Method for adhering and sealing a silicon chip in an integrated circuit package
First Claim
1. A method for protecting a semiconductor chip attached to a substrate comprising the steps of:
- attaching an adhesive layer to the substrate;
positioning the chip in contact with said adhesive layer;
placing the chip on a mounting stage while in contact with said adhesive layer;
applying heat and force to the chip while the chip is in contact with the adhesive layer sufficient to cause said adhesive layer to flow into areas between said chip and said substrate and around the perimeter of the chip; and
adhering the chip to the substrate and providing a seal around the perimeter of the chip to protect the chip by removal of said heat and force.
1 Assignment
0 Petitions
Accused Products
Abstract
A method and apparatus for producing an integrated circuit package (30) comprising a substrate (70) having an opening (86) and first and second surfaces (92, 94), a plurality of routing strips (82) being integral with the substrate (70) and extending into the opening (86), a plurality of pads (100) disposed on the first and second surfaces (92, 94) are electrically connected with at least one of the routing strips (82), wire bonding (80) electrically connecting at least one bonding pad (120) to at least one of the routing strips (82) and a silicon chip (50) attached to the printed circuit board (70) by an adhesive material (60) that provide a seal between silicon chip (50) and printed circuit board (70) is disclosed.
58 Citations
8 Claims
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1. A method for protecting a semiconductor chip attached to a substrate comprising the steps of:
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attaching an adhesive layer to the substrate; positioning the chip in contact with said adhesive layer; placing the chip on a mounting stage while in contact with said adhesive layer; applying heat and force to the chip while the chip is in contact with the adhesive layer sufficient to cause said adhesive layer to flow into areas between said chip and said substrate and around the perimeter of the chip; and adhering the chip to the substrate and providing a seal around the perimeter of the chip to protect the chip by removal of said heat and force. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification