Apparatus and method for reducing wear on a conductor
First Claim
1. A multilayered wiring unit for reducing the wear on a wire, comprising:
- a first wiring layer;
a second wiring layer pivotably attached to said first wiring layer by a hinge for pivotable movement from an opened position, in which said second wiring layer is pivoted away at an angle from said first wiring layer, to a closed position, in which said second wiring layer is in confronting overlying relationship with said first wiring layer; and
a pair of wire guides comprising a first wire guide disposed on said first wiring layer and a second wire guide disposed on said second wiring layer, said pair of wire guides formed to guidedly cause a wire to traverse a path extending from said first wiring layer to said second wiring layer across said hinge such that when said second wiring layer is moved into said closed position, said wire is subjected to both rotational and bending forces.
5 Assignments
0 Petitions
Accused Products
Abstract
Apparatus and method for reducing the wear on a wire traversing a pivot or hinge and extending from first wiring layer to a second wiring layer that is pivotably attached to the first wiring layer by the hinge for pivotable angular movement from a closed position, in which the second wiring layer is in overlying relationship with the first wiring layer, to an opened position, in which the second wiring layer is pivoted away from the first wiring layer. A first wire guide is disposed on the first wiring layer and the second wire guide is disposed on the second wiring layer. The wire guides channel the wire so that should the second wiring layer be in the closed position, the wire would be subjected to both rotational and bending forces.
32 Citations
16 Claims
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1. A multilayered wiring unit for reducing the wear on a wire, comprising:
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a first wiring layer; a second wiring layer pivotably attached to said first wiring layer by a hinge for pivotable movement from an opened position, in which said second wiring layer is pivoted away at an angle from said first wiring layer, to a closed position, in which said second wiring layer is in confronting overlying relationship with said first wiring layer; and a pair of wire guides comprising a first wire guide disposed on said first wiring layer and a second wire guide disposed on said second wiring layer, said pair of wire guides formed to guidedly cause a wire to traverse a path extending from said first wiring layer to said second wiring layer across said hinge such that when said second wiring layer is moved into said closed position, said wire is subjected to both rotational and bending forces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. Apparatus for reducing the wear on a wire subject to bending forces comprising:
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a first wire guide on a first side of a pivot; and a second wire guide on a second side of said pivot and angularly pivotably moveable relative to said first guide by an angle, and said first and said second guides being so oriented that a wire guided through said guides across said pivot is subjected to both rotational and bending forces as said second wire guide is angularly pivotably moved in a direction which causes said angle to decrease. - View Dependent Claims (11, 12, 13, 14)
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15. A method of reducing wear on a wire, comprising the steps of:
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causing said wire to be guided by a first wire guide on a first side of a pivot; directing said wire across said pivot; and causing said wire to be guided by a second wire guide on a second side of said pivot and angularly pivotably moveable relative to said first guide by an angle, said second guide being so oriented relative to said first wire guide that a wire guided through said guides across said pivot is subjected to both rotational and bending forces as said second wire guide is angularly pivotably moved in a direction which causes said angle to decrease. - View Dependent Claims (16)
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Specification