RF and EMI shield

• US 6,088,231 A
• Filed: 03/03/1999
• Issued: 07/11/2000
• Est. Priority Date: 03/03/1999
• Status: Expired due to Term

• Current Assignee: Methode Electronics Incorporated
• Original Assignee: Methode Electronics Incorporated
• Inventors: Fajardo, Iggoni
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Gandhi, Jayprakash N.
• Application Number:
  US09/261,618
• Time in Patent Office: 496 Days
• Field of Search: 361/752, 361/737, 361/799, 361/816, 361/818, 174/35 R, 174/51, 439/607-610, 257/660, 211/41.17, 206/719
• US Class Current: 361/737
• CPC Class Codes: H05K 9/0039 Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218

Abstract

A shield for a PCB package for shielding electromagnetic radiation from exiting or entering the package. Typically, the package includes first and second electrically conductive covers and first and second frames. A printed circuit board fits within the shield, and the shield fits within the first and second covers and frames. The shield has side walls which surround a perimeter of the printed circuit board so as to prevent electromagnetic radiation from entering and exiting through the first and second frames of the package. The shield also has ground springs which electrically connect the shield with the first and second covers so as to insulate the printed circuit board from electromagnetic radiation radiating to and from directions perpendicular to planes of the first and second covers. The shield also includes side springs which attached to the side walls and press against a side edge of one of the first and second frames so as to secure the shield within the package. Optionally, the shield can include ground clips attached to the side walls which contact the printed circuit board so as to electrically connect the printed circuit board to the shield. A further option is to provide a removed portion in one of the side walls so as to enable a connector of an input/output device to pass through the side wall of the shield.

Claims

1. A shield for insertion into a package that houses a printed circuit board, wherein the printed circuit board has a perimeter, the shield comprising:

side walls dimensioned so as to substantially surround the perimeter of the printed circuit board; and

at least one side spring attached to at least one of the side walls, and wherein

the shield is made of an electrically conductive material, and wherein

the shield is substantially surrounded by the package.

2. The shield of claim 1, further comprising a ground clip attached to at least one of the side walls for electrically contacting the printed circuit board.

3. The shield of claim 2 wherein the package is a compact flash package.

4. The shield of claim 2 wherein the package is a PCMCIA card.

5. The shield of claim 2 wherein the package is a small PCMCIA card.

6. The shield of claim 2 wherein the package is a miniature card.

7. The shield of claim 2 wherein the package is a JEIDA package.

8. The shield of claim 2 wherein the package is a compact flash plus package.

9. The shield of claim 1, further comprising at least one ground spring attached to at least one of the side walls.

10. The shield of claim 1 wherein at least one of the side walls has a removed portion.

11. The shield of claim 10 wherein the removed portion is dimensioned so as to accommodate therethrough a connector of an input/output device.

12. The shield of claim 1, further comprising an aperture, and wherein the electrically conductive material is substantially rigid.

17. The shield of claim 12 wherein at least one of the side walls has a removed portion.

18. The shield of claim 17, further comprising a ground clip attached to at least one of the side walls for electrically contacting the printed circuit board.

19. The shield of claim 17 wherein the removed portion is dimensioned so as to accommodate therethrough a connector of an input/output device.

13. A shield for insertion into a package that houses a printed circuit board, wherein the package includes a first cover attached to a first frame and a second cover attached to a second frame, in an assembled position the package includes the first frame contacting the second frame, the shield surrounding a portion of the printed circuit board, and first cover and the second cover substantially surrounding other portions of the printed circuit board not surrounded by the shield, wherein the first cover and the second cover are separated by the first frame and the second frame, the shield comprising:

side walls of the shield having a height, the height being substantially the same as the distance between an inner surface of the first cover and an inner surface of the second cover when the package is in the assembled position, the side walls surround a perimeter of the printed circuit board; and

at least one side spring attached to at least one of the side walls for contacting one of an inner side edge of the frame and an inner side edge of the second frame when the package is in the assembled position, and wherein

the shield is made of an electrically conductive material, and wherein

the shield is substantially surrounded by the package.

14. The shield of claim 13, further comprising a ground clip attached to at least one of the side walls for electrically contacting the printed circuit board.

15. The shield of claim 13, further comprising at least one ground spring attached to at least one of the side walls for contacting at least one of the inner surface of the first cover and the inner surface of the second cover when the package is in the assembled position.

16. The shield of claim 15, further comprising a ground clip attached to at least one of the side walls for electrically contacting the printed circuit board.

20. The shield of claim 13, further comprising an aperture.

21. The shield of claim 20, further comprising a ground clip attached to at least one of the side walls for electrically contacting the printed circuit board.

22. The shield of claim 13 wherein the first cover is made of an electrically conductive material and the second cover is made of an electrically conductive material.

23. The shield of claim 22, further comprising a ground clip attached to at least one of the side walls for electrically contacting the printed circuit board.

24. The shield of claim 22, further comprising at least one ground spring attached to at least one of the side walls for contacting at least one of the inner surface of the first cover and the inner surface of the second cover when the package is in the assembled position.

25. The shield of claim 22 wherein one of the side walls has a removed portion.

26. The shield of claim 25 wherein the removed portion is dimensioned so as to accommodate therethrough a connector of an input/output device.

27. The shield of claim 25, further comprising a ground clip attached to at least one of the side walls for electrically contacting the printed circuit board.

28. The shield of claim 27 wherein the package is a compact flash package.

29. The shield of claim 27 wherein the package is a PCMCIA card.

30. The shield of claim 27 wherein the package is a small PCMCIA card.

31. The shield of claim 27 wherein the package is a miniature card.

32. The shield of claim 27 wherein the package is a JEIDA package.

33. The shield of claim 27 wherein the package is a compact flash plus package.

34. A peripheral device comprising:

a package;

a printed circuit board having a perimeter, the printed circuit board substantially positioned within the package;

a shield substantially positioned within the package, the shield having side walls dimensioned so as to substantially surround the perimeter of the printed circuit board, wherein at least one of the side walls has at least one side spring attached thereto, and wherein the shield is made of an electrically conductive material.