Integrated circuit assembly and method of assembly

• US 6,094,138 A
• Filed: 09/11/1998
• Issued: 07/25/2000
• Est. Priority Date: 02/27/1998
• Status: Expired due to Fees

• Current Assignee: Motorola Solutions, Inc.
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Eberhardt, Noel H., Vega, Victor Allen
• Primary Examiner(s): SWANN III, GLEN R
• Application Number:
  US09/152,201
• Time in Patent Office: 683 Days
• Field of Search: 340/572.1, 340/825.34, 340/825.54, 29/25.01, 29/592.1, 29/601, 29/DIG. 1
• US Class Current: 340/572.1
• CPC Class Codes: G06K 19/027 the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items markings attached to laundry items in general D06F93/00
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 7/0008 General problems related to the reading of electronic memory record carriers, independent of its reading method, e.g. power transfer
• CPC Class Codes: Y10S 29/001 Method or apparatus involving adhesive
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

An integrated circuit assembly (12) such as used on a radio frequency identification tag, or other device, includes an integrated circuit (14) coupled to first and second printed conductors (16a) and (16b), such as tag electrodes, on a flexible substrate (18). The printed conductors (16a and 16b) may be conductors in the form of printed ink electrostatic antennas. The integrated circuit (14), is disposed in a generally co-planar arrangement with the flexible substrate (18). That is, the integrated circuit (14) is positioned in-line with the flexible substrate (18).

Claims

1. An integrated circuit (IC) assembly comprising:

a flexible substrate, having a thickness that defines a plane, supporting at least one conductor;

an integrated circuit disposed in a coplanar arrangement with the flexible substrate, wherein the integrated circuit is substantially within the plane; and

isotropic electrically conductive material coupled between the conductor and the integrated circuit to form an electrical connection therebetween.

2. The IC assembly of claim 1 wherein the flexible substrate is made from at least one of:

acetate, polyester, polyimide, PVC, woven fabric and polycarbonate.

3. The IC assembly of claim 1 wherein the assembly is a radio frequency identification tag.

4. The IC assembly of claim 3 wherein the at least one conductor is a printed antenna formed of conductive ink on the substrate and the integrated circuit includes an electrostatic receiving circuit operatively coupled to the printed antenna.

5. The IC assembly of claim 1 wherein the at least one conductor is a printed antenna and the substrate is paper.

6. The IC assembly of claim 1 wherein the isotropic electrically conductive material includes pressure sensitive conductive adhesive.

7. The IC assembly of claim 1 including nonconductive tape attached to the isotropic conductive material.

8. An integrated circuit (IC) assembly comprising:

a flexible substrate, supporting at least one conductor, wherein the flexible substrate includes paper;

an integrated circuit disposed in a coplanar arrangement with the flexible substrate; and

isotropic electrically conductive material coupled between the conductor and the integrated circuit to form an electrical connection therebetween.

9. An integrated circuit (IC) assembly comprising:

a flexible substrate supporting at least one conductor;

an integrated circuit disposed in a coplanar arrangement with the flexible substrate, and

isotropic electrically conductive material coupled between the conductor and the integrated circuit to form an electrical connection therebetween, wherein the isotropic electrically conductive material includes pressure sensitive conductive tape.

10. The IC assembly of claim 9 wherein the pressure sensitive conductive tape includes nonconductive portions to facilitate selective non-conduction.

11. An integrated circuit (IC) assembly comprising:

a flexible substrate supporting at least one conductor;

an integrated circuit disposed in a coplanar arrangement with the flexible substrate, and

isotropic electrically conductive material coupled between the conductor and the integrated circuit to form an electrical connection therebetween, wherein non-conductive tape is attached to the flexible substrate and to a surface of the coplanar integrated circuit.

12. An integrated circuit (IC) assembly comprising:

a flexible substrate supporting at least two conductors formed from conductive ink;

an integrated circuit disposed in a coplanar arrangement with the flexible substrate; and

isotropic electrically conductive material coupled between the at least two conductors and the integrated circuit to form an electrical connection therebetween such that the two conductors are electrically isolated from one another and each conductor is electrically coupled with the integrated circuit.

13. The IC assembly of claim 12 wherein the IC assembly is a radio frequency identification tag.

14. The IC assembly of claim 12 wherein the at least two conductors are printed antennas and the substrate is paper.

15. The IC assembly of claim 14 wherein the at least two conductors are printed antennas formed of conductive ink on the substrate and the integrated circuit includes an electrostatic receiving circuit operatively coupled to the printed antennas.

16. The IC assembly of claim 12 wherein the isotropic electrically conductive material includes pressure sensitive conductive adhesive.

17. The IC assembly of claim 12 wherein the isotropic electrically conductive material includes pressure sensitive conductive tape.

18. A method of making an IC assembly comprising the steps of:

locating an integrated circuit in a co-planar manner with a substrate that supports at least one conductor, wherein the substrate has a thickness that defines a plane and the integrated circuit is substantially within the plane; and

applying an isotropic electrically conductive material between the integrated circuit and the at least one conductor to form an electrical connection therebetween.

19. The method of claim 18 including the step of applying a nonconductive layer of material to the isotropic electrically conductive material.

20. The method of claim 18 including the step of applying a nonconductive layer of material to the substrate and to a surface of the integrated circuit located in a co-planar manner with the substrate.