Surface treatment of semiconductor substrates
First Claim
1. A process for drying a substrate comprising the steps of:
- supporting the substrate within a foam treatment vessel causing the supported substrate to be submerged in a solution of carbon dioxide in deionized water under pressure within said foam treatment vessel;
thereafter gradually reducing the pressure within the foam treatment vessel, thereby causing carbon dioxide bubbles to form a foam layer on the surface of the solution; and
,while gradually reducing the pressure within the foam treatment vessel, causing the foam layer to move relative to the substrate so that the substrate Passes through the foam layer, in moving contact therewith, into a gaseous atmosphere.
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Accused Products
Abstract
Surface cleaning, chemical treatment and drying of semiconductor substrates is carried out using foam as a medium instead of a condensed phase liquid medium. In cleaning and chemical treatment, by introducing a foam into an overflow vessel the foam is caused to pass over the substrate in moving contact therewith. Drying of the substrate is carried out, using a water solution of carbon dioxide in a pressurizable vessel. By releasing the pressure in the vessel, a layer of foam is established on the surface of the solution. The solution is discharged from the vessel, causing the foam layer to pass over the substrate in moving contact therewith. The carbon dioxide reduces the surface tension of the water, thereby enabling the foam layer to be produced and also assisting in the elimination of water from the surface of the substrate. In both cases, the use of foam reduces materials requirements and also reduces the quantity of particles deposited onto the substrate in the treatment process.
91 Citations
12 Claims
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1. A process for drying a substrate comprising the steps of:
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supporting the substrate within a foam treatment vessel causing the supported substrate to be submerged in a solution of carbon dioxide in deionized water under pressure within said foam treatment vessel; thereafter gradually reducing the pressure within the foam treatment vessel, thereby causing carbon dioxide bubbles to form a foam layer on the surface of the solution; and
,while gradually reducing the pressure within the foam treatment vessel, causing the foam layer to move relative to the substrate so that the substrate Passes through the foam layer, in moving contact therewith, into a gaseous atmosphere. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification