Electrode connection method
First Claim
1. A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate and partially coated with a resist pattern so as to substantially expose an opening thereof at a surface of the second electrodes, said method comprising the steps of:
- (a) coating the second electrodes with a solder at the opening of the resist pattern,(b) aligning the first electrodes with the second electrodes, and(c) electrically connecting the first electrodes to the second electrodes through the solder by heat-pressing the first and second electrodes with a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the first and second electrodes at an entire region of the tip face of the heat-pressure bonding head.
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Accused Products
Abstract
A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate and partially coated with a resist pattern so as to substantially expose an opening thereof at a surface of the second electrodes includes (a) coating the second electrodes with a solder at the opening of the resist pattern, (b) aligning the first electrodes with the second electrodes, and (c) electrically connecting the first electrodes to the second electrodes through the solder by heat-pressing the first and second electrodes with a heat-pressure bonding head including a tip face having a width smaller than a width of the opening of the resist pattern so as to heat-press the first and second electrodes at an entire region of the tip face of the heat-pressure bonding head. The method is effective in performing a good electrical connection between electrodes through a solder irrespective of an amount of the solder.
58 Citations
38 Claims
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1. A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate and partially coated with a resist pattern so as to substantially expose an opening thereof at a surface of the second electrodes, said method comprising the steps of:
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(a) coating the second electrodes with a solder at the opening of the resist pattern, (b) aligning the first electrodes with the second electrodes, and (c) electrically connecting the first electrodes to the second electrodes through the solder by heat-pressing the first and second electrodes with a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the first and second electrodes at an entire region of the tip face of the heat-pressure bonding head. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 32, 33, 34, 35, 38)
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12. A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate, said method comprising the steps of:
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(a) aligning the first electrodes with the second electrodes, and (b) electrically connecting the first electrodes to the second electrodes by heat-pressing the first and second electrodes using a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the first and second electrodes at an entire region of the tin face of the heat-pressure bonding head, while supplying a cooling gas to at least one of the first and second substrates. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method for producing an optical modulation apparatus which includes:
- an optical modulation panel;
a tape carrier package structure comprising a flexible substrate, a semiconductor device for driving the panel mounted on the flexible substrate, and input electrodes and output electrodes for the semiconductor device; and
a circuit board provided with connection electrodes partially coated with resist pattern so as to leave an opening thereof and supplying power and supplying control signals to the semiconductor device;
said processing comprising the steps of;(a) electrically connecting electrode terminals of the optical modulation panel to the output electrodes of the tape carrier package structure, (b) coating the connection electrodes with a solder at the opening of the resist pattern, (c) aligning the input electrodes of the tape carrier package structure with the connection electrodes of the circuit board, and (d) electrically connecting the input electrodes to the connection electrodes through the solder by heat-pressing the input and connection electrodes with a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the input and connection electrodes at an entire region of the tip face of the heat-pressure bonding head. - View Dependent Claims (26, 27, 28, 36, 37)
- an optical modulation panel;
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29. A method for producing an optical modulation apparatus which includes:
- an optical modulation panel;
a tape carrier package structure comprising a flexible substrate a semiconductor device for driving the panel mounted on the flexible substrate, and input electrode and output electrodes for the semiconductor device; and
a circuit board provided with connection electrodes for supplying power and supplying control signals to the semiconductor device;
said process comprising the steps of;(a) electrically connecting electrode terminals of the optical modulation panel to the output electrodes of the tape carrier package structure, (b) aligning the input electrodes of the tape carrier package structure with the connection electrodes of the circuit board, and (c) electrically connecting the input electrodes to the connection electrodes by a heat-pressure bonding using a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the input and connection electrodes at an entire region of the tip face of the heat-pressure bonding head, while supplying a cooling gas toward the circuit board via the flexible substrate. - View Dependent Claims (30, 31)
- an optical modulation panel;
Specification