Method of and apparatus for manufacturing thin solar battery
First Claim
1. A method of forming a thin solar battery in which semiconductor films formed on a silicon substrate are separated from said silicon substrate, an electrode is formed on said semiconductor films so that said semiconductor films will serve as a power generation layer, and a glass substrate is stacked on light incident surfaces of said semiconductor films, said method comprising the steps of:
- (a) forming semiconductor films on said silicon substrate and separating said semiconductor films from said silicon substrate;
(b) coating said glass substrate with a transparent resin;
(c) arranging said semiconductor films on said glass substrate which is coated with said transparent resin; and
(d) forming electrodes by printing on said semiconductor films which are arranged on said glass substrate using a predetermined printing method.
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Abstract
A process of forming electrodes is simplified during modularizing of a solar battery. According to the manufacturing method and the manufacturing apparatus, a thin solar battery is manufactured at a reduced cost and with a better yield. Using a robot which includes a suction chip which can handle a semiconductor film 2 without any damage which is separated from a particular substrate 1, the semiconductor films 2 are each accurately placed through a transparent resin 3 onto a glass substrate 7 which serves as a window of a solar battery, and p-type and n-type electrodes are printed at a time on the semiconductor films 2 which are arranged. Further, since a monolithic tab electrode is soldered to connect the electrodes, the manufacturing processes of the solar battery are simplified.
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Citations
14 Claims
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1. A method of forming a thin solar battery in which semiconductor films formed on a silicon substrate are separated from said silicon substrate, an electrode is formed on said semiconductor films so that said semiconductor films will serve as a power generation layer, and a glass substrate is stacked on light incident surfaces of said semiconductor films, said method comprising the steps of:
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(a) forming semiconductor films on said silicon substrate and separating said semiconductor films from said silicon substrate; (b) coating said glass substrate with a transparent resin; (c) arranging said semiconductor films on said glass substrate which is coated with said transparent resin; and (d) forming electrodes by printing on said semiconductor films which are arranged on said glass substrate using a predetermined printing method. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification