Apparatus and method for processing substrate

• US 6,092,485 A
• Filed: 10/28/1997
• Issued: 07/25/2000
• Est. Priority Date: 10/29/1996
• Status: Expired due to Fees

• Current Assignee: Nissin Electric Company Limited
• Original Assignee: Nissin Electric Company Limited
• Inventors: Ando, Yasunori, Onoda, Masatoshi
• Primary Examiner(s): Ahmad, Nasser
• Application Number:
  US08/959,521
• Time in Patent Office: 1,001 Days
• Field of Search: 118/723 VE, 118/723 FL, 156/345 P, 156/345 PC, 156/345 WH, 204/298.25, 204/298.28
• US Class Current: 118/723.0VE
• CPC Class Codes: H01L 21/67213 comprising at least one ion or electron beam chamber coating by ion implantation C23C; ion or electron beam tubes H01J37/00
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67754 horizontal transfer of a batch of workpieces

Abstract

A substrate processing apparatus includes a processing chamber and a vacuum spare chamber adjacent thereto through a vacuum valve. The processing chamber houses two holders for holding substrates on their surfaces on the same side. The processing chamber is provided with an ion source for irradiating the substrate on each holder having reached a processing position P with an ion beam so that it is subjected to ion implantation. The processing chamber is internally provided with a holder moving mechanism for performing the operation of moving the two holders in parallel independently from each other so that they traverse the processing position P, and moving the two holders in parallel simultaneously between the insides of the processing chamber and vacuum spare chamber through the vacuum valve. The vacuum spare chamber is internally provided with a substrate replacing mechanism for replacing processed substrates and non-processed substrates with each other collectively for the two holders in cooperation with the holder moving mechanism.

Claims

1. A substrate processing apparatus comprising:

a processing chamber evacuated to vacuum for processing substrates;

a plurality of holders arranged substantially in parallel to one another within said processing chamber, each for holding a substrate on a surface thereof on the same side;

processing means for successively processing the substrates held in the respective holders at a prescribed position in said processing chamber;

a vacuum spare chamber provided adjacent to said processing chamber;

a vacuum valve intervening between said vacuum spare chamber and said processing chamber to permit said plurality of holders holding the substrates to be passed collectively;

a holder moving mechanism for performing the operation of the reciprocating movement of said plurality of holders independently from one another within said processing chamber so that said plurality of holders traverse the processing position, and the reciprocating movement of said plurality of holders simultaneously between the insides of said processing chamber and vacuum spare chamber through said vacuum valve;

a substrate replacing mechanism provided within said vacuum spare chamber capable of holding non-processed substrates and processed substrates whose number is equal to that of said holders, and serving to replace the processed substrates and non-processed substrates with each other collectively for said plurality of holders moved into said vacuum spare chamber in cooperation with the holder moving mechanism; and

a rotary mechanism for rotating said holder moving mechanism so that said plurality of holders employ their profiles in an upright condition or a substantially horizontal condition within said processing chamber;

wherein said processing means serves to process the substrate held in each of said holders in the upright condition, said vacuum valve serves to pass the holders in the substantially horizontal condition, and said substrate replacing mechanism serves to make replacement of the substrates for the holders in the substantially horizontal condition.

2. A substrate processing apparatus according to claim 1, further comprising cooling means for cooling said holder.

3. A substrate processing apparatus according to claim 2, wherein said cooling means comprises a plurality of cooling mechanisms each constituting a reciprocating flow path of refrigerant by a plurality of rotary joints and conduits for coupling said rotary joints, and capable of passing the refrigerant through each holder via said flow path.

4. A substrate processing apparatus according to claim 1, wherein said processing means is an ion source for emitting an ion beam which is lengthy in a direction substantially orthogonal to the moving direction of said holders within said processing chamber and longer than the length of each of the substrates in said orthogonal direction.

5. A substrate processing method for processing substrates using a substrate processing apparatus comprising:

a processing chamber evacuated to vacuum for processing substrates;

a plurality of holders arranged substantially in parallel to one another within said processing chamber, each for holding a substrate on a surface thereof on the same side;

processing means for successively processing the substrates held in the respective holders at a prescribed position in said processing chamber;

a vacuum spare chamber provided adjacent to said processing chamber;

a vacuum valve intervening between said vacuum spare chamber and said processing chamber to permit said plurality of holders holding the substrates to be passed collectively;

a holder moving mechanism for performing the operation of the reciprocating movement of said plurality of holders independently from one another within said processing chamber so that said plurality of holders traverse the processing position, and the reciprocating movement of said plurality of holders simultaneously between the insides of said processing chamber and vacuum spare chamber through said vacuum valve;

a substrate replacing mechanism provided within said vacuum spare chamber capable of holding non-processed substrates and processed substrates whose number is equal to that of said holders, and serving to replace the processed substrates and non-processed substrates with each other collectively for said plurality of holders moved into said vacuum spare chamber in cooperation with the holder moving mechanism; and

a rotary mechanism for rotating said holder moving mechanism so that said plurality of holders employ their profiles in an upright condition or a substantially horizontal condition within said processing chamber;

wherein said processing means serves to process the substrate held in each of said holders in the upright condition, said vacuum valve serves to pass the holders in the substantially horizontal condition, and said substrate replacing mechanism serves to make replacement of the substrates for the holders in the substantially horizontal condition;

said method comprising the steps of;

reciprocating one of said plurality of holders each holding said substrate once over the processing position to process the substrate by said processing means; and

during said reciprocating step, resting the remaining holders each holding the substrate at a stand-by position where the substrate is not processed;

wherein said reciprocating step and resting step are subjected successively to said plurality of holders, and a series of said successive process to said plurality of holders are repeated at least one time.

6. A substrate processing apparatus according to claim 5, further comprising cooling means for cooling said holder.

7. A substrate processing apparatus according to claim 6, wherein said cooling means comprises a plurality of cooling mechanisms each constituting a reciprocating flow path of refrigerant by a plurality of rotary joints and conduits for coupling said rotary joints, and capable of passing the refrigerant through each holder via said flow path.

8. A substrate processing apparatus according to claim 5, wherein said processing means is an ion source for emitting an ion beam which is lengthy in a direction substantially orthogonal to the moving direction of said holders within said processing chamber and longer than the length of each of the substrates in said orthogonal direction.