Passivation for integrated circuit sensors

• US 6,091,132 A
• Filed: 12/19/1997
• Issued: 07/18/2000
• Est. Priority Date: 12/19/1997
• Status: Expired due to Fees

• Current Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Original Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Inventors: Bryant, Frank R.
• Primary Examiner(s): Prenty, Mark V.
• Application Number:
  US08/995,211
• Time in Patent Office: 942 Days
• Field of Search: 257/632, 257/635, 257/640, 257/642, 438/763
• US Class Current: 257/632
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing

Abstract

A structure and method for creating an integrated circuit passivation comprising, a circuit (16) over which an insulating layer (26 and/or 28) is disposed that electrically and hermetically isolates the circuit (16) and a silicon carbide layer (30) to form a passivation (24) to protect a circuit (16), is disclosed.

Claims

1. A mechanical protection layer for a finger contactable integrated circuit comprising:

a fingerprint sensor having a surface;

a silicon oxide insulating layer disposed over the sensor to electrically isolate the surface; and

a silicon-based layer disposed over the silicon oxide insulating layer, the silicon-based layer having a hardness greater than silicon nitride to provide mechanical protection to the fingerprint sensor during contact with a finger.

2. The integrated circuit passivation of claim 1 wherein the silicon based layer is silicon carbide.

3. The integrated circuit passivation of claim 1, further comprising:

a silicon nitride insulating layer disposed between the silicon oxide insulating layer and the silicon-based layer.

4. The integrated circuit passivation of claim 3 wherein the silicon-based layer is silicon carbide.

5. The integrated circuit passivation of claim 1 wherein said passivation is part of a fingerprint sensor.

6. A finger contactable mechanical protection layer for a fingerprint sensor comprising:

a fingerprint sensor having a surface;

a silicon oxide insulating layer disposed over the sensor to electrically isolate the sensor surface; and

a finger contactable silicon carbide layer disposed over the silicon oxide insulating layer, wherein the silicon carbide layer provides mechanical protection and scratch resistance from contact during sensor use.

7. The integrated circuit passivation of claim 6, further comprising:

a silicon nitride insulating layer disposed between the silicon oxide insulating layer and the silicon carbide layer.

8. The integrated circuit passivation of claim 6 wherein said passivation is part of a fingerprint sensor.

9. A method of fabricating a fingerprint sensor passivation comprising the steps of:

forming an integrated circuit fingerprint sensor;

depositing a silicon oxide insulating layer on the integrated circuit sensor; and

depositing a silicon carbide layer over the silicon oxide insulating layer, wherein the silicon carbide layer protects the integrated circuit sensor from mechanical stress during contact.

10. The method of claim 9, further comprising:

depositing a silicon nitride insulating layer between the silicon oxide insulating layer and the silicon carbide layer.