Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module

• US 6,095,423 A
• Filed: 02/16/1999
• Issued: 08/01/2000
• Est. Priority Date: 08/14/1996
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Wilm, Robert, Houdeau, Detlef
• Primary Examiner(s): Le, Thien M.
• Assistant Examiner(s): St. Cyr, Daniel
• Application Number:
  US09/250,874
• Time in Patent Office: 532 Days
• Field of Search: 235/487, 235/488, 235/492, 235/441, 361/737, 361/820, 257/679
• US Class Current: 235/487
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/01028 Nickel [Ni]
• CPC Class Codes: H01L 2924/01058 Cerium [Ce]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

The smart card module has a supporting plate which has a first contact plane and a semiconductor chip and electrically conductive connections between the semiconductor chip and the first contact plane. Apart from the first contact plane, the smart card module has, on the reverse side of the supporting plate, another connection plane that is also electrically connected to the semiconductor chip. The other connection plane may be used, for example, for turning on a built-in induction coil inside the chip body for contactless data transfer. The invention relates also to a combined smart card for contacting and contactless data transfer, which contains the smart card module. A manufacturing process is specified with a given sequence of process steps leading to the production of the smart card module.

Claims

1. A method of producing a smart card module having a substrate with a first contact plane, a semiconductor chip, and a further connecting plane, the method which comprises:

laminating a metal strip along a longitudinal direction onto a first side of a module substrate ribbon;

structuring the metal strip to form individual connecting sites of a further connecting plane and simultaneously structuring the module substrate ribbon by punching the module substrate ribbon for forming a cavity for receiving a semiconductor chip and openings for electrically conductive connections in the module substrate ribbon;

subsequently laminating a metal foil onto a second side of the module substrate ribbon, and structuring the metal foil to form a first contact plane electrically isolated from the further connecting plane;

mounting the semiconductor chip in the module substrate ribbon and contacting the chip with the first contact plane and the further connecting plane;

encasing the semiconductor chip with a plastic compound; and

singling an individual smart card module from the module substrate ribbon.

2. The method according to claim 1, which further comprises electroplating at least one of the first contact plane and the further connecting plane.

3. The method according to claim 1, which further comprises simultaneously electroplating the first contact plane and the further connecting plane.

4. The method according to claim 1, which further comprises fitting a support ring on the further connecting plane.

5. The method according to claim 1, wherein the step of laminating the metal strip comprises laminating the metal strip substantially centrally on the first side of the module substrate ribbon.

6. The method according to claim 1, which further comprises bonding a support ring onto the further connecting plane with a pressure-sensitive adhesive.

7. A smart card module produced by the method of claim 1, wherein the further connecting plane consists of metal.

8. The smart card according to claim 7, wherein the metal is copper.

9. The smart card module according to claim 8, wherein the copper is electroplated with nickel, and the nickel is electroplated with gold.

10. The smart card module according to claim 7, wherein the further connecting plane is formed with two connecting sites for connecting an antenna.

11. The smart card module according to claim 7, wherein the further connecting plane is formed with two connecting sites for connecting an induction coil for inductive data communication with the semiconductor chip.

12. The smart card module according to claim 7, wherein the first contact plane is formed by ISO contact surfaces.

13. The smart card module according to claim 7, which comprises a support ring made from a resilient material surrounding the semiconductor chip.

14. The smart card module according to claim 13, wherein the support ring is a metal ring.

15. The smart card module according to claim 13, wherein the support ring is a copper ring.

16. A combination smart card for contactless and conventional data transmission, which comprises a card body and a smart card module according to claim 7 disposed in said card body.