Method for producing a carrier element for semiconductor chips

• US 6,088,901 A
• Filed: 12/14/1998
• Issued: 07/18/2000
• Est. Priority Date: 06/10/1997
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Fischer, Jurgen, Graf, Helmut, Huber, Michael, Stampka, Peter, Houdeau, Detlef, Heitzer, Josef
• Primary Examiner(s): Bryant, David P.
• Assistant Examiner(s): Cozart, Jermie E.
• Application Number:
  US09/211,107
• Time in Patent Office: 582 Days
• Field of Search: 29/469.5, 361/728, 361/736, 361/737, 361/749, 257/679, 156/252, 156/219, 156/242, 156/293, 428/901
• US Class Current: 29/469.5
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 156/1039 Surface deformation only of sandwich or lamina [e.g., embossed panels]
• CPC Class Codes: Y10T 156/1056 Perforating lamina
• CPC Class Codes: Y10T 29/49906 Metal deforming with nonmetallic bonding

Abstract

A carrier element for a semiconductor chip, in particular to be built into smart cards. The carrier element has a substrate that carries the chip and a stiffening sheet which also carries the chip and has a recess for receiving the chip and its connection leads therein. An edge of the recess is provided with a frame formed integrally from the sheet.

Claims

1. A method for producing a carrier element for a semiconductor chip, which comprises:

forming a trough in a stiffening sheet by deep-drawing;

stamping a bottom of the trough for defining a frame with a recess formed therein for receiving a chip and associated connection leads; and

laminating the stiffening sheet onto a chip receiving side of a flexible substrate.

2. The method according to claim 1, which comprises:

forming the flexible substrate as a non-conducting sheet; and

laminating a conductive sheet structured into contact faces on the flexible substrate on a side opposite from the chip receiving side.

3. The method according to claim 1, which comprises forming the flexible substrate as a foil.

4. The method according to claim 1, which comprises forming the stiffening sheet from metal.

5. The method according to claim 1, which comprises forming the stiffening sheet from plastic.

6. The method according to claim 1, which comprises:

forming the flexible substrate as a non-conducting sheet; and

laminating a conductive sheet, structured into side contact faces, onto the flexible substrate on a side opposite from the stiffening sheet.

7. The method according to claim 1, which comprises forming stress-relief holes in the stiffening sheet outside a carrier-element region.

8. A method for producing a carrier element for a semiconductor chip, which comprises:

forming a trough in a stiffening sheet by deep-drawing;

stamping a part of a bottom of the trough for defining a frame having an end with an integral web extending from the end, substantially perpendicular to the frame and a recess formed therein for receiving a chip and associated connection leads; and

laminating the stiffening sheet onto a chip receiving side of a flexible substrate.

9. A method for producing a carrier element for a semiconductor chip and to be built into a smart card, which comprises:

forming a trough in a stiffening sheet by deep-drawing;

stamping a bottom of the trough for defining a frame with a recess formed therein for receiving a chip and associated connection leads; and

laminating the stiffening sheet onto a chip receiving side of a flexible substrate.