Microfabrication process for enclosed microstructures

• US 6,093,330 A
• Filed: 06/02/1997
• Issued: 07/25/2000
• Est. Priority Date: 06/02/1997
• Status: Expired due to Term

• Current Assignee: Cornell Research Foundation Incorporated (Cornell University)
• Original Assignee: Cornell Research Foundation Incorporated (Cornell University)
• Inventors: Shaw, Kevin A., MacDonald, Noel C., Adams, Scott G., Chong, John M.
• Primary Examiner(s): Gulakowski, Randy
• Assistant Examiner(s): Alanko, Anita
• Application Number:
  US08/867,060
• Time in Patent Office: 1,149 Days
• Field of Search: 216/2, 216/11, 216/39, 216/41, 216/46, 216/51, 438/52
• US Class Current: 216/2
• CPC Class Codes: B81B 2203/0338 Channels
• CPC Class Codes: B81C 1/00047 Cavities
• CPC Class Codes: B81C 1/00071 Channels
• CPC Class Codes: B81C 1/0015 Cantilevers switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244
• CPC Class Codes: B81C 2201/053 Depositing a protective layers
• CPC Class Codes: B81C 2203/0136 Growing or depositing of a covering layer

Abstract

A single-mask process for fabricating enclosed, micron-scale subsurface cavities in a single crystal silicon substrate includes the steps of patterning the substrate to form vias, etching the cavities through the vias, and sealing the vias. Single cavities of any configuration may be produced, but a preferred embodiment includes closely spaced cavity pairs. The cavities may be separated by a thin membrane, or may be merged to form an enlarged merged cavity having an overhanging bar to which electrical leads may be connected. A three-mask process for fabricating enclosed cavities with electrical contacts and electrical connections is also disclosed.

Claims

1. A process for fabrication of subsurface structures comprising:

producing, on a surface of a substrate, a mask having a pattern defining the location and configuration of a subsurface cavity to be formed;

vertically etching said substrate through said mask pattern to produce in said substrate at least one via channel corresponding to said pattern;

isotropically etching said substrate through said via channel to produce within said substrate and below the surface thereof said subsurface cavity; and

etching said substrate around said cavity and said via channel to produce a structure which is at least partially released from said substrate and which contains said cavity.

2. The process of claim 1, wherein said vertical etching of said substrate produces a via channel having substantially vertical sidewalls leading to said cavity.

3. The process of claim 2, further including depositing a protective layer on said via channel sidewalls prior to isotropically etching said substrate.

4. The process of claim 1, further including controlling said isotropic substrate etch to regulate the dimensions of said subsurface cavity.

5. The process of claim 1, wherein the step of producing said mask pattern includes defining the location and configuration of at least two closely-spaced cavities, and wherein etching said substrate through said pattern mask produces corresponding closely-spaced via channels in said surface.

6. The process of claim 5, wherein isotropically etching said substrate includes etching subsurface channels corresponding to each of said via cavities.

7. The process of claim 6, further including depositing a protective layer in said via channels prior to said isotropic etch.

8. The process of claim 6, further including controlling the duration of said isotropic substrate etching of said subsurface cavities to produce a membrane wall between adjacent subsurface cavities.

9. The process of claim 6, further including controlling the duration of said isotropic substrate etch to produce cavities having varying diameters along their lengths.

10. The process of claim 6, further including controlling the duration of said isotropic substrate etch to cause said subsurface cavities to merge to form a single subsurface merged cavity.

11. The process of claim 10, further including defining in said mask pattern the number and spacing of said cavities to thereby define the dimensions of said subsurface merged cavity upon said merger.

12. The process of claim 11, wherein said cavities are elongated, and further including varying dimensions of said merged cavity along the length thereof by varying the number and spacing of said elongated cavities.

13. The process of claim 10, further including forming from said substrate between said vias at least one overhanging bar above said single subsurface merged cavity, said bar being separated from said substrate.

14. The process of claim 13, further including forming an electrical contact on at least one said overhanging bar.

15. The process of claim 13, further including forming dielectric support bridges for said at least one overhanging bar, said bridges extending between said overhanging bar and said substrate.

16. The process of claim 15, further including:

forming at least one electrical contact on said at least one overhanging bar; and

fabricating an electrical connector between said contact and a second contact.

17. The process of claim 6, further including forming electrical contacts in communication with each of said subsurface cavities.

18. The process of claim 6, further including:

controlling the duration of said isotropic substrate etch to produce a membrane wall between adjacent cavities; and

forming an electrical contact on said substrate in contact with said membrane.

19. The process of claim 1, further including forming a dielectric layer on an inner surface of said cavity prior to sealing said via channel.

20. The process of claim 1, further including shaping said cavity by an anisotropic etch through said via channel prior to sealing.

21. The process of claim 1, wherein etching around said cavity includes substantially completely releasing said structure to produce a cantilevered beam containing said cavity.

22. The process of claim 1, wherein etching said substrate around said cavity produces a structure having an upper thin wall portion enclosing said cavity and a lower portion connected to said substrate.

23. The process of claim 1, wherein etching said substrate around said cavity produces a released beam containing said cavity.

24. The process of claim 22, wherein etching said substrate around said cavity exposes a cavity wall surrounding said cavity.

25. The process of claim 1, further including sealing said via channel to close said cavity.

26. The process of claim 25, wherein isotropically etching said substrate includes etching intersecting subsurface cavities, one said cavity having a dividing membrane.

27. A process for the fabrication of subsurface structures, comprising:

forming in the surface of a substrate an elongated via channel having a width sufficiently large to permit isotropic etching of the substrate through the via channel;

isotropically etching the substrate below the via channel to produce an elongated cavity within the substrate; and

at least partially releasing an elongated beam within said substrate and containing said elongated cavity.

28. The process of claim 27, wherein at least partially releasing an elongated beam includes etching said substrate around said cavity to produce an exposed wall for at least a part of said cavity.

29. The process of claim 27, wherein at least partially releasing an elongated beam includes etching said substrate to produce a cantilevered beam containing said elongated cavity.

30. The process of claim 27, wherein at least partially releasing an elongated beam includes:

thermally oxidizing said cavity to provide an oxide wall surrounding the cavity; and

etching said substrate to expose at least a portion of said oxide wall.

31. The process of claim 30, wherein etching said substrate includes completely releasing a region of said beam to expose said oxide wall around said cavity.