Semiconductor gamma- ray camera and medical imaging system

• US 6,091,070 A
• Filed: 07/03/1997
• Issued: 07/18/2000
• Est. Priority Date: 12/23/1994
• Status: Expired due to Term

• Current Assignee: Digirad Corporation
• Original Assignee: Digirad Corporation
• Inventors: Doty, F. Patrick, Lingren, Clinton L., Apotovsky, Boris, Friesenhahn, Stanley J., Augustine, Frank L., Ashburn, William L., Butler, Jack F.
• Primary Examiner(s): Ham, Seungsook
• Assistant Examiner(s): HANIG, RICHARD E
• Application Number:
  US08/887,957
• Time in Patent Office: 1,111 Days
• Field of Search: 250/370.09, 250/370.13, 250/370.01, 250/370.14
• US Class Current: 250/370.09
• CPC Class Codes: A61B 6/037 Emission tomography
• CPC Class Codes: A61B 6/4258 for detecting non x-ray radiation, e.g. gamma radiation A61B6/037 takes precedence
• CPC Class Codes: G01T 1/161 Applications in the field of nuclear medicine, e.g. in vivo counting apparatus for radiation diagnosis A61B6/00
• CPC Class Codes: G01T 1/1642 using a scintillation crystal and position sensing photodetector arrays, e.g. ANGER cameras
• CPC Class Codes: G01T 1/243 Modular detectors, e.g. arrays formed from self contained units constructional or manufacturing details H01L25/00
• CPC Class Codes: G01T 1/247 Detector read-out circuitry for processing gain or off-set correction H04N
• CPC Class Codes: H01L 27/146 Imager structures
• CPC Class Codes: H01L 27/14658 X-ray, gamma-ray or corpuscular radiation imagers measuring X-, gamma- or corpuscular radiation G01T1/00
• CPC Class Codes: H01L 27/14676 X-ray, gamma-ray or corpuscular radiation imagers measuring X-, gamma- or corpuscular radiation G01T1/00
• CPC Class Codes: H04N 23/30 for generating image signals from X-rays
• CPC Class Codes: H04N 5/32 Transforming X-rays cameras or camera modules for generating image signals from X-rays H04N23/30; circuitry of SSIS for transforming X-rays into image signals H04N25/30

Abstract

A high-energy photon imaging system including an imaging head, a signal processor, a data acquisition system and an image processing computer. The imaging head includes a detector comprising a plurality of closely-packed detection modules. Each detection module comprises a plurality of detection elements mounted to a circuit carrier. The detection elements produce electrical pulses having amplitudes indicative of the magnitude of radiation absorbed by the detection elements. The circuit carrier includes channels for conditioning and processing the signals generated by corresponding detection elements and for preparing the processed signals for further processing by a signal processor. Each conditioning and processing channel stores the amplitudes of the detection element electrical pulses exceeding a predetermined threshold. The detection modules employ a fall-through circuit which automatically finds only those detection elements that have a stored pulse amplitude exceeding the threshold. The fall-through circuit searches for the next detection element and associated channel having a valid event. The signal processor performs diagnostics, gain normalization, and response efficiency normalization functions. The data acquisition system controls the acquisition and processing of data received from the conditioning and processing channels, produces image data based upon the data in a format that is compatible with existing imaging cameras, and transmits the data to the image processing computer. The image processing computer formulates images based upon the processed signals and displays the formulated images on a display device.

Claims

1. A detection module comprising:

a. a semiconductor radiation detector having a top surface and a bottom surface, wherein the bottom surface is patterned into a plurality of detection elements defined by patterning selected portions of the surface with areas of conductor, and wherein each detection element produces an electrically-charged detection pulse indicative of the magnitude of radiation received by each element, and wherein the detection element pulse is transmitted to an electrode coupled to the bottom surface of each element, the detector having electrical contacts arranged on the bottom surface; and

b. an electronic circuit carrier mechanically coupled to the bottom surface of the detector such that substantially all of the detection element pulses are coupled to the carrier through the bottom surface of the detector, wherein the carrier contains circuits for processing the detection-element pulses, and wherein the circuits include at least one channel for conditioning and processing the detection-element pulses coupled to each detection element.

2. The detection module of claim 1, further comprising a circuit board, mounted between the detector and the carrier, wherein the circuit board couples the electrode from the bottom surface of each element to a conditioning and processing channel for each element.

3. The detection module of claim 1, wherein the channel amplifies, conditions and processes the detection-element pulses, and wherein the conditioning and processing channel stores an amplitude and an address of the detection-element pulses which exceed a reference threshold.

4. The detection module of claim 3, wherein the channel transmits the stored amplitude and address when enabled by a fall-through means, and wherein the fall-through means enables the channel after processing an upstream channel.

5. The detection module of claim 3, wherein the conditioning and processing channel further includes leakage current compensation means, and wherein the compensation means compensates for substantially large and variable leakage currents generated by the detection elements.

6. A detection module comprising:

a. a semiconductor radiation detector having a top surface and a bottom surface, wherein the bottom surface is patterned into a plurality of detection elements defined by patterning selected portions of the surface with areas of conductor, and wherein each detection element produces an electrically-charged detection pulse indicative of the magnitude of radiation received by each element, and wherein the detection element pulse is transmitted to an electrode coupled to the bottom surface of each element;

b. an electronic circuit carrier mechanically coupled to the detector, wherein the carrier contains circuits for processing the detection-element pulses, and wherein the circuits include at least one channel for conditioning and processing the detection-element pulses coupled to each detection element, and

c. a substantially thin plate mounted to and electrically coupled to the top surface of the detector.

7. A detection module comprising:

a. a semiconductor radiation detector having a top surface and a bottom surface, wherein the bottom surface is patterned into a plurality of detection elements defined by patterning selected portions of the surface with areas of conductor, and wherein each detection element produces an electrically-charged detection pulse indicative of the magnitude of radiation received by each element, and wherein the detection element pulse is transmitted to an electrode coupled to the bottom surface of each element;

b. an electronic circuit carrier mechanically coupled to the detector, wherein the carrier contains circuits for processing the detection-element pulses, and wherein the circuits include at least one channel for conditioning and processing the detection-element pulses coupled to each detection element, and

c. a substantially thin plate mounted to the bottom surface of the detector.

8. A detection module comprising:

a. a semiconductor radiation detector having a top surface and a bottom surface, wherein the bottom surface is patterned into a plurality of detection elements defined by patterning selected portions of the surface with areas of conductor, and wherein each detection element produces an electrically-charged detection pulse indicative of the magnitude of radiation received by each element, and wherein the detection element pulse is transmitted to an electrode coupled to the bottom surface of each element;

b. an electronic circuit carrier mechanically coupled to the detector, wherein the carrier contains circuits for processing the detection-element pulses, and wherein the circuits include at least one channel for conditioning and processing the detection-element pulses coupled to each detection element,

c. a substantially thin plate mounted to and electrically coupled to the top surface of the detector, and

d. a substantially thin plate mounted to the bottom surface of the detector,

wherein the plates comprise ceramic.

9. A detection module comprising:

a. a semiconductor radiation detector having a top surface and a bottom surface, wherein the bottom surface is patterned into a plurality of detection elements defined by patterning selected portions of the surface with areas of conductor, and wherein each detection element produces an electrically-charged detection pulse indicative of the magnitude of radiation received by each element, and wherein the detection element pulse is transmitted to an electrode coupled to the bottom surface of each element;

b. an electronic circuit carrier mechanically coupled to the detector, wherein the carrier contains circuits for processing the detection-element pulses, and wherein the circuits include at least one channel for conditioning and processing the detection-element pulses coupled to each detection element,

c. a substantially thin plate mounted to and electrically coupled to the top surface of the detector,

d. a substantially thin plate mounted to the bottom surface of the detector, wherein the plates comprise ceramic, and

wherein the plates are less than 0.025 inch thick.

10. A detection module comprising:

a. a semiconductor radiation detector having a top surface and a bottom surface, wherein the bottom surface is patterned into a plurality of detection elements, and wherein each detection element produces pulses indicative of the energy of an absorbed photon of radiation received by each element, and wherein the detection-element pulses are transmitted to an electrode coupled to the bottom surface of each element, the detector having electrical contacts arranged on the bottom surface;

; and

b. an electronic circuit carrier mechanically coupled to the bottom surface of the detector such that substantially all of the detection element pulses are coupled to the carrier through the bottom surface of the detector, wherein the carrier contains electronic circuits for processing the detection-element pulses, and wherein the circuits include at least one processing channel for each detection element, and wherein the processing channel produces a flag whenever a detection-element pulse exceeds a reference threshold.