Radio frequency identification tag having printed circuit interconnections

• US 6,091,332 A
• Filed: 07/14/1998
• Issued: 07/18/2000
• Est. Priority Date: 06/09/1998
• Status: Expired due to Term

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Wright, Philip R., Eberhardt, Noel H.
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US09/115,279
• Time in Patent Office: 735 Days
• Field of Search: 340/572.1, 340/572.7, 29/840, 428/901, 428/209, 228/180.22, 361/748, 361/749, 361/751, 361/772, 361/774, 257/692, 257/666, 257/735, 257/773
• US Class Current: 340/572.1
• CPC Class Codes: B65D 2203/10 Transponders
• CPC Class Codes: B65D 5/4233 Cards, coupons, labels or the like formed separately from the container or lid
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: G07B 2017/00629 Circuit, e.g. transponder
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/24011 Deposited, e.g. MCM-D type
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/24998 Reinforcing structures, e.g. ramp-like support
• CPC Class Codes: H01L 2224/82007 involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting a build-up interconnect during or after the bonding process
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/25 : of a plurality of high density interconnect connectors
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: Y10S 428/901 : Printed circuit

Abstract

A radio frequency identification tag (100) includes a radio frequency identification tag circuit chip (112) bonded to a substrate (114). Additional circuit components (140) are also bonded to the substrate. The substrate is formed to include a number of conductive traces (18, 20), and the radio frequency identification tag and circuit components are electrically coupled to the traces via selective application of a printable conductive medium (130, 132).

Claims

1. A radio frequency identification tag comprising:

a substrate, the substrate formed to include a conductive trace;

a radio frequency identification tag circuit chip secured to the substrate, the radio frequency identification tag circuit chip including a conductive pad; and

a layer of conductive medium printed on the substrate and coupling the conductive pad to the conductive trace.

2. The radio frequency identification tag of claim 1, further comprising an antenna secured to the substrate, and layer of conductive medium printed on the substrate coupling the antenna to the conductive trace.

3. The radio frequency identification tag of claim 2, the layer comprising a first layer and a second layer of conductive medium.

4. The radio frequency identification tag of claim 2, the antenna comprising a coil antenna.

5. The radio frequency identification tag of claim 2, the antenna comprising conductive ink printed on the substrate.

6. The radio frequency identification tag of claim 1, the conductive trace comprising conductive ink printed on the substrate.

7. The radio frequency identification tag of claim 1, further comprising a circuit component secured to the substrate, the circuit component including a circuit component conductive pad, and a third layer of conductive medium printed on the substrate coupling the circuit component conductive pad to the conductive trace.

8. The radio frequency identification tag of claim 1, the substrate comprising a recess and the radio frequency identification tag circuit chip disposed within the recess.

9. The radio frequency identification tag of claim 1, comprising an insulating layer disposed adjacent an edge of the radio frequency identification tag circuit chip.

10. The radio frequency identification tag of claim 1, wherein the radio frequency identification tag comprises one of an inductive coupled device and a capacitive coupled device.

11. A radio frequency identification tag comprising:

a substrate;

a radio frequency identification tag circuit chip secured to the substrate, the radio frequency identification tag circuit chip including a first conductive pad and a second conductive pad;

an antenna secured to the substrate, the antenna having a first antenna lead and a second antenna lead; and

a first layer of conductive medium printed on the substrate and coupling the first conductive pad to the first antenna lead and a second layer of conductive medium printed on the substrate and coupling the second conductive pad to the second antenna lead.

12. The radio frequency identification tag of claim 11, comprising a circuit component secured to the substrate, the circuit component comprising a first component conductive pad and a second component conductive pad, the first layer coupling the first component conductive pad to the first conductive pad and the first antenna lead and the second layer coupling the second component conductive pad to the second conductive pad and the second antenna lead.

13. The radio frequency identification tag of claim 11, the antenna comprising a coil antenna.

14. The radio frequency identification tag of claim 11, the antenna comprising conductive ink printed on the substrate.

15. The radio frequency identification tag of claim 11, the substrate comprising a recess and the radio frequency identification tag circuit chip disposed within the recess.

16. The radio frequency identification tag of claim 11, comprising an insulating layer disposed adjacent an edge of the radio frequency identification tag circuit chip.

17. The radio frequency identification tag of claim 11, wherein the radio frequency identification tag comprises one of an inductive coupled device and a capacitive coupled device.

18. A radio frequency identification tag comprising:

a substrate having plurality of conductive traces formed on a surface;

a template secured to the surface, the template including a recess;

a radio frequency identification tag circuit chip disposed within the recess and secured to the surface, the radio frequency identification tag circuit chip including a conductive pad; and

a layer of conductive medium printed on the template and coupling the conductive pad to at least one of the plurality of conductive traces.

19. The radio frequency identification tag of claim 18, further comprising an antenna secured to the substrate, the antenna having an antenna lead, the template comprising an antenna lead recess, the antenna lead disposed within the antenna lead recess and the layer coupling the antenna lead to the conductive pad.

20. The radio frequency identification tag of claim 19, the antenna comprising a coil antenna.

21. The radio frequency identification tag of claim 19, further comprising a circuit component, the circuit component having a circuit component conductive pad, the template comprising a circuit component recess, the circuit component disposed within the circuit component recess and secured to the substrate, and the layer coupling the circuit component conductive pad to the conductive pad and the antenna lead.

22. The radio frequency identification tag of claim 18, comprising an insulating layer disposed adjacent an edge of the radio frequency identification tag circuit chip.

23. The radio frequency identification tag of claim 18, wherein the radio frequency identification tag comprises one of an inductive coupled device and a capacitive coupled device.

24. A circuit assembly comprising:

a substrate, the substrate formed to include a conductive trace;

a circuit chip secured to the substrate, the circuit chip including a conductive pad; and

a layer of conductive medium printed on the substrate and coupling the conductive pad to the conductive trace.

25. The circuit assembly of claim 24, the conductive trace comprising conductive ink printed on the substrate.

26. The circuit assembly of claim 24, further comprising a second circuit chip secured to the substrate, the second circuit chip including a second conductive pad, and the circuit assembly comprising a second layer of conductive medium printed on the substrate coupling the second conductive pad to the conductive trace.

27. The circuit assembly of claim 24, the substrate comprising a recess and the circuit chip disposed within the recess.

28. The circuit assembly of claim 24, comprising an insulating layer disposed adjacent an edge of the circuit chip.

29. A circuit assembly comprising:

a substrate including a conductive trace formed on a surface;

a template secured to the substrate, the template comprising a recess;

a circuit chip disposed within the recess and secured to the substrate, the circuit chip including a conductive pad; and

a layer of conductive medium printed on the template and coupling the conductive pad to the conductive trace.

30. The circuit assembly of claim 29, further comprising a second circuit chip, the second circuit chip having a second conductive pad, the template comprising a second recess, the second circuit chip disposed within the second recess and secured to the substrate, and the layer coupling the second conductive pad to the conductive pad.

31. The circuit assembly of claim 29, comprising an insulating layer disposed adjacent an edge of the circuit chip.

32. The circuit assembly of claim 31, the insulating layer disposed within the recess.

33. A circuit assembly comprising:

a substrate,

a first circuit chip secured the substrate;

a second circuit chip secured to the substrate; and

a layer of conductive medium electrically coupling the first circuit chip and the second circuit chip, the layer printed on the substrate over the first circuit chip and under the second circuit chip.

34. The circuit assembly of claim 33, comprising a second layer coupling the first circuit chip and the second circuit chip, the second layer printed on the substrate and over the first circuit chip and the second circuit chip.