Multi-layer printed board with an inductor providing a high impedance at high frequency

• US 6,091,310 A
• Filed: 03/26/1998
• Issued: 07/18/2000
• Est. Priority Date: 03/26/1997
• Status: Expired due to Fees

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Utsumi, Kazuaki, Saitou, Mitsuo, Yoshida, Shiro
• Primary Examiner(s): Pascal, Robert
• Assistant Examiner(s): Summons, Barbara
• Application Number:
  US09/048,127
• Time in Patent Office: 845 Days
• Field of Search: 333/12, 333/181, 333/246, 333/247, 333/185, 336/83, 336/200, 361/761, 361/765, 361/782, 361/811, 361/794, 174/262, 174/264, 174/265
• US Class Current: 333/12
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/165 : incorporating printed inductors
• CPC Class Codes: H05K 2201/09645 : Patterning on via walls; Plural lands around one hole
• CPC Class Codes: H05K 2201/097 : Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components

Abstract

A laminated multi-layer printed board having at least a power source circuit layer, at least a ground layer and at least a signal layer includes a hole which extends through the board to the power source circuit layer. An inductor is provided in the hole.

Claims

1. A circuit board comprising:

a laminate of a power layer, a ground layer, and a plurality of signal layers, each of said power, ground, and signal layers being separated from an adjacent one of said power, ground and signal layers by an insulation layer, wherein at least two of said signal layers each comprises plural separate segments;

plural electrically conductive first vias through the insulation layer between said at least two signal layers, each of said first vias connecting one of said segments in one of said at least two signal layers to one of said segments in another of said at least two signal layers, wherein a series connection of said plural first vias and plural said segments in each of said at least two signal layers is a continuous coil; and

a second via with an inductor therein that connects said continuous coil to a contact pad on the circuit board and an electrically conductive third via that connects said continuous coil to said power layer.

2. The circuit board of claim 1, wherein said inductor comprises an electrically conductive helix that connects said contact pad to said continuous coil.

3. A circuit board comprising:

a contact pad on a surface of the circuit board;

a horizontally disposed laminate comprising a power layer and a plurality of signal layers, each of said power and signal layers being separated from an adjacent one of said power and signal layers by an insulation layer, wherein at least two of said signal layers each comprises plural separate segments;

plural electrically conductive first vias extending vertically through the insulation layer between said at least two signal layers, each of said first vias connecting one of said segments in one of said at least two signal layers to one of said segments in another of said at least two signal layers, wherein a series connection of said plural first vias and plural said segments in each of said at least two signal layers is a horizontally disposed continuous coil;

an electrically conductive second via that comprises a vertically aligned helix that connects said continuous coil to said contact pad; and

an electrically conductive third via that connects said continuous coil to said power layer.

4. A circuit board comprising:

a laminate of a power layer, two ground layers, and a signal layer, each of said power, ground, and signal layers being separated from an adjacent one of said power, ground, and signal layers by an insulation layer, said power layer being sandwiched between two of said insulation layers, and said two insulation layers sandwiching said power layer being sandwiched between said two ground layers,

said power layer comprising a main interconnection, circuit elements, and an impedance adding circuit, said impedance adding circuit comprising branch interconnections connecting said main interconnection to said circuit elements, each of said branch interconnections having a current path that is longer than a straight line connection between said main interconnection and a respective one of said circuit elements; and

at least one via extending from an exterior surface of said laminate to said power layer, and an inductor in said via.