Polymer marker

• US 6,087,192 A
• Filed: 09/02/1999
• Issued: 07/11/2000
• Est. Priority Date: 09/03/1998
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Roderos, Rodel M., Cowens, Marvin W.
• Primary Examiner(s): Monin, Jr., Donald L.
• Assistant Examiner(s): Peralta, Ginette
• Application Number:
  US09/388,728
• Time in Patent Office: 313 Days
• Field of Search: 438/14, 438/15, 438/16, 438/18, 438/111, 438/123, 156/626.1, 33/34, 53/65, 116/211, 257/47
• US Class Current: 438/14
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED

Abstract

An embodiment of the instant invention is a method of making a semiconductor device situated within a package with conductive leads extending from the package, the method comprising the steps of: testing a plurality of the semiconductor devices so as to determine defective devices; and marking the defective devices with a polymer marker able to withstand temperatures in excess of 200 C., acids with a pH of less than 2, and basic solutions with a pH of greater than 11. Preferably, the polymer marker is comprised of a surfactant, a solvent, a polymer backbone, and a dye, and may additionally include an adhesion promoter. The surfactant is, preferably, comprised of: SVC-15, isopropanol, and any combination thereof. The solvent is, preferably, comprised of a substance consisting of: ENSOLV, bromopropane, chloropropane, and C_n H_2n+1 X (where X is a halogen and n is between 3 and 5), and any combination thereof. Preferably, the polymer backbone is comprised of: PMMA and an acrylate with a molecular weight between 30 and 100,000 AMU/gram.

Claims

1. A method of making a semiconductor device situated within a package with conductive leads extending from the package, said method comprising the steps of:

testing a plurality of said semiconductor devices so as to determine defective devices; and

marking said defective devices with a polymer marker able to withstand temperatures in excess of 200 C., acids with a pH of less than 2, and basic solutions with a pH of greater than 11.

2. The method of claim 1, wherein said polymer marker is comprised of a surfactant, a solvent, a polymer backbone, and a dye.

3. The method of claim 2, wherein said polymer marker additionally comprises an adhesion promoter.

4. The method of claim 2, wherein said surfactant is comprised of a substance selected from the group consisting of:

SVC-15, isopropanol, and any combination thereof.

5. The method of claim 2, wherein said solvent is comprised of a substance consisting of:

ENSOLV, bromopropane, chloropropane, or C_n H_2n+1 X (where X is a halogen and n is between 3 and

     5), and any combination thereof.

6. The method of claim 2, wherein said polymer backbone is comprised of a substance selected from the group consisting of:

PMMA and an acrylate with a molecular weight between 30 and 100,000 AMU/gram.

7. The method of claim 1, wherein said step of marking said defective devices is marking said package with said polymer marker.

8. The method of claim 7, wherein said dye is comprised of TiO₂.

9. The method of claim 7, wherein said dye is comprised of zinc oxide.

10. The method of claim 1, wherein said step of marking said defective devices is marking said conductive leads with said polymer marker.

11. The method of claim 10, wherein said conductive lead is comprised of Pd.

12. The method of claim 11, wherein said dye is comprised of a copper phthalocyanine derivative.

13. The method of claim 10, wherein said conductive lead is comprised of Cu.

14. The method of claim 13, wherein said dye is comprised of cobalt aluminate blue spinel.