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Composition and method for reducing copper oxide to metallic copper

  • US 6,086,956 A
  • Filed: 01/19/1999
  • Issued: 07/11/2000
  • Est. Priority Date: 12/19/1995
  • Status: Expired due to Fees
First Claim
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1. In a method of bonding copper and a resin together wherein a copper oxide layer is reduced and the reduced copper oxide layer is bonded to a resin, the improvement comprising reducing the copper oxide layer with an aqueous reducing agent solution containing a cyclic borane compound under conditions which produce a weight loss greater than 15%.

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