Photo-curable resin composition
First Claim
1. A photo-curable resin composition comprising,(A) an epoxy compound represented by the formula (1) ##STR4## wherein R1 and R2 independently represent a hydrogen atom or a methyl group,(B) a compound having a cyclohexene oxide structure,(C) a cationic photo-initiator,(D) an ethylenically unsaturated monomer,(E) a radical photo-initiator, and(F) a polyol having three or more hydroxyl groups.
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Accused Products
Abstract
A photo-curable resin composition capable of providing a three-dimensional object having excellent mechanical strength and high dimensional accuracy when used in a photo-fabrication process. The resin composition is also capable of providing a three-dimensional object with excellent stability in shape and properties in a photo-fabrication process. The photo-curable composition includes:
(A) a compound represented by the formula (1) ##STR1## wherein R1 and R2 independently represent a hydrogen atom or a methyl group;
(B) a compound having a cyclohexene oxide structure;
(C) a cationic photo-initiator;
(D) an ethylenically unsaturated monomer;
(E) a radical photo-initiator; and
(F) a polyol having three or more hydroxyl groups.
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Citations
11 Claims
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1. A photo-curable resin composition comprising,
(A) an epoxy compound represented by the formula (1) ##STR4## wherein R1 and R2 independently represent a hydrogen atom or a methyl group, (B) a compound having a cyclohexene oxide structure, (C) a cationic photo-initiator, (D) an ethylenically unsaturated monomer, (E) a radical photo-initiator, and (F) a polyol having three or more hydroxyl groups.
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2. The photo-curable resin composition of claim 1, wherein said epoxy compound of formula (1) is selected from the group consisting of:
- hydrogenated bisphenol A diglycidyl ethers, hydrogenated bisphenol F diglycidyl ethers, and hydrogenated bisphenol AD diglycidyl ethers.
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3. The photo-curable resin composition of claim 1, wherein, relative to the total amount of resin composition:
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component (A) is present in an amount from about 5 wt. % to about 40 wt. %; component (B) is present in an amount from about 50 wt. % to 100 wt. %; component (C) is present in an amount of about 0.1 wt. % to about 10 wt. %; component (D) is present in an amount from about 5 wt. % to about 30 wt. %; component (E) is present in an amount from about 0.01 wt. % to about 10 wt. %; and component (F) is present in an amount from about 5 wt. % to about 30 wt. %.
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4. The photo-curable resin composition of claim 1, wherein component (D) is a poly-functional ethylenically unsaturated monomer.
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5. The photo-curable resin composition of claim 1, wherein component (D) is a poly-functional ethylenically unsaturated compound having at least three ethylenically unsaturated groups.
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6. The photo-curable resin composition of claim 1, wherein said composition once cured, and after exposure to 95% relative humidity and 23°
- C. for 30 days, displays a relative change in Young'"'"'s Modulus of not more than 20%.
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7. The photo-curable resin composition of claim 1, wherein said composition after curing, and after exposure to water at 23°
- C. for 30 days, displays a relative change in Young'"'"'s Modulus of not more than 50%.
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8. The photo-curable resin composition of claim 1, wherein said composition after curing, has a rate of deformation of less than 0.10 mm after 30 days.
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9. The photo-curable resin composition of claim 1, wherein said composition has a viscosity at 25°
- C. of between 50 to 1,000 cps.
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10. A three-dimensional object comprising a cured photo-curable resin composition comprising:
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(A) an epoxy compound represented by the formula (1) ##STR5## wherein R1 and R2 independently represent a hydrogen atom or a methyl group, (B) a compound having a cyclohexene oxide structure, (C) a cationic photo-initiator, (D) an ethylenically unsaturated monomer, (E) a radical photo-initiator, and (F) a polyol having three or more hydroxyl groups.
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11. A process for photo-fabricating a three-dimensional object comprising the steps of selectively curing a photo-curable resin, wherein said photo-curable resin comprises:
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(A) an epoxy compound represented by the formula(1) ##STR6## wherein R1 and R2 independently represent a hydrogen atom or a methyl group, (B) a compound having a cyclohexene oxide structure, (C) a cationic photo-initiator, (D) an ethylenically unsaturated monomer, (E) a radical photo-initiator, and (F) a polyol having three or more hydroxyl groups.
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Specification