Overload protected solid state varistors

• US 6,094,128 A
• Filed: 08/11/1998
• Issued: 07/25/2000
• Est. Priority Date: 08/11/1998
• Status: Expired due to Term

• Current Assignee: Maida Development Company
• Original Assignee: Maida Development Company
• Inventors: Boyd, Ronald D., Stockum, Robert W., Bennett, John C.
• Primary Examiner(s): Donovan, Lincoln
• Assistant Examiner(s): Lee, Richard K.
• Application Number:
  US09/132,492
• Time in Patent Office: 714 Days
• Field of Search: 338/21, 338/20, 338/67, 337/4, 337/5, 337/142, 337/290, 337/183, 337/184
• US Class Current: 338/21
• CPC Class Codes: H01C 7/126 Means for protecting against excessive pressure or for disconnecting in case of failure

Abstract

A fail-safe varistor includes either a fail-short or a fail-open device. Both devices include a fusible, electrically conductive material that melts before the varistor fails due to overvoltage. In the fail-open device, the fusible, electrically conductive material joins separated portions of the leads. The material also may join at least one of the leads directly to a ceramic disk of the varistor. Upon reaching the predetermined temperature, the varistor melts causing a circuit including the varistor to open. In the fail-short device, the material melts creating a short between the leads. This short causes a fuse or a breaker to open the circuit.

Claims

1. A solid state varistor having thermal overload protection, comprising:

a metal oxide varistor; and

leads connected to the semiconductor device, at least one of the leads having a fusible link between separated portions of the at least one lead, the fusible link being meltable when heated to a predetermined temperature creating an open circuit between the separated portions, and

a heat sensitive elastic member formed around the fusible link to further separate the separated portions as the fusible link melts.

2. The solid state varistor as in claim 1, wherein the separated portions are aligned.

3. The solid state varistor as in claim 2, wherein the separated portions are perpendicular to a portion of the at least one lead connecting with the varistor.

4. The solid state varistor of claim 1, wherein the fusible link circumscribes a gap between the separated portions.

5. The solid state varistor as in claim 1, including a heat sensitive elastic member around the fusible link to further separate the separated portions as the fusible link melts.

6. The solid state varistor of claim 5, further comprising the leads being bent over such that the heat shrinkable elastic member contact an outer surface of the varistor.

7. The solid state varistor of claim 5, wherein the heat sensitive elastic member changes shape in response to heat generated by the semiconductor device.

8. The solid state varistor of claim 7, wherein the heat sensitive elastic member comprises a heat shrinkable polymer tube.

9. The solid state varistor of claim 7, wherein the heat sensitive elastic member comprises a shape memory metal alloy.

10. A solid state varistor having thermal overload protection, comprising:

a metal oxide varistor having first and second surfaces;

a first lead electrically connected to the first surface;

a fusible link electrically connected to said second surface; and

a second lead electrically connected to said second surface through said fusible link, said fusible link being enclosed in a containment material such that as said fusible link melts within said containment material, an open circuit is formed between said second lead and said second surface.

11. A solid state varistor having thermal overload protection, comprising:

a metal oxide varistor; and

leads connected to the metal oxide varistor, at least one of the leads having a proximal portion and a distal portion, the proximal portion having a proximal straight portion and a proximal bend portion, the distal portion having a distal straight portion and a distal bend portion, the proximal bend portion and the distal bend portion being electrically connected by a fusible link, the fusible link being meltable as heated to a predetermined temperature creating an open circuit between the proximal bend portion and the distal bend portion.