Electronics enclosure for power electronics with passive thermal management

• US 6,084,772 A
• Filed: 09/03/1998
• Issued: 07/04/2000
• Est. Priority Date: 09/03/1998
• Status: Expired due to Term

• Current Assignee: Microsoft Technology Licensing LLC (Microsoft Corporation)
• Original Assignee: Nortel Networks Corporation
• Inventors: Zapach, Trevor G., Pell, David J., Sahraoui, Melik
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US09/146,233
• Time in Patent Office: 670 Days
• Field of Search: 361/690-699, 361/700-709, 257/706-727, 165/80.2, 165/80.3, 165/80.4, 165/104.21, 165/104.32, 165/104.33, 165/104.14, 165/104.26, 165/46, 165/185, 174/15.2, 174/52.4, 174/16.3, 174/252
• US Class Current: 361/699
• CPC Class Codes: H05K 7/20681 within cabinets for removing heat from sub-racks

Abstract

An electronics enclosure is provided with passive thermal management for a high power electronic units, for example a power amplifier for wireless telecommunications, the enclosure being suitable for mast head mounted units, or remotely located units exposed to a wide range of weather conditions. The use of heat pipes in place of a conventional heat sink provides for natural convection cooling and eliminates the need for fans. Appropriate selection of materials, using copper and aluminum respectively, for the construction of heat pipe and cooling fin assemblies provides a significant reduction in weight and volume is achieved relative to know units having conventional heatsinks and forced air convection cooling. Since the heat pipe efficiency decreases at low temperature, the power amplifier self heats the unit in cold weather and eliminates the need for heaters. This further reduces the power consumption and the size of the unit.

Claims

1. An electronics enclosure for a power electronic unit with passive thermal management comprising:

a modular electronic unit comprising circuit modules mounted on a substantially planar thermally conductive substrate, the circuit modules being arranged vertically above one another, and each circuit module having an associated thermal control module in thermal contact with the circuit module,

a plurality of the circuit modules being higher power modules comprising power components, and the thermal control module associated with each of the higher power modules comprising a heat pipe assembly;

the thermal control module associated with each other circuit module comprising a conventional heatsink; and

,

the heatpipe assemblies of the thermal control modules being arranged one above the other with cooling fins of the heatpipe assemblies arranged vertically, to provide for air flow vertically by natural convection through fins of the heatpipe assemblies and over the conventional heatsink.

2. An enclosure according to claim 1 wherein the thermal dissipation of each thermal control module is matched to the thermal dissipation of the associated circuit module.

3. An enclosure according to claim 1 wherein the plurality of circuit modules comprising power electronic components, and the associated thermal control modules comprise heat pipe assemblies arranged to selectively transport and dissipate heat from regions of the circuit module carrying the power electronic components.

4. An enclosure according to claim 1 wherein the heatpipes comprise copper pipes containing a working fluid which freezes in the condenser pipes at a specified temperature.

5. An enclosure according to claim 4 heatpipes wherein the working fluid is water so that freezing of the working fluid occurs at 0°

C.

6. An enclosure according to claim 1 wherein cooling fins of one module are laterally offset relative to fins of an adjacent module.

7. An enclosure according to claim 1 capable of thermal dissipation up to 11000 watts per m³ by natural convection.

8. An enclosure according to claim 1 comprising a modular assembly of circuit modules and associated thermal control modules.

9. An enclosure according to claim 1 wherein each heatpipe assembly comprises copper heatpipes and aluminum fins.

10. An enclosure according to claim 9 wherein the copper heatpipes and aluminum fins have a tin coating.

11. An enclosure according to claim 10 wherein the heatpipe assembly has a powder coating overlying the tin coating.

12. An electronics enclosure according to claim 1 wherein a thermal control module associated with a circuit module comprising a conventional heatsink is positioned below the thermal control modules associated with the higher power modules, so as to direct air flow vertically through fins of the heatpipe assemblies, over the conventional heatsink by natural convection.