Bond pad for a flip-chip package
First Claim
1. In an integrated circuit having a bond pad located thereon, a bond pad support structure, comprising:
- a first bond pad support layer at least partly located below the bond pad, the first bond pad support layer comprising a plurality of radial patterns with at least one space therebetween; and
a second bond pad support layer located on the first bond pad support layer and filling at least a portion of the space.
9 Assignments
0 Petitions
Accused Products
Abstract
A bond pad support structure is located beneath a bond pad on an integrated circuit. The bond pad support structure includes a first bond pad support layer at least partly located below the bond pad. The first bond pad support layer has a plurality of radial patterns with at least one space between the radial patterns. The radial patterns may be, for example, straight lines having approximately uniform thickness. Alternatively, the radial patterns may be triangles, each of which has an apex pointing to the center of a region below the bond pad. The radial patterns may have a plurality of different lengths. A second bond pad support layer is located on the first bond pad support layer. The second bond pad support layer fills at least a portion of the space between the radial patterns.
30 Citations
14 Claims
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1. In an integrated circuit having a bond pad located thereon, a bond pad support structure, comprising:
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a first bond pad support layer at least partly located below the bond pad, the first bond pad support layer comprising a plurality of radial patterns with at least one space therebetween; and a second bond pad support layer located on the first bond pad support layer and filling at least a portion of the space. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An integrated circuit, system comprising:
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a substrate having a circuit pattern on a surface thereof; a bond pad support structure formed over the substrate, comprising; a first bond pad support layer comprising a plurality of radial patterns with at least one space therebetween, and a second bond pad support layer located on the first bond pad support layer and filling at least a portion of the space; and a bond pad lying above at least a portion of the bond pad support structure. - View Dependent Claims (13, 14)
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Specification