Apparatus for and methods of implanting desired chemical species in semiconductor substrates

• US 6,093,625 A
• Filed: 05/20/1998
• Issued: 07/25/2000
• Est. Priority Date: 05/20/1997
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Wagner, Dennis W., Castle, Matthew D. Scotney, Wauk, Michael T. II, Adibi, Babak
• Primary Examiner(s): DANG, THI D
• Application Number:
  US09/081,517
• Time in Patent Office: 797 Days
• Field of Search: 250/492.2, 250/492.21, 250/441.11, 118/723 R, 156/345, 134/1.1, 438/514, 438/515
• US Class Current: 438/514
• CPC Class Codes: H01J 2237/006 Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece, H01J37/3244 takes precedence; environmental cells for electron microscopes H01J2237/2003; microscopes with environmental specimen chamber H01J2237/2608
• CPC Class Codes: H01J 2237/022 Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
• CPC Class Codes: H01J 37/3171 for ion implantation plasma immersion ion implantation H01J37/32412

Abstract

An apparatus and method for implanting a desired chemical species in a semiconductor substrate. The apparatus comprises a target chamber, a holder to hold a substrate in the target chamber for implantation, a pump to pump the target chamber down to a desired pressure, a pressure lock to enable a substrate to be passed into the target chamber for loading on the holder while the target chamber is at sub-atmospheric pressure, an ion beam generator for generating and directing a beam of ions containing said desired species at a surface of a substrate on said holder, and a reactive gas supply to feed a reactive gas into the target chamber while the chamber is maintained by the pump at the desired pressure, to provide a desired partial pressure of the reactive gas in the target chamber to reactive with and volatilise unwanted contaminants on surfaces in the target chamber.

Claims

1. Apparatus for implanting a desired chemical species in a semiconductor substrate comprising

a target chamber,

a holder to hold a substrate in the target chamber for implantation,

a pump to pump the target chamber down to a desired pressure,

a pressure lock to enable a substrate to be passed into the target chamber for loading on the holder while the target chamber is at sub-atmospheric pressure,

an ion beam generator for generating and directing a beam of ions containing said desired species at a surface of a substrate on said holder,

and a reactive gas supply to feed a reactive gas into the target chamber while the chamber is maintained by the pump at the desired pressure, to provide a desired partial pressure of the reactive gas in the target chamber to react with and volatilise unwanted contaminants on surfaces in the target chamber.

2. Apparatus as claimed in claim 1, wherein the reactive gas supply includes a source of said gas, a conduit for said gas from the source to the target chamber, and a regulator to regulate the quantity of said gas supplied by said conduit to the target chamber.

3. Apparatus as claimed in claim 2, wherein the reactive gas supply further includes a pressure controller to control the regulator to keep the partial pressure at a desired value.

4. Apparatus as claimed in claim 3, including an implant process controller incorporating said pressure controller and arranged to control the partial pressure of the reactive gas to follow a desired profile.

5. Apparatus as claimed in claim 4, wherein said implant process controller is arranged to provide a partial pressure of the reactive gas during implantation of the desired species into a substrate.

6. Apparatus as claimed in claim 4, wherein said implant process controller is arranged to provide a partial pressure of the reactive gas in the target chamber after implantation with a first desired species and before implantation with a second desired species, to reduce contamination by said first species during implantation with said second species.

7. Apparatus as claimed in claim 1, wherein the ion beam generator provides a beam of ions comprising any one or a combination of AS⁺, P⁺, BF₂⁺, Sb⁺, B⁺, Ge⁺, Si⁺.

8. Apparatus as claimed in claim 1, wherein the reactive gas supply provides a supply of gas comprising at least one of O₂, O₃, H₂, N₂, NH₃, CH₄, Cl, SF₆, CO₂, and air or a reactive composition thereof.

9. A method of implanting a desired chemical species in a semiconductor substrate comprising

holding said substrate in an evacuated target chamber,

directing a beam of ions containing said desired species at a surface of said substrate,

and providing a predetermined partial pressure of a reactive gas in said target chamber.

10. A method as claimed in claim 9 wherein the partial pressure of reactive gas is maintained at at least 3×

10^-6 Torr during the implantation.

11. A method as claimed in claim 9, wherein the reactive gas is at least one of O₂, O₃, H₂, N₂, NH₃, CH₄, Cl, SF₆, CO₂, and air or a reactive composition thereof.

12. A method of implanting a desired chemical species in a semiconductor substrate comprising

pumping down a target chamber to a desired pressure,

introducing a predetermined partial pressure of a reactive gas into said target chamber,

loading a substrate to be implanted into the target chamber through a pressure lock,

and directing a beam of ions containing said desired species at a surface of said substrate.

13. A method as claimed in claim 12, wherein the substrate to be implanted is loaded after the reactive gas is introduced.

14. A method as claimed in claim 13 comprising an additional step of directing said beam of ions at a dummy target loaded in said target chamber after introducing said reactive gas and before loading said substrate to be implanted.

15. A method as claimed in claim 12, wherein said desired species to be implanted is arsenic.

16. A method as claimed in claim 12, wherein the reactive gas is introduced after the target chamber is used for implanting a different chemical species, to reduce contamination by said different species during implantation of said desired species.

17. A method as claimed in claim 16, wherein said different species is phosphorus.

18. A method as claimed in claim 12, wherein the reactive gas comprises at least one of O₂, O₃, H₂, N₂, NH₃, CH₄, Cl, SF₆, CO₂, and air or a reactive composition thereof.

19. A method as claimed in claim 12, wherein said partial pressure of reactive gas in the target chamber is at least 3×

10^-6 Torr, up to the start of implanting said desired species in said substrate.