Procedure for producing a chip mounting board and chip-mounting board thus produced

• US 6,088,230 A
• Filed: 09/20/1996
• Issued: 07/11/2000
• Est. Priority Date: 03/28/1994
• Status: Expired due to Term

• Current Assignee: Smartrac IP BV (OEP Technologie BV)
• Original Assignee: David Finn, Manfred Rietzler
• Inventors: Rietzler, Manfred, Finn, David
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): FOSTER, DAVID A
• Application Number:
  US08/716,285
• Time in Patent Office: 1,390 Days
• Field of Search: 361/737, 361/748, 361/765, 361/772, 361/774, 361/777, 361/783, 361/760, 361/764, 361/820, 361/821, 361/807, 257/690, 257/691, 257/723, 257/724, 257/773, 257/782, 257/783, 257/784, 257/787, 257/735, 257/737, 174/52.4
• US Class Current: 361/737
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07781 the coil being fabricated in a winding process
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01F 41/10 Connecting leads to windings making electric connections in general H01R43/00
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45565 Single coating layer
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/85203 Thermocompression bonding
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/85207 Thermosonic bonding
• CPC Class Codes: H01L 2224/85214 using a laser
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base

Abstract

Procedure for producing a transponder unit (55) provided with at least one chip (16) and one coil (18), and in particular a chip card/chip-mounting board (17) wherein the chip and the coil are mounted on one common substrate (15) and the coil is formed by installing a coil wire (21) and connecting the coil-wire ends (19, 23) to the contact surfaces (20, 24) of the chip on the substrate.

Claims

1. Procedure for producing a transponder unit (55) having at least one chip (16, 36) and one coil (18, 35), and in particular a chip-mounting board (17), wherein the chip and the coil are mounted on one common substrate (15) and the coil is formed by installing a coil wire (21) and connecting the coil-wire ends (19, 23) to the contact surfaces (20, 24) of the chip on the substrate.

2. Procedure as in claim 1, characterized in that,

as a first step prior to the installation of the coil wire (21), one coil-wire end (19) is connected to a first contact surface (20) of the chip (16, 36), the coil wire (21) is then installed to form the coil (18, 35), whereupon the leading end (23) of the coil wire is connected to a second contact surface (24) of the chip, while in the process of the coil-wire installation the coil wire (21) is bonded to the substrate (15) at least in some locations.

3. Procedure as in claim 1, characterized in that,

in the course of the application of the chip (16, 36) on the substrate (15), the chip is bonded to the substrate.

4. A process for the manufacture of a transponder unit (55) including at least one chip (16, 36) and one coil (18, 35), in particular, a chip card (17) in which the chip and the one coil are placed on a common substrate (15), comprising the step of

(a) forming the coil by laying a coil wire (21) having wire ends (19, 23) and connecting the coil wire ends to contact surfaces (20, 24) of the chip on the substrate.

6. The process in accordance with claim 4, further comprising the step of connecting the chip (16, 36) to the substrate (15).

5. A process for the manufacture of a transponder unit (55) including at least one chip (16, 36) and one coil (18, 35) comprising a coil wire (21) having wire ends (19, 23), in particular, a chip card (17), in which the chip and the one coil are placed on a common substrate (15), comprising the following steps in the sequence set force:

(a) connecting the first wire end (19) with a first contact surface (20) of the chip (16,36);

(b) forming the one coil (18,35) by laying the coil wire (21);

(c) connecting the second (23) coil wire end with a second contact surface (24) of the chip (16,36), and connecting the coil wire (21) with at least one place on the substrate (15).

7. A chip card comprising

a transponder unit (55) including a substrate (15);

at least one chip (16,

     36) and at least one coil (18,

     35) associated to the at least one chip, the at least one coil is formed of at least one wire winding having wire ends (19,

     23);

the at least one chip (16,

     36) includes contact surfaces (20,

     24);

the wire ends (19,

     23) being connected to the contact surfaces (20,

     24);

the coil is positioned on the substrate and is bonded to the substrate in at least one place.

8. The chip card in accordance with claim 7, wherein the wire winding is positioned on the substrate in a zig-zag manner.

9. The chip card in accordance with claim 7, wherein the transponder unit further comprises at least one electronic component (37, 38), having associated with it contact surfaces and a component coil formed of wire windings having wire ends;

the at least one electronic unit being placed on the substrate (15) along with the at least one chip (16,

     36).

10. The chip card in accordance with claim 9, wherein one of the at least one electronic components is a membrane push-button (38).

11. The chip card in accordance with claim 9, wherein one of the at least one electronic components is a membrane key pad.

12. The chip card in accordance with claim 9, further comprising a top layer (53) connected to the substrate which top layer at least partially covers the substrate.