Surface analysis using Gaussian beam profiles

• US 6,084,671 A
• Filed: 05/06/1998
• Issued: 07/04/2000
• Est. Priority Date: 05/06/1997
• Status: Expired due to Fees

• Current Assignee: Matthew J. Holcomb
• Original Assignee: Matthew J. Holcomb
• Inventors: Holcomb, Matthew J.
• Primary Examiner(s): Font, Frank G.
• Assistant Examiner(s): Punnoose, Roy M.
• Application Number:
  US09/073,496
• Time in Patent Office: 790 Days
• Field of Search: 356/335, 356/336, 356/354
• US Class Current: 356/511
• CPC Class Codes: G01B 11/303 using photoelectric detection means
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/95623 using a spatial filtering method per se G02B

Abstract

A method and apparatus for measuring the physical characteristics of reflective or transparent surfaces may be used to detect particulates, measure surface roughness, and reconstruct surface images and detect defects in regular patterns on both smooth and rough surfaces. The method is based on, and takes advantage of, the fact that high frequency spatial Fourier components are formed when a Gaussian profile beam interacts with an irregular, or otherwise inhomogeneous, surface. Through the measurement of these non-Gaussian components of the reflected beam, information about the sample surface may be obtained. An apparatus based on this principle comprises a light source [12] for producing a beam of light [10] directed along an optical path; a spatial filter [34], positioned along the optical path downstream from the light source, for giving the beam of light a Gaussian intensity profile [18]; positioning means [22] for positioning the material [20] in the optical path downstream from the spatial filter [34]; an inverse spatial filter [40], positioned along the optical path downstream from the material, for removing from the beam a Gaussian intensity profile; and a detector [46], positioned along the optical path downstream from the inverse spatial filter, for detecting the beam.

Claims

1. An apparatus for detecting surface properties of a material, the apparatus comprising:

a) a light source for producing a beam of light directed along an optical path;

b) a first spatial filter, positioned along the optical path downstream from the light source, for giving the beam of light a Gaussian intensity profile;

c) positioning means for positioning the material in the optical path downstream from the first spatial filter;

d) a second spatial filter, positioned along the optical path downstream from the material, for removing from the beam a Gaussian intensity profile, wherein the second sipatial filter is a spatial inverse of the first spatial filter; and

e) a detector, positioned along the optical path downstream from the second spatial filter, for detecting the beam.

2. The apparatus of claim 1 wherein the first spatial filter comprises a first Fourier lens assembly and a circular aperture positioned in the focal plane of the first Fourier lens assembly.

3. The apparatus of claim 1 wherein the second spatial filter comprises a second Fourier lens assembly and an opaque circular disk positioned in the focal plane of the second Fourier lens assembly.

4. A method for detecting surface properties of a material, the method comprising the steps of:

a) producing a beam of light;

b) spatial filtering the beam of light to produce spatially filtered beam having a Gaussian intensity profile;

c) causing the spatially filtered beam to interact with the material to produce a distorted beam;

d) inverse spatial filtering the distorted beam to produce an inverse spatially filtered beam having a Gaussian intensity profile removed, wherein the inverse spatial filtering is a spatial inverse of the spatial filtering; and

e) detecting the inverse spatially filtered beam.

5. The method of claim 4 wherein the spatial filtering comprises passing the beam of light through a circular aperture positioned in the focal plane of a first Fourier lens assembly.

6. The method of claim 4 wherein the inverse spatial filtering comprises passing the distorted beam through an opaque circular disk positioned in the focal plane of a second Fourier lens assembly.

7. The method of claim 4 wherein causing the spatially filtered beam to interact with the material comprises reflecting the spatially filtered beam from a surface of the material.

8. The method of claim 4 wherein causing the spatially filtered beam to interact with the material comprises transmitting the spatially filtered beam through the material.