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Integrated electro-optical package

  • US 6,084,697 A
  • Filed: 07/20/1998
  • Issued: 07/04/2000
  • Est. Priority Date: 07/20/1998
  • Status: Expired due to Fees
First Claim
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1. An electro-optical package comprising:

  • a housing;

    a first microscanner positioned within the housing, the first microscanner including a semiconductor wafer having integrally formed therein a cantilevered portion characterized as vertically deflecting about an "x" axis normal to a lower portion of the semiconductor wafer, the first microscanner including and at least one laser diode mounted to a surface of the cantilevered portion of the semiconductor wafer;

    at least one additional microscanner including a semiconductor wafer having integrally formed therein a cantilevered portion characterized as vertically deflecting about a "y" axis normal to a lower portion of the semiconductor wafer, the at least one additional microscanner including at least one laser diode mounted to a surface of the cantilevered portion of the semiconductor wafer;

    a photodetector positioned within the housing; and

    a plurality of electrical interconnects electrically interfacing the first microscanner, the at least one additional microscanner, and the photodetector.

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