Dual channel microwave transmit/receive module for an active aperture of a radar system
First Claim
1. A transmit/receive (T/R) module for an active aperture of a radar system, comprising:
- a substrate;
an RF interface and a DC/logic interface located on the substrate;
a plurality of cavities formed in the substrate;
an outer heat sink plate located on the substrate and covering at least one of the cavities;
at least one T/R channel circuit implemented on said substrate and including a plurality of circuit components;
wherein a selected number of said plurality of circuit components are located in said cavities adjacent the heat sink plate.
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Accused Products
Abstract
Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The MMICs which generate substantially all of the heat are located in multi-level cavities formed in the substrate and are bonded directly to a generally flat a heat sink plate which is secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate. DC power conditioning is also provided by a capacitive bank type of energy storage subassembly externally attached to the rear of the module package for supplying supplementary power to the module during peak power operation. The T/R module is one module of an array of like T/R modules coupled to an active aperture of a radar system.
32 Citations
50 Claims
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1. A transmit/receive (T/R) module for an active aperture of a radar system, comprising:
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a substrate; an RF interface and a DC/logic interface located on the substrate; a plurality of cavities formed in the substrate; an outer heat sink plate located on the substrate and covering at least one of the cavities; at least one T/R channel circuit implemented on said substrate and including a plurality of circuit components; wherein a selected number of said plurality of circuit components are located in said cavities adjacent the heat sink plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A package for a transmit/receive (T/R) module including two discrete T/R channels having active circuit components, comprising:
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a common substrate for the two T/R channels and being comprised of a plurality of laminated ceramic layers, each having a pattern of electrical vias therethrough and a pattern of metallization at least on one surface thereof for providing three dimensional routing of signals and power between the layers of the substrate and further including two like sets of multilevel cavities formed therein, one set for each said T/R channel, arranged side by side and in which one or more active circuit components are respectively located; a ring frame member located on top of said substrate, bordering a major portion of the outer periphery of the substrate as well as encircling the two sets of cavities; a cover member located on said ring frame, said cover member enclosing and mutually isolating the cavities of said two sets of cavities from each other; a heat sink plate on an underside surface of the substrate and also covering an area including the two sets of cavities, said active circuit components being located adjacent said heat sink plate, said heat sink plate providing a thermal interface to an external heat exchanger. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A dual channel transmit/receive (T/R) module including two T/R channels having active circuit components and exhibiting a relatively thin profile, comprising:
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a common substrate for both of the T/R channels, including a plurality of laminated ceramic layers, each having a defined pattern of electrical vias therethrough and a defined pattern of metallization at least on one surface thereof, for providing three dimensional routing of signals and power between the layers of the substrate and further including two like sets of multilevel cavities formed therein, one set for each said T/R channel, arranged side by side and in which one or more of the active circuit components are respectively located; a ring frame member located on top of said substrate, said ring frame member bordering a major portion of the outer periphery of the substrate as well as encircling the two sets of cavities; a cover member located on said ring frame member and covering an area including the two sets of cavities; a heat sink plate located on the underside surface of the substrate and also covering an area including the two sets of cavities, said active circuit components being located adjacent said heat sink plate which thereby provides a thermal interface to an external heat exchanger; a unitary RF connector assembly including a plurality of discrete signal connectors mounted on the substrate for independently coupling RF signals to and from said T/R channels; a power and logic interface mounted on the substrate for coupling DC power and operational control signals to said active circuit components; and an energy storage circuit coupled to the substrate for supplying supplementary DC power to said active circuit components located on the substrate. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50)
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Specification