Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry
First Claim
1. A method of testing electrical continuity between a lead of an integrated circuit and a conductive trace, the method comprising the following steps:
- coupling a signal source to the conductive trace;
providing a conductive probe within the integrated circuit, the conductive probe being oriented beneath the lead such that loss of active circuit area of the integrated circuit due to placement of the conductive probe is reduced, the conductive probe being electromagnetically but not ohmically coupled to the lead of the integrated circuit;
measuring a response, from the signal source, on the conductive probe; and
determining that the lead is electrically connected to the conductive trace if the response on the conductive probe exceeds a predetermined threshold.
2 Assignments
0 Petitions
Accused Products
Abstract
An electromagnetic probe is integrated within an integrated circuit or mounted within an IC package to provide a capability for testing continuity between the integrated circuit and a substrate to which the integrated circuit is mounted. In a first embodiment, capacitive test probes are integrated within the integrated circuit, underneath bonding pads. In a second embodiment, Hall-effect devices are integrated within the integrated circuit underneath bonding pads. In a third embodiment, an inductive loop is integrated within the integrated circuit underneath bonding pads. In a fourth embodiment, an IC package assembly includes an internal capacitive test probe for electrical continuity testing. An internal shield may also be used as a capacitive test probe. In a fifth embodiment, an IC package assembly includes an inductive loop within the package for electrical continuity testing. The integrated or intrapackage test probes provide electromagnetic coupling to bonding pads or to a lead frame and to bonding wires (if present), to detect whether there is electrical continuity between an integrated circuit bonding pad or lead frame and conductors on an external substrate. The integrated or intrapackage test probes enable continuity testing for direct-bonding with no package, or for a package assembly even if the package assembly includes grounded shielding or a grounded heat sink.
72 Citations
12 Claims
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1. A method of testing electrical continuity between a lead of an integrated circuit and a conductive trace, the method comprising the following steps:
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coupling a signal source to the conductive trace; providing a conductive probe within the integrated circuit, the conductive probe being oriented beneath the lead such that loss of active circuit area of the integrated circuit due to placement of the conductive probe is reduced, the conductive probe being electromagnetically but not ohmically coupled to the lead of the integrated circuit; measuring a response, from the signal source, on the conductive probe; and determining that the lead is electrically connected to the conductive trace if the response on the conductive probe exceeds a predetermined threshold. - View Dependent Claims (2, 3)
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4. A method of testing electrical continuity between a lead of an integrated circuit and a conductive trace, the method comprising the following steps:
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providing a conductive probe within the integrated circuit, the conductive probe being oriented beneath the lead such that loss of active circuit area of the integrated circuit due to placement of the conductive probe is reduced; coupling a signal source to the conductive probe, the conductive probe being electromagnetically but not ohmically coupled to the lead of the integrated circuit; measuring a response, from the signal source, on the conductive trace; and determining that the lead is electrically connected to the conductive trace if the response on the conductive trace exceeds a predetermined threshold. - View Dependent Claims (5)
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6. A method of testing electrical continuity between a lead of an integrated circuit and a conductive trace, the integrated circuit mounted in a package, the method comprising the following steps:
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providing a conductive probe within the package and externally of the integrated circuit, the conductive probe being electromagnetically but not ohmically coupled to the lead of the integrated circuit; coupling a signal source to the conductive trace; measuring a response, from the signal source, on the conductive probe; and determining that the lead is electrically connected to the conductive trace if the response on the conductive probe exceeds a predetermined threshold. - View Dependent Claims (7, 8, 9, 10)
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11. A method of testing electrical continuity between a lead of an integrated circuit and a conductive trace, the integrated circuit mounted in a package, the method comprising the following steps:
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providing a conductive probe within the package and externally of the integrated circuit, the conductive probe being electromagnetically but not ohmically coupled to the lead of the integrated circuit; coupling a signal source to the conductive probe; measuring a response, from the signal source, on the conductive trace; and determining that the lead is electrically connected to the conductive trace if the response on the conductive trace exceeds a predetermined threshold. - View Dependent Claims (12)
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Specification