Plasma etching methods

• US 6,093,655 A
• Filed: 02/12/1998
• Issued: 07/25/2000
• Est. Priority Date: 02/12/1998
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Stocks, Richard L., Donohoe, Kevin G.
• Primary Examiner(s): Nuzzolillo, Maria
• Assistant Examiner(s): Ruthkosky, Mark
• Application Number:
  US09/022,813
• Time in Patent Office: 894 Days
• Field of Search: 438/712, 438/717, 438/725, 438/743, 216/67, 216/79, 134/1.2, 134/1.3
• US Class Current: 438/717
• CPC Class Codes: H01J 37/32871 Means for trapping or directing unwanted particles
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/31138 by dry-etching

Abstract

A plasma etching method includes forming polymer material over at least some internal surfaces of a plasma etch chamber and forming polymer material over at least some surfaces of a semiconductor wafer received within the plasma etch chamber. Substantially all polymer material is plasma etched from the chamber internal surfaces while at least some polymer material remains on the wafer. In another aspect, a semiconductor wafer is positioned on a wafer receiver within a plasma etch chamber. A photoresist layer has previously been formed thereon and has openings formed therethrough. First plasma etching is conducted through openings formed in the photoresist layer with a gas comprising carbon and a halogen to form openings in material on the wafer. A first polymer comprising carbon and the halogen forms over at least some internal surfaces of the plasma etch chamber during the first plasma etching. A second polymer is formed over the wafer and relative to the material openings to mask said material within the openings. After forming the first and second polymers and with the wafer in the chamber, substantially all the first polymer from chamber internal surfaces is plasma etched while the second polymer masks the material within the openings.

Claims

1. A plasma etching method comprising:

forming polymer material over at least some internal surfaces of a plasma etch chamber and forming polymer material over at least some surfaces of a semiconductor wafer received within the plasma etch chamber; and

plasma etching substantially all polymer material from the chamber internal surfaces while at least some polymer material remains on the wafer.

2. The plasma etching method of claim 1 wherein all polymer material formed over the internal surfaces has an average first thickness and all polymer material formed over the wafer has an average second thickness, the average second thickness being greater than the average first thickness.

3. The plasma etching method of claim 1 wherein all polymer material formed over the internal surfaces has an average first thickness and all polymer material formed over the wafer has an average second thickness, the average second thickness being substantially the same as the average first thickness.

4. A plasma etching method comprising:

forming a first polymer over at least some internal surfaces of a plasma etch chamber and forming a second polymer over at least some surfaces of a semiconductor wafer received within the plasma etch chamber; and

after forming the first and second polymers and with the wafer in the chamber, plasma etching substantially all the first polymer from chamber internal surfaces while at least some first or second polymer remains on the wafer.

5. The plasma etching method of claim 4 wherein at least one of the first and second polymers comprises carbon and a halogen.

6. The plasma etching method of claim 4 wherein both of the first and second polymers comprises carbon and a halogen.

7. The plasma etching method of claim 4 wherein both polymers comprise fluorine.

8. The plasma etching method of claim 4 wherein the first polymer is formed with a fluorine comprising feed gas and the second polymer is not formed with a fluorine comprising feed gas.

9. The plasma etching method of claim 4 wherein all polymer material formed over the internal surfaces has an average first thickness and all polymer material formed over the wafer has an average second thickness, the average second thickness being greater than or equal to the average first thickness.

10. The plasma etching method of claim 4 wherein all polymer material formed over the internal surfaces has an average first thickness and all polymer material formed over the wafer has an average second thickness, the average second thickness being substantially the same as the average first thickness.