Laminated substrates and data input unit using the same

• US 6,093,477 A
• Filed: 08/31/1998
• Issued: 07/25/2000
• Est. Priority Date: 09/02/1997
• Status: Expired due to Term

• Current Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Original Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Inventors: Hagiya, Ryuichi, Matsufusa, Hideto
• Primary Examiner(s): Speer, Timothy M.
• Assistant Examiner(s): YOUNG, BRYANT L
• Application Number:
  US09/143,550
• Time in Patent Office: 694 Days
• Field of Search: 428/209, 428/131, 428/137, 428/901, 345/173, 178/18.03
• US Class Current: 428/209
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: H05K 1/0289 having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10666 Plated through-hole for surface mounting on PCB
• CPC Class Codes: H05K 2201/10977 Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 2203/0455 PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
• CPC Class Codes: H05K 2203/1178 Means for venting or for letting gases escape
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/363 by soldering
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24273 including aperture
• CPC Class Codes: Y10T 428/24322 Composite web or sheet
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

A resist film and a bonding layer are disposed between a sensor substrate and a PCB, and a cutout is formed in the resist film and the bonding layer at the part where the through hole of the sensor substrate communicates with the through hole of a PCB to form an air vent communicating with the outside of the edge part of the laminated substrates. When the conductive material is filled in the through hole from the obverse surface of the sensor substrate, the air in the through hole is released from the air vent to thereby reliably fill the conductive material in the through hole, which can reliably bring the electrode and the land 28 into conduction.

Claims

1. Laminated substrates comprising:

a first substrate having electrodes and through holes;

a second substrate having a wiring pattern; and

an insulating layer,

wherein the first substrate and the second substrate are laminated with the insulating layer sandwiched between them;

wherein a conductive material is filled in the through holes of the first substrate to bring the electrodes of the first substrate and the wiring pattern of the second substrate into conduction via the conductive material; and

wherein the insulating layer and at least one of the substrates have air releasing passages for making the through holes communicate with a space outside the edge of the substrate.

2. Laminated substrates according to claim 1, wherein the through holes communicating with the through holes of the first substrate and with the air releasing passages are formed in the second substrate and the conductive material filled in the through holes is brought into conduction to the wiring pattern formed on the reverse surface of the second substrate facing the side opposite to the first substrate.

3. Laminated substrates according to claim 1 or claim 2, wherein the insulating layer in which the air releasing passages are formed is a bonding layer for bonding the first substrate to the second substrate.

4. Laminated substrates according to claim 1 or claim 2, wherein the insulating layer in which the air releasing passages are formed is a resist layer for covering the surface of the first substrate or the second substrate.

5. Laminated substrates according to claim 1 or claim 2, wherein the insulating layer comprises an insulating sheet and a bonding layer and wherein the air releasing passages are formed in at least one of them.

6. A data input unit having the laminated substrates according to claim 1 or claim 2, wherein the X electrodes and the Y electrodes which are insulated from each other are formed on the first substrate to detect a change in electrostatic capacity between the X electrodes and the Y electrodes.

7. A data input unit according to claim 6, wherein a face sheet is laminated on the surface of the first substrate via an insulating body and wherein a ground pattern formed on the edge part of the first substrate is oozed from the insulating body at the positions where it does not overlap the air releasing passages.