Process for manufacturing high-sensitivity capacitive and resonant integrated sensors, particularly accelerometers and gyroscopes, and sensors made therefrom
First Claim
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1. An integrated sensor, comprising:
- a suspended structure having a tungsten region, and positioned over a semiconductor material body, and connected to said semiconductor material body through anchorage portions; and
a protective structure comprising silicon portions coupled to and surrounding the tungsten region, wherein said protective structure comprises a region of polycrystalline silicon disposed directly underneath said tungsten region and silicon carbide regions positioned over and at sides of said tungsten region.
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Abstract
A sensor having high sensitivity is formed using a suspended structure with a high-density tungsten core. To manufacture it, a sacrificial layer of silicon oxide, a polycrystal silicon layer, a tungsten layer and a silicon carbide layer are deposited in succession over a single crystal silicon body. The suspended structure is defined by selectively removing the silicon carbide, tungsten and polycrystal silicon layers. Then spacers of silicon carbide are formed which cover the uncovered ends of the tungsten layer, and the sacrificial layer is then removed.
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Citations
13 Claims
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1. An integrated sensor, comprising:
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a suspended structure having a tungsten region, and positioned over a semiconductor material body, and connected to said semiconductor material body through anchorage portions; and a protective structure comprising silicon portions coupled to and surrounding the tungsten region, wherein said protective structure comprises a region of polycrystalline silicon disposed directly underneath said tungsten region and silicon carbide regions positioned over and at sides of said tungsten region. - View Dependent Claims (2, 3, 4)
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5. An integrated sensor, comprising:
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a suspended structure having a tungsten region, and positioned over a semiconductor material body, and connected to said semiconductor material body through anchorage portions; and a protective structure comprising silicon portions coupled to and surrounding the tungsten region, wherein said protective structure comprises a region of polycrystalline silicon disposed underneath said tungsten region and silicon carbide regions positioned over and at sides of said tungsten region wherein a first adhesive layer is present between said tungsten region and said region of polycrystalline silicon and wherein a second adhesive layer is present between said tungsten region and said silicon carbide regions.
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6. An integrated sensor, comprising:
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a semiconductor substrate; a suspended structure suspended over the semiconductor substrate to form a gap between the suspended structure and the semiconductor substrate, the suspended structure including a tungsten region and a protective layer having portions of silicon coupled to and surrounding the tungsten region, wherein said protective layer comprises a region of polycrystalline silicon disposed directly underneath said tungsten region and silicon carbide regions positioned over and at sides of said tungsten region; and anchorage portions laterally coupling the suspended structure to the semiconductor substrate. - View Dependent Claims (7, 8, 9, 10)
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11. An integrated sensor, comprising:
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a suspended structure having a tungsten region, the tungsten region surrounded by a protective structure resistant to etching sacrificial material, the protective structure comprising portions of silicon or portions of silicon carbide, the protective structure including a region of polycrystal silicon disposed underneath the tungsten region and a silicon carbide region positioned over and at sides of the tungsten region; a first adhesive layer present between the tungsten region and the region of polycrystal silicon; and a second adhesive layer present between the tungsten region and the silicon carbide region.
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12. An integrated sensor, comprising:
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a semiconductor substrate; a suspended structure positioned over the semiconductor substrate to form a gap between the suspended structure and the semiconductor substrate, the suspended structure including a tungsten region and a protective layer coupled to and surrounding the tungsten region, the protective layer having a lower portion comprising silicon and an upper portion comprising silicon carbide, the lower portion being directly underneath the tungsten region; and anchorage portions coupling the suspended structure to the semiconductor substrate. - View Dependent Claims (13)
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Specification