Thermal microplatform

• US 6,091,050 A
• Filed: 11/17/1997
• Issued: 07/18/2000
• Est. Priority Date: 11/17/1997
• Status: Expired due to Fees

• Current Assignee: Multispectral Imaging, Inc. (Agiltron, Inc.)
• Original Assignee: Roxburgh Limited
• Inventors: Carr, William N.
• Primary Examiner(s): Walberg, Teresa
• Assistant Examiner(s): ROBINSON, DANIEL LEON
• Application Number:
  US08/972,055
• Time in Patent Office: 974 Days
• Field of Search: 219/201, 257/414, 257/415, 257/116, 257/417, 257/418, 257/419, 73/504.15, 73/517 R
• US Class Current: 219/201
• CPC Class Codes: H05B 1/0216 actuated by the expansion of a solid element, e.g. wire or rod
• CPC Class Codes: H05B 2203/003 using serpentine layout
• CPC Class Codes: H05B 3/262 the insulating base being an insulated metal plate

Abstract

A micromachined platform structure includes a substrate having a major surface and a platform positioned over the major surface. Plural support beams are tethered between the substrate and the platform, with each support beam including at least a first layer exhibiting a first thermal coefficient of expansion (TCE) and a second layer with a second TCE, the first TCE greater than the second TCE. The first layer is deposited on the second layer at a temperature that is higher than an ambient temperature at which the platform is to be used. Thus, at the ambient use temperature, the first layer is in a contraction/tension state relative to the second layer and causes a flexure of the support beams and an elevation of the platform away from the substrate'"'"'s major surface.

Claims

1. A micromachined platform structure comprising:

a substrate having a major surface;

a platform positioned away from said major surface;

plural support beams tethered between said substrate and said platform, each said support beam comprising at least a first layer exhibiting a first thermal coefficient of expansion (TCE) and a second layer with a second TCE, said first TCE greater than said second TCE, said first layer deposited on said second layer at a temperature that is higher than an ambient temperature at which said platform is to be used, said first layer, at said ambient temperature, having contracted and in tension relative to said second layer, causing a flexure of said beam to elevate said platform to a static position away from said major surface.

2. The micromachined platform structure as recited in claim 1, wherein said first layer and second layer of at least some of said plural support beams are both insulating materials.

3. The micromachined platform structure as recited in claim 1, wherein said platform comprises a resistive heater element and wherein at least one of said first layer or said second layer of at least some of said plural support beams is a conductor material which enables application of a heater current to said resistive heater element.

4. The micromachined platform structure as recited in claim 1, further comprising:

a heater structure positioned between said substrate and said platform and comprising plural layers exhibiting different TCEs, said heater structure responsive to an applied heater current to deflect into contact with said platform and thereby provide a heating thereof.

5. The micromachined platform structure as recited in claim 4 wherein said heater structure retracts away from said platform upon cooling to enable increased thermal isolation of said platform and a decreased rate of cooling thereof.

6. The micromachined platform structure as recited in claim 5, wherein said heater structure comprises a plurality of independently controllable heater elements.

7. The micromachined platform structure as recited in claim 5, wherein said heater structure comprises a spiral structure.

8. A micromachined platform structure comprising:

a substrate having a major surface;

capacitive plate means formed on said substrate;

a platform positioned away from said major surface and comprising plural layers exhibiting different thermal coefficients of expansion (TCEs), at least one of said layers comprising a conductive material, said platform responsive to applied heat to move with respect to said capacitive plate means on said substrate;

plural support beams tethered between said substrate and said platform, each said support beam comprising at least a first layer exhibiting a first TCE and a second layer with a second TCE, said first TCE greater than said second TCE,

said first layer deposited on said second layer at a temperature that is higher than an ambient temperature at which said platform is to be used, said first layer, at said ambient temperature, having contracted and in tension relative to said second layer, causing a flexure of said beam to elevate said platform away from said major surface; and

means for sensing changes in capacitance between said capacitive plate means and said conductive material of said platform as an indication of a change of temperature of said platform.

9. The micromachined platform structure as recited in claim 8, wherein said capacitive plate means comprise a pair of plates and said conductive material of said platform is positioned to substantially cover said pair of plates.

10. The micromachined platform structure as recited in claim 8, wherein said first layer and said second layer of said plural support beams are low thermal conductance materials.

11. A method for configuring a micromachined platform structure, said structure including a substrate having a major surface, a platform positioned upon a sacrificial material on said major surface and plural support beams tethered between said substrate and said platform, each support beam comprising at least a first layer exhibiting a first thermal coefficient of expansion (TCE) and a second layer with a second TCE, said first TCE greater than said second TCE, said method comprising the steps of:

depositing said first layer on said second layer at a temperature that is higher than an ambient temperature at which said platform is to be used, said first layer thus being in tension at said ambient temperature;

removing said sacrificial layer to enable, at said ambient temperature, said first layer to cause a flexure of said support beams to elevate said platform to a static position away from said major surface.

12. The method as recited in claim 11 wherein a heater structure is positioned between said substrate and said platform, said heater structure comprising plural layers exhibiting different TCEs, said method comprising the further step of:

applying a heater current said heater structure to deflect said heater structure into contact with said platform to thereby provide a heating thereof.

13. A method for configuring a micromachined platform structure that includes a substrate having a major surface, capacitive plate means formed on said substrate, a platform positioned on a sacrificial layer attached to said substrate, said platform comprising plural layers exhibiting different thermal coefficients of expansion (TCEs), at least one of said layers comprising a conductive material, said platform responsive to applied heat to move with respect to said capacitive plate means on said substrate, and plural support beams tethered between said substrate and said platform, each said support beam comprising at least a first layer exhibiting a first TCE and a second layer with a second TCE, said first TCE greater than said second TCE, said method comprising the steps of:

depositing said first layer on said second layer at a temperature that is higher than an ambient temperature at which said platform is to be used, said first layer thus being in tension at said ambient temperature;

removing said sacrificial layer to enable, at said ambient temperature, said first layer to cause a flexure of said support beams to elevate said platform to a static position away from said major surface; and

sensing changes in capacitance between said capacitive plate means and said conductive material of said platform as an indication of a change of temperature of said platform.