Method for soldering integrated circuits

• US 6,095,405 A
• Filed: 08/03/1998
• Issued: 08/01/2000
• Est. Priority Date: 08/01/1997
• Status: Expired due to Term

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Woo-sik, Tsukue, Masaharu, Kim, Choul-su, Woo, Byung-woo
• Primary Examiner(s): Mills, Gregory
• Assistant Examiner(s): JOHNSON, JONATHAN J
• Application Number:
  US09/127,630
• Time in Patent Office: 729 Days
• Field of Search: 228/180.21, 228/214, 228/222, 228/46, 228/6.2, 228/212, 228/213, 228/234.1
• US Class Current: 228/180.21
• CPC Class Codes: B23K 1/005 Soldering by means of radiant energy
• CPC Class Codes: B23K 1/0053 soldering by means of I.R.
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2203/0557 Non-printed masks
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 2203/304 Protecting a component during manufacturing
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212

Abstract

Any one of at least two holding blocks loaded in a holding block storing portion is picked up and moved to cover an IC on a PCB of a PCB array. A light beam is applied to the whole surface of the PCB. The holding block is moved from the PCB to the holding block storing portion and cooled. It is then determined whether any other PCB to be soldered exists in the PCB array. If it is determined that any other PCB to be soldered exists in the PCB array, another holding block is picked up from the holding block storing portion and moved to cover an IC on the PCB of the PCB array. The above steps are repeated until all the PCBs of the PCB array to be soldered are completely soldered. If it is determined that any other PCB to be soldered does not exist in the PCB array, the PCB array is transferred to a subsequent process.

Claims

1. A method for soldering integrated circuits on a printed circuit board, comprising the steps of:

picking up by using a holding block pickup, a holding block of at least two holding blocks loaded in a holding block storing portion;

covering an integrated circuit on a printed circuit board with said picked up holding block and then separating said holding block pickup from said picked up holding block;

applying a light beam to a surface of said printed circuit board covered with said picked up holding block;

transferring by using said holding block pickup, said holding block covering said integrated circuit on said printed circuit board to said holding block storing portion;

cooling said holding block transferred to said holding block storing portion;

picking up by using said holding block pickup, another holding block of said at least two holding blocks loaded in said holding block storing portion if another integrated circuit remains to be soldered;

covering another integrated circuit on another printed circuit board with said another holding block and then separating said holding block pickup from said another holding block;

applying a light beam to a surface of said another printed circuit board covered with said another holding block;

transferring by using said holding block pickup, said another holding block covering said another integrated circuit on said another printed circuit board to said holding block storing portion;

cooling said another holding block transferred to said holding block storing portion; and

repeating said steps for soldering any other integrated circuit on any other printed circuit board.

2. The method according to claim 1, further comprising the step of using a pushing member to position a holding block covering an integrated circuit before each said step of applying said light beam.

3. The method according to claim 1, further comprising the step of applying cool air to a printed circuit board after each said step of applying said light beam.

4. The method according to claim 3, further comprised of applying said cool air for three seconds.

5. A method for soldering integrated circuits on a printed circuit board array including a plurality of printed circuit boards, comprising the steps of:

picking up by using a holding block pickup, a holding block of at least two holding blocks loaded in a holding block storing portion;

covering an integrated circuit on a printed circuit board of said printed circuit board array with said picked up holding block and then separating said holding block pickup from said picked up holding block;

applying a light beam to a surface of said printed circuit board including said integrated circuit covered with said picked up holding block;

transferring by using said holding block pickup, said holding block covering said integrated circuit on said printed circuit board to said holding block storing portion;

cooling said holding block transferred to said holding block storing portion;

determining whether another printed circuit board in said printed circuit board array is to be soldered;

if it is determined that another punted circuit board in said printed circuit board array is to be soldered, picking up by using said holding block pickup, another holding block of said at least two holding blocks loaded in said holding block storing portion;

covering another integrated circuit on another printed circuit board with said another holding block and then separating said holding block pickup from said another holding block;

applying a light beam to a surface of said another printed circuit board including said another integrated circuit covered with said another holding block;

transferring by using said holding block pickup, said another holding block covering said another integrated circuit on said another printed circuit board to said holding block storing portion;

cooling said another holding block transferred to said holding block storing portion;

repeating said steps for soldering any other integrated circuits on any other printed circuit board of said printed circuit board array; and

transferring said printed circuit board array to a subsequent process if it is determined no other printed circuit board remains to be soldered in said printed circuit board array.

6. The method according to claim 5, further comprising the step of using a pushing member to position a holding block covering an integrated circuit before each said step of apply said light beam.

7. The method according to claim 5, further comprising the step of applying cool air to a printed circuit board after each said step of applying said light beam.

8. The method according to claim 7, further comprised of applying said cool air for three seconds.

9. The method according to claim 5, further comprised of gradually reducing mounts of time for application of said light beam to respective printed circuit boards of said printed circuit board.

10. The method according to Clam 9, wherein said light beam is applied for 16.8 seconds to a first printed circuit board of said printed circuit boards in said printed circuit board array on which an integrated circuit is first soldered.

11. A process for soldering an integrated circuit on a printed circuit board, with each said including a plurality of leads, comprising:

deploying at least two holding blocks, with each said holding block positioned to protect a plastic package on an integrated circuit from high temperature during a heat soldering process while soldering said plurality of leads for an integrated circuit;

establishing a holding block storing portion for storing said at least two holding blocks; and

using a pickup to pick up, by turns, one holding block of said at least two holding blocks from said holding block storing portion, transferring said holding block picked up to cover an integrated circuit on a printed circuit board, for returning said holding block picked up to said holding block storing portion after a soldering process, for transferring another holding block of said at least two holding blocks from said holding block storing portion to cover another integrated circuit on another printed circuit board, and returning said another holding block to said holding block portion after a soldering process on said another integrated circuit.

12. The process according to claim 11, further comprising for applying cool air to a the printed circuit board after a soldering process on the printed circuit board is completed.

13. The process according to claim 12, further comprised of applying cool air with a nozzle installed under the printed circuit board.

14. The process according to claim 11, further comprised of arranging said printed circuit board and said another printed circuit board are included in an array including a plurality of printed circuit boards.