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EMI shielding enclosures

  • US 6,090,728 A
  • Filed: 05/01/1998
  • Issued: 07/18/2000
  • Est. Priority Date: 05/01/1998
  • Status: Expired due to Fees
First Claim
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1. An EMI shielding enclosure for an electronic assembly, comprising:

  • a ground plane; and

    a shielding cover, formed by thermoforming a composite sheet, said cover comprising;

    a non-porous carrier sheet;

    a fibrous metal mat having an outer surface and a contact surface, said contact surface adjacent said carrier sheet, said metal mat comprising low melting metal fibers that melt during thermoforming of said shielding cover;

    a fiber-coat to insulate said metal fibers by substantially surrounding said fibers, said fiber-coat overlying said metal fibers at said outer surface of said mat by less than 0.15 mm, said fiber-coat substantially extending through said mat to said non-porous carrier sheet; and

    a contact edge to form an electrical connection to said ground plane, said electrical connection made by adhesion of said contact edge against said ground plane, at temperatures up to about 200°

    C., said cover essentially free from spheroidal protrusions.

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