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Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module

  • US 6,095,423 A
  • Filed: 02/16/1999
  • Issued: 08/01/2000
  • Est. Priority Date: 08/14/1996
  • Status: Expired due to Fees
First Claim
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1. A method of producing a smart card module having a substrate with a first contact plane, a semiconductor chip, and a further connecting plane, the method which comprises:

  • laminating a metal strip along a longitudinal direction onto a first side of a module substrate ribbon;

    structuring the metal strip to form individual connecting sites of a further connecting plane and simultaneously structuring the module substrate ribbon by punching the module substrate ribbon for forming a cavity for receiving a semiconductor chip and openings for electrically conductive connections in the module substrate ribbon;

    subsequently laminating a metal foil onto a second side of the module substrate ribbon, and structuring the metal foil to form a first contact plane electrically isolated from the further connecting plane;

    mounting the semiconductor chip in the module substrate ribbon and contacting the chip with the first contact plane and the further connecting plane;

    encasing the semiconductor chip with a plastic compound; and

    singling an individual smart card module from the module substrate ribbon.

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