Insulated gate thyristor

• US 6,091,087 A
• Filed: 05/06/1997
• Issued: 07/18/2000
• Est. Priority Date: 05/09/1996
• Status: Expired due to Fees

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Iwamuro, Noriyuki, Harada, Yuichi, Iwaana, Tadayoshi
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): DUONG, HUNG V
• Application Number:
  US08/852,269
• Time in Patent Office: 1,169 Days
• Field of Search: 257/335, 257/330, 257/133, 257/138, 257/137, 257/134, 257/147
• US Class Current: 257/133
• CPC Class Codes: H01L 29/7455 produced by an insulated gate structure
• CPC Class Codes: H01L 29/749 with turn-on by field effect

Abstract

An insulated gate thyristor includes a first-conductivity-type base layer having a high resistivity, first and second second-conductivity-type base regions formed in a surface layer of the first-conductivity-type base layer, a first-conductivity-type source region formed in a surface layer of the first second-conductivity-type base region, and a first-conductivity-type emitter region formed in a surface layer of the second second-conductivity-type base region. The thyristor further includes a gate electrode formed through an insulating film on the first second-conductivity-type base region, an exposed portion of the first-conductivity-type base layer and the second second-conductivity-type base region, a first main electrode that contacts both the first second-conductivity-type base layer and first-conductivity-type source region, a second-conductivity-type emitter layer formed on the first-conductivity-type base layer, a second main electrode that contacts the second-conductivity-type emitter layer, and an insulating film covering entire areas of surfaces of the second second-conductivity-type base region and first-conductivity-type emitter region. The second second-conductivity-type base region has a diffusion depth that is greater than a larger one of diffusion depths of the first second-conductivity-type base region and a second-conductivity-type well region included in the first second-conductivity-type base region.

Claims

1. An insulated gate thyristor comprising;

a first-conductivity-type base layer;

first and second second-conductivity-type base regions formed in selected areas of a surface layer of a first major surface of said first-conductivity-type base layer, said first second-conductivity-type base region including a second-conductivity-type well region;

a first-conductivity-type source region formed in a selected area of a surface layer of said first second-conductivity-type base region;

a first-conductivity-type emitter region formed in a selected area of a surface layer of said second second-conductivity-type base region;

a gate electrode formed through a gate insulating film on a surface of said first second-conductivity-type base region, an exposed portion of said first-conductivity-type base layer, and a surface of said second second-conductivity-type base region, which surfaces and exposed portion are interposed between said first-conductivity-type source region and said first-conductivity-type emitter region;

a first main electrode that contacts both an exposed portion of said first second-conductivity-type base layer and said first-conductivity-type source region;

a second-conductivity-type emitter layer formed on a second surface of said first-conductivity-type base layer;

a second main electrode that contacts said second-conductivity-type emitter layer; and

an insulating film covering entire areas of surfaces of said second second-conductivity-type base region and said first-conductivity-type emitter region;

wherein

said second second-conductivity-type base region has a diffusion depth that is smaller than a larger one of diffusion depths of said first second-conductivity-type base region and said second-conductivity-type well region.

2. An insulated gate thyristor according to claim 1, wherein said second second-conductivity-type base region has a surface impurity concentration that is lower than that of said first second-conductivity-type base region.

3. An insulated gate thyristor according to claim 1, wherein said first-conductivity-type source region comprises a first region having a first surface impurity concentration, and a second region having a second surface impurity concentration that is lower than said first surface impurity concentration, said first main electrode being in contact with a surface of said first region having a higher surface impurity concentration than said second region.

4. An insulated gate thyristor according to claim 1, further comprising a first-conductivity-type auxiliary region formed in the exposed portion of said first-conductivity-type base layer between said first and second second-conductivity-type base regions, said first-conductivity-type auxiliary region having an impurity concentration that is higher than that of said first-conductivity-type base layer, and a diffusion depth that is smaller than those of the first and second second-conductivity-type base regions.

5. An insulated gate thyristor according to claim 1, wherein a first part of said gate insulating film formed on the exposed portion of said first-conductivity-type base layer which is interposed between two of said first second-conductivity-type base region has a thickness that is greater than a second part of the gate insulating film formed on the exposed portion of the first-conductivity-type base layer which is interposed between said first and second second-conductivity-type base regions.

6. An insulated gate thyristor according to claim 1, wherein at least one of said first and second second-conductivity-type base regions, said first-conductivity-type emitter region and said first-conductivity-type source region has one of polygonal, circular and elliptical shapes.

7. An insulated gate thyristor according to claim 1, wherein said first second-conductivity-type base region and said first-conductivity-type source region formed in the surface layer thereof are formed so as to surround said second second-conductivity-type base region.

8. An insulated gate thyristor according to claim 1, wherein a plurality of said first second-conductivity-type base regions are formed around said second second-conductivity-type base region.

9. An insulated gate thyristor according to claim 8, wherein a plurality of said first second-conductivity-type base regions and said first-conductivity-type source regions formed in surface layers thereof are formed around said second second-conductivity-type base region, and wherein said gate electrode having a substantially annular shape is provided so as to surround said insulating film on the second second-conductivity-type base region, said first main electrode being provided through an insulating film on one side of the gate electrode remote from the second second-conductivity-type base region.

10. An insulated gate thyristor according to claim 9, wherein a contact portion between said first main electrode and said first second-conductivity-type base region and said first-conductivity-type source region has a shape selected from a polygonal shape, a circular shape and an elliptical shape.

11. An insulated gate thyristor according to claim 9, wherein a first surface portion of said first-conductivity-type source region which is opposed to said second second-conductivity-type base region is covered with an insulating film, and a second surface portion of said first-conductivity-type source region which is opposed to said first second-conductivity-type base region is in contact with said first main electrode.

12. An insulated gate thyristor according to claim 9, wherein said first-conductivity-type emitter region has a diffusion depth that is greater than that of said first-conductivity-type source region.

13. An insulated gate thyristor according to claim 9, wherein lifetime killers are present in local portions of the thyristor.

14. An insulated gate thyristor according to claim 9, further comprising a first-conductivity-type buffer layer between said first-conductivity-type base layer and said second-conductivity-type emitter layer, said first-conductivity-type buffer layer having a higher impurity concentration than the first-conductivity-type base layer.

15. An insulated gate thyristor comprising;

a first-conductivity-type base layer;

first and second second-conductivity-type base regions formed in selected areas of a surface layer of a first major surface of said first-conductivity-type base layer;

a first-conductivity-type source region formed in a selected area of a surface layer of said first second-conductivity-type base region;

a first-conductivity-type emitter region formed in a selected area of a surface layer of said second second-conductivity-type base region;

a gate electrode formed through a gate insulating film on a surface of said first second-conductivity-type base region, an exposed portion of said first-conductivity-type base layer, and a surface of said second second-conductivity-type base region, which surfaces and exposed portion are interposed between said first-conductivity-type source region and said first-conductivity-type emitter region;

a first main electrode that contacts both an exposed portion of said first second-conductivity-type base layer and said first-conductivity-type source region;

a second-conductivity-type emitter layer formed on a second surface of said first-conductivity-type base layer;

a second main electrode that contacts said second-conductivity-type emitter layer; and

an insulating film covering entire areas of surfaces of said second second-conductivity-type base region and said first-conductivity-type emitter region; and

wherein

said second second-conductivity-type base region has a surface impurity concentration that is lower than that of said first second-conductivity-type base region.

16. An insulated gate thyristor according to claim 15, wherein said first second-conductivity-type base region includes a second-conductivity-type well region, and wherein said second second-conductivity-type base region has a diffusion depth that is smaller than a larger one of diffusion depths of said first second-conductivity-type base region and said second-conductivity-type well region.

17. An insulated gate thyristor according to claim 15, wherein said first-conductivity-type source region comprises a first region having a first surface impurity concentration, and a second region having a second surface impurity concentration that is lower than said first surface impurity concentration, said first main electrode being in contact with a surface of said first region having a higher surface impurity concentration than said second region.

18. An insulated gate thyristor according to claim 15, further comprising a first-conductivity-type auxiliary region formed in the exposed portion of said first-conductivity-type base layer between said first and second second-conductivity-type base regions, said first-conductivity-type auxiliary region having an impurity concentration that is higher than that of said first-conductivity-type base layer, and a diffusion depth that is smaller than those of the first and second second-conductivity-type base regions.

19. An insulated gate thyristor according to claim 15, wherein a first part of said gate insulating film formed on the exposed portion of said first-conductivity-type base layer which is interposed between two of said first second-conductivity-type base region has a thickness that is greater than a second part of the gate insulating film formed on the exposed portion of the first-conductivity-type base layer which is interposed between said first and second second-conductivity-type base regions.

20. An insulated gate thyristor according to claim 15, wherein at least one of said first and second second-conductivity-type base regions, said first-conductivity-type emitter region and said first-conductivity-type source region has one of polygonal, circular and elliptical shapes.

21. An insulated gate thyristor according to claim 15, wherein said first second-conductivity-type base region and said first-conductivity-type source region formed in the surface layer thereof are formed so as to surround said second second-conductivity-type base region.

22. An insulated gate thyristor according to claim 15, wherein a plurality of said first second-conductivity-type base regions are formed around said second second-conductivity-type base region.

23. An insulated gate thyristor comprising;

a first-conductivity-type base layer;

first and second second-conductivity-type base regions formed in selected areas of a surface layer of a first major surface of said first-conductivity-type base layer;

a first-conductivity-type source region formed in a selected area of a surface layer of said first second-conductivity-type base region;

a first-conductivity-type emitter region formed in a selected area of a surface layer of said second second-conductivity-type base region;

a gate electrode formed through a gate insulating film on a surface of said first second-conductivity-type base region, an exposed portion of said first-conductivity-type base layer, and a surface of said second second-conductivity-type base region, which surfaces and exposed portion are interposed between said first-conductivity-type source region and said first-conductivity-type emitter region;

a first main electrode that contacts both an exposed portion of said first second-conductivity-type base layer and said first-conductivity-type source region;

a second-conductivity-type emitter layer formed on a second surface of said first-conductivity-type base layer;

a second main electrode that contacts said second-conductivity-type emitter layer; and

an insulating film covering entire areas of surfaces of said second second-conductivity-type base region and said first-conductivity-type emitter region;

wherein

said first-conductivity-type source region comprises a first region having a first surface impurity concentration, and a second region having a second surface impurity concentration that is lower than said first surface impurity concentration, said first main electrode being in contact with a surface of said first region having a higher surface impurity concentration than said second region.

24. An insulated gate thyristor according to claim 23, wherein said first second-conductivity-type base region includes a second-conductivity-type well region, and wherein said second second-conductivity-type base region has a diffusion depth that is smaller than a larger one of diffusion depths of said first second-conductivity-type base region and said second-conductivity-type well region.

25. An insulated gate thyristor according to claim 23, wherein said second second-conductivity-type base region has a surface impurity concentration that is lower than that of said first second-conductivity-type base region.

26. An insulated gate thyristor according to claim 23, further comprising a first-conductivity-type auxiliary region formed in the exposed portion of said first-conductivity-type base layer between said first and second second-conductivity-type base regions, said first-conductivity-type auxiliary region having an impurity concentration that is higher than that of said first-conductivity-type base layer, and a diffusion depth that is smaller than those of the first and second second-conductivity-type base regions.

27. An insulated gate thyristor according to claim 23, wherein a first part of said gate insulating film formed on the exposed portion of said first-conductivity-type base layer which is interposed between two of said first second-conductivity-type base region has a thickness that is greater than a second part of the gate insulating film formed on the exposed portion of the first-conductivity-type base layer which is interposed between said first and second second-conductivity-type base regions.

28. An insulated gate thyristor according to claim 23, wherein at least one of said first and second second-conductivity-type base regions, said first-conductivity-type emitter region and said first-conductivity-type source region has one of polygonal, circular and elliptical shapes.

29. An insulated gate thyristor according to claim 23, wherein said first second-conductivity-type base region and said first-conductivity-type source region formed in the surface layer thereof are formed so as to surround said second second-conductivity-type base region.

30. An insulated gate thyristor according to claim 23, wherein a plurality of said first second-conductivity-type base regions are formed around said second second-conductivity-type base region.

31. An insulated gate thyristor comprising;

a first-conductivity-type base layer;

first and second second-conductivity-type base regions formed in selected areas of a surface layer of a first major surface of said first-conductivity-type base layer;

a first-conductivity-type source region formed in a selected area of a surface layer of said first second-conductivity-type base region;

a first-conductivity-type emitter region formed in a selected area of a surface layer of said second second-conductivity-type base region;

a gate electrode formed through a gate insulating film on a surface of said first second-conductivity-type base region, an exposed portion of said first-conductivity-type base layer, and a surface of said second second-conductivity-type base region, which surfaces and exposed portion are interposed between said first-conductivity-type source region and said first-conductivity-type emitter region;

a first main electrode that contacts both an exposed portion of said first second-conductivity-type base layer and said first-conductivity-type source region;

a second-conductivity-type emitter layer formed on a second surface of said first-conductivity-type base layer;

a second main electrode that contacts said second-conductivity-type emitter layer;

an insulating film covers entire areas of surfaces of said second second-conductivity-type base region and said first-conductivity-type emitter region; and

a first-conductivity-type auxiliary region formed in the exposed portion of said first-conductivity-type base layer between said first and second second-conductivity-type base regions, said first-conductivity-type auxiliary region having an impurity concentration that is higher than that of said first-conductivity-type base layer, and a diffusion depth that is smaller than those of the first and second second-conductivity-type base regions.

32. An insulated gate thyristor according to claim 31, wherein said first second-conductivity-type base region includes a second-conductivity-type well region, and wherein said second second-conductivity-type base region has a diffusion depth that is smaller than a larger one of diffusion depths of said first second-conductivity-type base region and said second-conductivity-type well region.

33. An insulated gate thyristor according to claim 31, wherein said second second-conductivity-type base region has a surface impurity concentration that is lower than that of said first second-conductivity-type base region.

34. An insulated gate thyristor according to claim 31, wherein said first-conductivity-type source region comprises a first region having a first surface impurity concentration, and a second region having a second surface impurity concentration that is lower than said first surface impurity concentration, said first main electrode being in contact with a surface of said first region having a higher surface impurity concentration than said second region.

35. An insulated gate thyristor according to claim 31, wherein a first part of said gate insulating film formed on the exposed portion of said first-conductivity-type base layer which is interposed between two of said first second-conductivity-type base region has a thickness that is greater than a second part of the gate insulating film formed on the exposed portion of the first-conductivity-type base layer which is interposed between said first and second second-conductivity-type base regions.

36. An insulated gate thyristor according to claim 31, wherein at least one of said first and second second-conductivity-type base regions, said first-conductivity-type emitter region and said first-conductivity-type source region has one of polygonal, circular and elliptical shapes.

37. An insulated gate thyristor according to claim 31, wherein said first second-conductivity-type base region and said first-conductivity-type source region formed in the surface layer thereof are formed so as to surround said second second-conductivity-type base region.

38. An insulated gate thyristor according to claim 31, wherein a plurality of said first second-conductivity-type base regions are formed around said second second-conductivity-type base region.

39. An insulated gate thyristor comprising;

a first-conductivity-type base layer;

first and second second-conductivity-type base regions formed in selected areas of a surface layer of a first major surface of said first-conductivity-type base layer;

a first-conductivity-type source region formed in a selected area of a surface layer of said first second-conductivity-type base region;

a first-conductivity-type emitter region formed in a selected area of a surface layer of said second second-conductivity-type base region;

a gate electrode formed through a gate insulating film on a surface of said first second-conductivity-type base region, an exposed portion of said first-conductivity-type base layer, and a surface of said second second-conductivity-type base region, which surfaces and exposed portion are interposed between said first-conductivity-type source region and said first-conductivity-type emitter region;

a first main electrode that contacts both an exposed portion of said first second-conductivity-type base layer and said first-conductivity-type source region;

a second-conductivity-type emitter layer formed on a second surface of said first-conductivity-type base layer;

a second main electrode that contacts said second-conductivity-type emitter layer; and

an insulating film covering entire areas of surfaces of said second second-conductivity-type base region and said first-conductivity-type emitter region;

wherein

a first part of said gate insulating film on the exposed portion of said first-conductivity-type base layer which is interposed between two of said first second-conductivity-type base region has a thickness that is greater than a second part of the gate insulating film on the exposed portion of the first-conductivity-type base layer which is interposed between said first and second second-conductivity-type base regions.

40. An insulated gate thyristor according to claim 39, wherein said first second-conductivity-type base region includes a second-conductivity-type well region, and wherein said second second-conductivity-type base region has a diffusion depth that is smaller than a larger one of diffusion depths of said first second-conductivity-type base region and said second-conductivity-type well region.

41. An insulated gate thyristor according to claim 39, wherein said second second-conductivity-type base region has a surface impurity concentration that is lower than that of said first second-conductivity-type base region.

42. An insulated gate thyristor according to claim 39, wherein said first-conductivity-type source region comprises a first region having a first surface impurity concentration, and a second region having a second surface impurity concentration that is lower than said first surface impurity concentration, said first main electrode being in contact with a surface of said first region having a higher surface impurity concentration than said second region.

43. An insulated gate thyristor according to claim 39, further comprising a first-conductivity-type auxiliary region formed in the exposed portion of said first-conductivity-type base layer between said first and second second-conductivity-type base regions, said first-conductivity-type auxiliary region having an impurity concentration that is higher than that of said second region.

44. An insulated gate thyristor according to claim 39, wherein at least one of said first and second second-conductivity-type base regions, said first-conductivity-type emitter region and said first-conductivity-type source region has one of polygonal, circular and elliptical shapes.

45. An insulated gate thyristor according to claim 39, wherein said first second-conductivity-type base region and said first-conductivity-type source region formed in the surface layer thereof are formed so as to surround said second second-conductivity-type base region.

46. An insulated gate thyristor according to claim 39, wherein a plurality of said first second-conductivity-type base regions are formed around said second second-conductivity-type base region.