Procedure for producing a chip mounting board and chip-mounting board thus produced
DCFirst Claim
1. Procedure for producing a transponder unit (55) having at least one chip (16, 36) and one coil (18, 35), and in particular a chip-mounting board (17), wherein the chip and the coil are mounted on one common substrate (15) and the coil is formed by installing a coil wire (21) and connecting the coil-wire ends (19, 23) to the contact surfaces (20, 24) of the chip on the substrate.
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Accused Products
Abstract
Procedure for producing a transponder unit (55) provided with at least one chip (16) and one coil (18), and in particular a chip card/chip-mounting board (17) wherein the chip and the coil are mounted on one common substrate (15) and the coil is formed by installing a coil wire (21) and connecting the coil-wire ends (19, 23) to the contact surfaces (20, 24) of the chip on the substrate.
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Citations
12 Claims
- 1. Procedure for producing a transponder unit (55) having at least one chip (16, 36) and one coil (18, 35), and in particular a chip-mounting board (17), wherein the chip and the coil are mounted on one common substrate (15) and the coil is formed by installing a coil wire (21) and connecting the coil-wire ends (19, 23) to the contact surfaces (20, 24) of the chip on the substrate.
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4. A process for the manufacture of a transponder unit (55) including at least one chip (16, 36) and one coil (18, 35), in particular, a chip card (17) in which the chip and the one coil are placed on a common substrate (15), comprising the step of
(a) forming the coil by laying a coil wire (21) having wire ends (19, 23) and connecting the coil wire ends to contact surfaces (20, 24) of the chip on the substrate.
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5. A process for the manufacture of a transponder unit (55) including at least one chip (16, 36) and one coil (18, 35) comprising a coil wire (21) having wire ends (19, 23), in particular, a chip card (17), in which the chip and the one coil are placed on a common substrate (15), comprising the following steps in the sequence set force:
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(a) connecting the first wire end (19) with a first contact surface (20) of the chip (16,36); (b) forming the one coil (18,35) by laying the coil wire (21); (c) connecting the second (23) coil wire end with a second contact surface (24) of the chip (16,36), and connecting the coil wire (21) with at least one place on the substrate (15).
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7. A chip card comprising
a transponder unit (55) including a substrate (15); -
at least one chip (16,
36) and at least one coil (18,
35) associated to the at least one chip, the at least one coil is formed of at least one wire winding having wire ends (19,
23);the at least one chip (16,
36) includes contact surfaces (20,
24);the wire ends (19,
23) being connected to the contact surfaces (20,
24);the coil is positioned on the substrate and is bonded to the substrate in at least one place. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification