Package with integrated thermoelectric module for cooling of integrated circuits

• US 6,094,919 A
• Filed: 01/04/1999
• Issued: 08/01/2000
• Est. Priority Date: 01/04/1999
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Bhatia, Rakesh
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): JIANG, CHEN WEN
• Application Number:
  US09/225,252
• Time in Patent Office: 575 Days
• Field of Search: 62/3.7, 62/259.2, 62/3.2, 165/104.21
• US Class Current: 62/3.7
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/207 Diameter ranges

Abstract

A package for an integrated circuit (IC) comprises a lid attached to a base, with the IC being disposed in a space or cavity between the lid and the base. A thermoelectric module (TEM) having first and second primary surfaces is incorporated into a section of the lid. The first primary surface is thermally coupled to the IC such that application of power to the TEM causes heat to be transferred away from the IC.

Claims

1. A package for an integrated circuit (IC) comprising:

a base to support the IC;

a lid attached to the base, the IC being disposed in a space between the lid and the base;

a thermoelectric module (TEM) incorporated into a section of the lid, the TEM having first and second primary surfaces with the first primary surface being thermally coupled to the IC such that application of power to the TEM causes heat generated by the IC to be transferred from the first primary surface to the second primary surface, thereby cooling the IC.

2. The package of claim 1 wherein the TEM comprises a plurality of p-n junctions coupled in series.

3. The package of claim 2 further comprising a heat sink mounted in thermal contact with the second primary surface.

4. The package of claim 2 wherein the lid comprises a body composed of a rigid material, with the section that incorporates the TEM including a ceramic layer insulating the p-n junctions from the body.

5. The package of claim 4 wherein the rigid material comprises a metal.

6. The package of claim 4 wherein the rigid material comprises a plastic.

7. The package of claim 4 wherein the section comprises an opening in the body.

8. The package of claim 1 wherein the base comprises:

a substrate on which the IC is mounted; and

a bottom cover plate, the substrate being mounted on the bottom cover plate.

9. An integrated circuit (IC) package assembly comprising:

a substrate;

a plurality of ICs mounted on the substrate;

a lid having properties of thermal conductivity, the lid being attached to the substrate, with one or more of the ICs being in thermal contact with the lid;

a thermoelectric module (TEM) incorporated into a section of the lid, the TEM having a primary surface, application of power to the TEM causing heat generated by the one or more ICs to be transferred away from the primary surface;

a heat exchanger thermally coupled to the TEM to dissipate the heat generated by the one or more ICs.

10. The IC package assembly of claim 9 wherein the section is located a remote distance from the one or more ICs.

11. The IC package assembly of claim 10 wherein the lid comprises a body composed of a rigid material, with the section that incorporates the TEM including a plurality of p-n junctions encased in a ceramic layer.

12. The IC package assembly of claim 11 wherein the rigid material comprises a metal.

13. The IC package assembly of claim 10 wherein the section comprises an opening in the body.

14. The IC package assembly of claim 9 further comprising a heat pipe attached to the lid and TEM, the heat pipe transferring the heat generated by the one or more ICs from the lid to the TEM.

15. The IC package assembly of claim 9 wherein the substrate comprises a circuit board.

16. The IC package assembly of claim 15 wherein the one or more ICs comprise first and second ICs mounted on a top side of the circuit board, and a third IC mounted on a bottom side of the circuit board.

17. A package assembly for a computer system comprising:

first and second circuit boards, each circuit board having one or more ICs mounted thereon, and a lid mounted in thermal contact with the one or more ICs;

a heat exchanger that includes a heat sink and a thermoelectric module (TEM), application of power to the TEM causing heat generated by the one or more ICs to be dissipated by the heat sink; and

first and second heat transfer elements for respectively transferring heat generated by the one or more ICs from the first and second circuit boards to the heat exchanger.

18. The package assembly of claim 17 wherein the first and second heat transfer elements each comprise a heat pipe coupled between the lid and the TEM.

19. The package assembly of claim 18 wherein the lid is metallic.

20. The package assembly of claim 17 wherein the heat exchanger is located a remote distance from the one or more ICs.

21. Apparatus for cooling electronic devices mounted on a circuit board comprising:

a lid having properties of thermal conductivity, the lid being attached to the substrate with one or more of the electronic devices being in thermal contact with the lid; and

at least one thermoelectric module (TEM) incorporated into the lid, the at least one TEM having a primary surface, application of power to the at least one TEM causing heat generated by the one or more electronic devices to be transferred away from the primary surface.

22. The apparatus of claim 21 further comprising:

a heat exchanger thermally coupled to the at least one TEM to dissipate the heat generated by the one or more electronic devices.

23. The apparatus of claim 21 wherein the lid comprises a metal.

24. The apparatus of claim 21 wherein the at least one TEM includes a first TEM is disposed a remote distance from the one or more electronic devices.

25. The apparatus of claim 21 wherein the lid comprises a body composed of a rigid material with the at least one TEM comprising a plurality of p-n junctions.

26. The apparatus of claim 25 wherein the at least one TEM is encased in a ceramic layer.