×

Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry

  • US 6,097,203 A
  • Filed: 05/06/1998
  • Issued: 08/01/2000
  • Est. Priority Date: 04/29/1996
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method of testing electrical continuity between a lead of an integrated circuit and a conductive trace, the method comprising the following steps:

  • coupling a signal source to the conductive trace;

    providing a conductive probe within the integrated circuit, the conductive probe being oriented beneath the lead such that loss of active circuit area of the integrated circuit due to placement of the conductive probe is reduced, the conductive probe being electromagnetically but not ohmically coupled to the lead of the integrated circuit;

    measuring a response, from the signal source, on the conductive probe; and

    determining that the lead is electrically connected to the conductive trace if the response on the conductive probe exceeds a predetermined threshold.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×