Integrated electro-optical package

• US 6,084,697 A
• Filed: 07/20/1998
• Issued: 07/04/2000
• Est. Priority Date: 07/20/1998
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Ramdani, Jamal, Lebby, Michael S., Jachimowicz, Karen E.
• Primary Examiner(s): Epps, Georgia
• Assistant Examiner(s): Lucas, Michael A
• Application Number:
  US09/118,804
• Time in Patent Office: 715 Days
• Field of Search: 372/14, 372/24, 372/31, 372/32, 345/82, 345/83, 345/44, 345/45, 345/46, 359/201, 359/202, 359/197, 359/198, 359/298
• US Class Current: 359/202.1
• CPC Class Codes: G02B 26/02 for controlling the intensity of light G02B26/004 takes precedence
• CPC Class Codes: G02B 26/08 for controlling the direction of light in light guides G02B6/35
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01S 5/02216 Butterfly-type, i.e. with electrode pins extending horizontally from the housings
• CPC Class Codes: H01S 5/023 Mount members, e.g. sub-mount members
• CPC Class Codes: H01S 5/02326 Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
• CPC Class Codes: H01S 5/0233 Mounting configuration of laser chips
• CPC Class Codes: H01S 5/0235 Method for mounting laser chips
• CPC Class Codes: H01S 5/4025 Array arrangements, e.g. constituted by discrete laser diodes or laser bar H01S5/42 takes precedence

Abstract

An integrated electro-optical package including a laser diode microscanner, and an automatic focus mechanism housed within a housing. The microscanner includes a semiconductor wafer, having formed as a part thereof a cantilevered portion having mounted thereon at least one laser diode. The cantilevered portion having electrically interfaced thereto a plurality of interconnects capable of delivering varying voltages. The cantilevered portion is deflected in response to the varying voltages and therefore produces a scanning action in an "x" and/or "y" direction dependent upon the external varying voltage applied thereto and the design of the cantilevered portion. The automatic focus mechanism includes a single detector or a detector array that measures a reflected light and submits a signal to the display system optics for focus adjustment dependent upon the measurements received.

Claims

1. An electro-optical package comprising:

a housing;

a first microscanner positioned within the housing, the first microscanner including a semiconductor wafer having integrally formed therein a cantilevered portion characterized as vertically deflecting about an "x" axis normal to a lower portion of the semiconductor wafer, the first microscanner including and at least one laser diode mounted to a surface of the cantilevered portion of the semiconductor wafer;

at least one additional microscanner including a semiconductor wafer having integrally formed therein a cantilevered portion characterized as vertically deflecting about a "y" axis normal to a lower portion of the semiconductor wafer, the at least one additional microscanner including at least one laser diode mounted to a surface of the cantilevered portion of the semiconductor wafer;

a photodetector positioned within the housing; and

a plurality of electrical interconnects electrically interfacing the first microscanner, the at least one additional microscanner, and the photodetector.

2. An electro-optical package as claimed in claim 1 wherein the housing includes a transparent top portion, a plurality of sidewalls, and a lower portion having mounted thereto the first microscanner, the at least one additional microscanner and the photodetector.

3. An electro-optical package as claimed in claim 2 wherein the first microscanner and the at least one additional microscanner further each include at least one driver/control circuit connected to the at least one laser diode for delivering a voltage in response to data input and a driver/control circuit connected to the semiconductor wafer for delivering a plurality of varying voltages to the semiconductor wafer, thereby deflecting the cantilevered portion in response thereto and generating a resultant integrated image viewable by an observer.

4. An electro-optical package as claimed in claim 3 wherein the at least one microscanner includes a read laser diode, a green laser diode, and a blue laser diode for generating a full color resultant integrated image.

5. An electro-optical package comprising:

a housing, including a lower portion, a plurality of sidewalls and a transparent top portion;

a first microscanner and at least one additional microscanner, the first microscanner and the at least one additional microscanner each including a semiconductor wafer having integrally formed therein a cantilevered portion characterized as vertically deflecting normal to a lower portion, at least one laser diode, mounted to a surface of the cantilevered portion of the semiconductor wafer and positioned within the housing for receiving video data input signals;

a photodetector positioned within the housing;

electronics for electrically interfacing the first microscanner and the at least one additional microscanner and the photodetector; and

a plurality of copper leads extending from the electronics for electrically interfacing the electro-optical package with an optical display system.

6. An electro-optical package as claimed in claim 5 wherein the at least one laser diode includes a red laser diode, a green laser diode and a blue laser diode, thereby generating a resultant full color integrated image viewable by an observer.

7. An electro-optical package as claimed in claim 5 wherein the first microscanner and the at least one additional microscanner each further include at least one driver/control circuit connected to the at least one laser diode for delivering a voltage in response to data input and a driver/control circuit connected to the semiconductor wafer for delivering a plurality of varying voltages to the semiconductor wafer, thereby deflecting the cantilevered portion in response thereto and generating a resultant integrated image viewable by an observer.

8. An electro-optical package as claimed in claim 5 wherein the housing is formed of a plastic material utilizing transfer injection technology.

9. An electro-optical package comprising:

a housing, including a lower portion, a plurality of sidewalls and an upper transparent portion;

a first microscanner and at least one additional microscanner positioned within the housing for receiving video data input signals, the first microscanner and the at least one additional microscanner each including a semiconductor wafer having integrally formed therein a cantilevered portion characterized as vertically deflecting normal to a lower portion and including a plurality of laser diodes emitting light, mounted to a surface of the cantilevered portion of the semiconductor wafer, for generating a full color integrated image;

a p-i-n photodetector, positioned within the housing to receive a reflected portion of light emitted by the plurality of laser diodes;

electronics for electrically interfacing the first microscanner and the at least one additional microscanner and the photodetector; and

a plurality of copper leads extending from the electronics for electrically interfacing the electro-optical package with an optical display system.

10. An electro-optical package as claimed in claim 9 wherein the plurality of laser diodes include a red laser diode emitting light in a range of 635-680 nm, a green laser diode emitting light in a range of 540-560 nm, and a blue laser diode emitting light in a range of 410-460 nm.

11. An electro-optical package as claimed in claim 9 wherein the electronics include a central processing unit for receiving video data signals and a digital signal processor for processing the received signals into output signals for scanning.

12. An electro-optical package as claimed in claim 9 further including a focus controller for receiving and processing signals from the photodetector.

13. An electro-optical package as claimed in claim 9 wherein the full color integrated image is viewed as a projection image.

14. An electro-optical package as claimed in claim 9 wherein the full color integrated image is viewed as a virtual image.