Thermal monitoring system for semiconductor devices

• US 6,092,926 A
• Filed: 09/17/1998
• Issued: 07/25/2000
• Est. Priority Date: 09/17/1998
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Garcia, Ray, Tout, James J. Jr., Still, Stephen Eugene, Honeycutt, Kendall Anthony
• Primary Examiner(s): Bennett, G. Bradley
• Assistant Examiner(s): VERBITSKY, GAIL KAPLAN
• Application Number:
  US09/156,201
• Time in Patent Office: 677 Days
• Field of Search: 374/4, 374/5, 374/10, 374/15, 374/20, 374/43, 374/57, 374/110, 374/133, 374/165, 374/166, 374/141, 62/3.2, 62/3.3
• US Class Current: 374/141
• CPC Class Codes: G01K 7/42 Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature

Abstract

A method for monitoring the operating temperature of a semiconductor device. The method comprising the steps of: placing a thermal coupling material between the bottom of the semiconductor device and the top of a printed circuit board for inserting the device thereinto; inserting a sensor so to be at least partially covered by the thermal coupling material; and measuring the temperature from the sensor within a predetermined time interval. In accordance with another aspect of the invention, an apparatus is described to carry out the above process.

Claims

1. A method to monitor the temperature of a device comprising the steps of:

placing a thermal coupling material between the bottom of the device and the top of a circuit board for inserting the device thereinto;

placing a first sensor into a location such that at least thermal contact with thermal coupling material is made;

measuring the temperature from the sensor within a predetermined time interval;

comparing the temperature measured with the sensor to a first correlation factor for the device;

identifying the operating speed of the devices; and

comparing the temperature measured for this speed with the first correlation factor.

2. The method of claim 1, wherein the step of comparing the temperature includes identifying the packaging configuration of the device and comparing the temperature measured for this configuration with the first correlation factor.

3. The method of claim 1, wherein the step of comparing the temperature includes notifying an application program whether the temperature measured by the first sensor is outside of a predetermined temperature range.

4. The method of claim 1, further comprising the steps of:

mounting a second sensor in the vicinity of the device;

measuring the ambient air temperature surrounding the device; and

comparing the temperature measured with the second sensor with the temperature measured with the first sensor.

5. The method of claim 4, further comprising the step of:

comparing the temperature measured with the second sensor with a correlation factor for the device.

6. The method of claim 5, further comprising the step of:

notifying the application program whether the temperature measured with the second sensor is outside a predetermined range.

7. The method of claim 5, further comprising the steps of:

comparing the difference in temperature as measured by the first sensor and the temperature measured by the second sensor to a second correlation factor for the device.

8. The method of claim 7, further comprising the step of:

notifying the application if the difference in temperature is outside a predetermined range.

9. A system to monitor the temperature of a device comprising:

a circuit board for receiving a device;

a thermal coupling material sandwiched between the bottom of the device and the top of the circuit board for inserting the device thereinto;

a first sensor, whereby the first sensor is at least partially in thermal contact with the thermal coupling material;

means for measuring a temperature indication from the first sensor within a time interval;

a comparator for comparing the temperature measured with the first sensor to a first correlation factor for the device;

means for identifying the operating speed of the device; and

means for comparing the temperature measured for this operating speed with the first correlation factor.

10. The system of claim 9, wherein the comparator includes identifying the packaging configuration of the device and a means for comparing the temperature measured for this packaging configuration with the first correlation factor.

11. The system of claim 9, wherein the comparator includes a means for notifying an application program whether the temperature measured by the first sensor is outside of a predetermined temperature range.

12. The system of claim 9, further comprising:

a second sensor mounted in the vicinity of the device;

means for measuring the ambient air temperature surrounding the device; and

means for comparing the temperature measured with the second sensor with the temperature measured with the second sensor.

13. The system of claim 12, further comprising:

means for comparing the temperature measured with the second sensor to a second correlation factor for the device.

14. The system of claim 13, further comprising:

means for notifying the application if the temperature measured with the second sensor is outside a predetermined range.

15. The system of claim 13, further comprising:

means for comparing the difference in temperature as measured by the first sensor and the temperature measured by the second sensor to a second correlation factor for the device.

16. The system of claim 15, further comprising:

means for notifying the application if the difference in temperature is outside predetermined range.