Rinse/dry apparatus including a chamber with a moveable side wall

• US 6,095,167 A
• Filed: 07/21/1999
• Issued: 08/01/2000
• Est. Priority Date: 03/05/1998
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Florez, Barry K.
• Primary Examiner(s): Stinson, Frankie L.
• Assistant Examiner(s): Carrillo, S.
• Application Number:
  US09/358,250
• Time in Patent Office: 377 Days
• Field of Search: 134/2, 134/3, 134/21, 134/25.4, 134/25.5, 134/26, 134/31, 134/183, 134/902, 134/95.2, 34/77, 34/78, 137/574, 137/395, 137/426
• US Class Current: 134/183
• CPC Class Codes: B08B 3/00 Cleaning by methods involving the use or presence of liquid or steam B08B9/00 takes precedence
• CPC Class Codes: B08B 3/04 Cleaning involving contact with liquid
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: Y10S 134/902 Semiconductor wafer
• CPC Class Codes: Y10T 137/7313 Control of outflow from tank
• CPC Class Codes: Y10T 137/7413 Level adjustment or selection means
• CPC Class Codes: Y10T 137/86212 Plural compartments formed by baffles

Abstract

An apparatus for rinsing and drying semiconductor wafers. The apparatus includes side walls, end walls and a base. One embodiment of the apparatus includes a rigid side and end walls. In another embodiment of the apparatus, at least a portion of the side wall is collapsible. In yet another embodiment of the apparatus, at least a portion of the wall has a tambour configuration, facilitating bending or rolling of the wall beneath the base. The apparatus includes an assembly for injecting a rinse liquid into the chamber. The side walls, end walls, and base form a chamber configured to receive at least one semiconductor wafer. Rinse liquid can be directed into the chamber, over each semiconductor wafer therein to rinse each semiconductor wafer. At least a portion of a side wall can be lowered substantially vertically to permit rinse liquid to flow out of the chamber. The apparatus also includes an assembly for injecting a drying fluid into the chamber.

Claims

1. An apparatus for rinsing and drying semiconductor wafers, comprising:

a chamber having a base, substantially opposed side walls, and substantially opposed end walls and having at least one semiconductor wafer disposed therein, said substantially opposed side walls and said substantially opposed end walls extending upwardly from said base and each of said substantially opposed side walls positioned adjacent each of said substantially opposed end walls;

an actuator communicating with at least one of said substantially opposed side walls for moving at least one of said upwardly extending side walls vertically downward relative to said base such that said upwardly extending side wall is positioned below said at least one semiconductor wafer disposed on said base of said chamber;

a rinse liquid injection assembly positioned over said chamber for directing rinse liquid on said at least one semiconductor wafer in said chamber; and

a drying fluid injection assembly positioned over said chamber or directing drying fluid on said at least one semiconductor wafer in said chamber.

2. The apparatus of claim 1, wherein one of said upwardly extending side walls is rigid.

3. The apparatus of claim 1, wherein one of said upwardly extending side walls has a tambour configuration.

4. The apparatus of claim 1, wherein said actuator comprises a pneumatic actuator.

5. The apparatus of claim 1, wherein said actuator comprises a hydraulic actuator.

6. The apparatus of claim 1, wherein said actuator comprises a stepper motor.

7. The apparatus of claim 1, wherein said actuator comprises a screw drive.

8. The apparatus of claim 1, wherein one of said up side walls comprises a plurality of hingedly interconnected slats.

9. The apparatus of claim 1, wherein one of said upwardly extending side walls comprises a plurality of slats adhered to a sheet.

10. The apparatus of claim 1, wherein one of said upwardly extending side walls has an accordion configuration.

11. The apparatus of claim 1, wherein one of said upwardly extending side walls is rigid.

12. The apparatus of claim 1, further comprising a wafer carrier positioned above said base.

13. The apparatus of claim 1, further comprising a tray positioned above said base and configured to permit fluid flow therethrough.

14. The apparatus of claim 12, wherein said wafer carrier is configured to carry a plurality of semiconductor wafers in a mutually parallel relationship to each other.

15. The apparatus of claim 13, wherein said tray is configured to trap debris.

16. An apparatus for rinsing and drying semiconductor wafers, comprising:

a base having substantially opposed end walls and substantially opposed side walls extending upwardly from said base to define a chamber, wherein each of said substantially opposed side walls is positioned adjacent each of said substantially opposed end walls;

an actuator communicating with at least one of said substantially opposed side walls for moving at least one of said upwardly extending side walls vertically downward relative to said base such that said upwardly extending side wall is positioned below said base;

a rinse liquid injection assembly positioned over said base for directing rinse liquid on a surface of at least one semiconductor wafer positioned in said chamber; and

a drying fluid injection assembly positioned over said base for directing drying fluid on the surface of said at least one semiconductor wafer.

17. The apparatus of claim 16, wherein at least one of said upwardly extending side walls is in sealing contact with said base.

18. The apparatus of claim 16, wherein said actuator controls the rate at which one of said upwardly extending side walls move vertically downward relative to said base.

19. The apparatus of claim 16, wherein at least one of said upwardly extending side walls is rigid.

20. The apparatus of claim 16, wherein at least one of said upwardly extending side walls is collapsible.

21. The apparatus of claims 16, wherein at least one of said upwardly extending side walls has a tambour configuration.

22. The apparatus of claim 16, wherein said drying fluid injection assembly directs a quantity of vaporized drying fluid towards said surface of said semiconductor wafer.

23. The apparatus of claim 16, further comprising a wafer carrier positioned above said base.

24. The apparatus of claim 16, further comprising a tray positioned above said base and configured to permit fluid flow therethrough.

25. The apparatus of claim 23, wherein said wafer carrier is configured to carry a plurality of semiconductor wafers in a mutually parallel relationship to each other.

26. The apparatus of claim 24, wherein said tray is configured to trap debris.

27. An apparatus for rinsing and drying semiconductor wafers, comprising:

a chamber having a base, substantially opposed side walls, and substantially opposed end walls and having at least one semiconductor wafer disposed therein, said substantially opposed side walls and said substantially opposed end walls extending upwardly from said base and each of said substantially opposed side walls positioned adjacent each of said substantially opposed end walls;

an actuator communicating with at least one of said substantially opposed side walls for moving at least one of said upwardly extending side walls vertically downward relative to said base such that said upwardly extending side wall folds to form a collapsible side wall which is positioned below said at least one semiconductor wafer disposed on said base of said chamber;

a rinse liquid injection assembly positioned over said chamber for directing rinse liquid on said at least one semiconductor wafer in said chamber; and

a dying fluid injection assembly positioned over said chamber for directing drying fluid on said at least one semiconductor wafer in said chamber.