Thermally conductive filled polymer composites for mounting electronic devices and method of application

• US 6,090,484 A
• Filed: 04/30/1997
• Issued: 07/18/2000
• Est. Priority Date: 05/19/1995
• Status: Expired due to Term

• Current Assignee: Henkel IP & Holding GmbH (Henkel AG & Co KGaA)
• Original Assignee: Berquist Company The (Henkel AG & Co KGaA)
• Inventors: Bergerson, Steven E.
• Primary Examiner(s): Nakarani, D. S.
• Application Number:
  US08/848,955
• Time in Patent Office: 1,175 Days
• Field of Search: 428/328, 428/329, 428/447, 428/451, 428/421, 428/422, 428/474.4, 428/480, 428/522, 428/523, 428/355 CN, 428/355 AC, 428/355 N, 428/355 EN, 428/910 , 428/517, 428/519, 428/520
• US Class Current: 428/355.0EN
• CPC Class Codes: C08L 2666/04 Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
• CPC Class Codes: C08L 2666/26 Natural polymers, natural resins or derivatives thereof according to C08L1/00 - C08L5/00, C08L89/00, C08L93/00, C08L97/00 or C08L99/00
• CPC Class Codes: C08L 45/02 of coumarone-indene polymers
• CPC Class Codes: C08L 9/02 Copolymers with acrylonitrile
• CPC Class Codes: C08L 93/00 Compositions of natural resins; Compositions of derivatives thereof of polysaccharides C08L1/00 - C08L5/00; of natural rubber C08L7/00
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: Y10T 428/2878 including addition polymer from unsaturated monomer
• CPC Class Codes: Y10T 428/2887 including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
• CPC Class Codes: Y10T 428/3154 Of fluorinated addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31544 Addition polymer is perhalogenated
• CPC Class Codes: Y10T 428/31667 Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
• CPC Class Codes: Y10T 428/31725 Of polyamide
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]
• CPC Class Codes: Y10T 428/31924 Including polyene monomers
• CPC Class Codes: Y10T 428/31928 Ester, halide or nitrile of addition polymer

Abstract

A thermally conductive conformable interface layer for use in mounting electronic devices such as transistors or the like onto the surface of a chassis or heat sink. The thermally conductive interface material forms a highly conductive thermal bridge or transfer medium between the external surfaces of the electronic device and the heat sink. The thermally conductive material comprises a multi-layer laminate, typically a polymeric thermally conductive layer along with a film of adhesive bonded thereto. The polymeric layer is preferably a silicone resin, such as polydimethylsiloxane blended with a thermoplastic adhesive such as linear saturated polyester. The polydimethylsiloxane may be filled with a thermally conductive material such as graphite with an adhesive layer being utilized to attach the polymeric layer onto the device and heat sink.

Claims

1. A laminate comprising a polymeric thermally conductive layer with one of the individual layers being an adhesive film bonded thereto and wherein the adhesive film consists of a blend of a nitrile rubber having a melting point between 60°

C. and 120°

C. and a tackifying resin selected from the group consisting of coumarone-indene polymer, rosin acid, and rosin ester.

2. The laminate as set forth in claim 1 wherein said laminate is mounted on a supporting substrate.

3. The laminate of claim 2 wherein the supporting substrate is a film selected from the group consisting of stress oriented polyethylene terephthalate, fluorinated ethylene-propylene resin, polytetrafluoroethylene, polyvinyldifluoride, polypropylene.