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Flexible interface structures for electronic devices

  • US 6,092,280 A
  • Filed: 05/26/1999
  • Issued: 07/25/2000
  • Est. Priority Date: 12/23/1996
  • Status: Expired due to Term
First Claim
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1. A method for fabricating a flexible film interface comprising:

  • attaching a flexible material to a portion of a flexible film;

    applying surface metallization on the flexible material;

    forming at least one via through the flexible film extending to the surface metallization;

    applying a floating pad structure comprising floating pad metallization patterned over the flexible material and the surface metallization, a first portion of the floating pad metallization forming a central pad and a second portion of the floating pad metallization forming at least one extension from the central pad and extending into the at least one via.

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