Semiconductor device fabrication system

• US 6,099,599 A
• Filed: 11/12/1998
• Issued: 08/08/2000
• Est. Priority Date: 05/08/1996
• Status: Expired due to Fees

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Wu, Beuan P. F.
• Primary Examiner(s): Graybill, David E.
• Application Number:
  US09/190,339
• Time in Patent Office: 635 Days
• Field of Search: 29/25.01, 438/908, 204/298.25, 204/298.26, 204/298.35, 118/719, 118/733, 118/50
• US Class Current: 29/25.01
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber

Abstract

A semiconductor device fabrication system comprises a central hub area and multiple concentric ring sections circumferentially provided around the hub area. Each of the ring sections has a plurality of modular process units (MPUs) each receiving about three in-line semiconductor device processing stations therein and having the size of a standard shipping container for conveniently outgoing heavy repair. The MPUs are successively disposed around the hub area with the walls positioned radially of the hub area. Service facilities and handling piping system are provided under the MPUs. Each of the ring sections has a conveying track provided adjacent to the ring-shaped arranged MPUs for communication with the MPUs. A human maintenance system is provided in the system for carrying service persons to get into and out of the MPUs through the sidewalls thereof for light repair. The central hubs for common services or particular processes is communicated with the innermost ring section by providing multiple crossovers therebetween.

Claims

1. A semiconductor device fabrication system, comprising:

a central hub area;

at least one ring section circumferentially provided around the hub area, the ring section including;

a plurality of modular process units, each having two opposite sidewalls and two opposite endwalls which define an internal space, the modular process units being successively disposed around the hub area with the sidewalls positioned radially of the hub area, the modular process unit including;

at least one semiconductor device processing station disposed in the internal space;

an air conditioning system provided at a top of the internal space;

at least two through doors formed at one of the sidewalls of the unit;

a plurality of service facilities correspondingly provided under the modular process units;

a handling piping system provided under the service facilities;

a conveying track correspondingly provided adjacent to the modular process units;

passages provided for connection between the modular process units and the conveying track through the through doors; and

at least one maintenance track which is provided adjacent to the modular process units and opposite to the conveying track, the maintenance track having at least one container thereon which is accessible to the internal space of each of the modular process units.

2. The semiconductor device fabrication system as set forth in claim 1, including two ring sections which are a first ring section and a second ring section, wherein the first ring section and the second ring section concentrically provided around the hub area, and the second ring section is provided externally of the first ring section.

3. The semiconductor device fabrication system as set forth in claim 2, wherein the conveying track of the first ring section is a first conveying track which is internally adjacent to the modular process units of the first ring section, and wherein the conveying track of the second ring section is a second conveying track which is externally adjacent to the modular process units of the second rings.

4. The semiconductor device fabrication system as set forth in claim 3, including a maintenance track which has a plurality of containers and which is concentrically provided between the first ring section and the second ring section.

5. The semiconductor device fabrication system as set forth in claim 3, further comprising a plurality of first crossovers connected between the first conveying track and second conveying track.

6. The semiconductor device fabrication system as set forth in claim 1, further comprising a plurality of second crossovers which are provided between the conveying track and the central hub area.

7. The semiconductor device fabrication system as set forth in claim 4, further comprising a plurality of corridors which is provided on each of the containers for communication with the internal space of each of the modular process units.

8. The semiconductor device fabrication system as set forth in claim 7, wherein each of the modular process units includes a plurality of semiconductor device processing stations which are in-line arranged in a direction substantially perpendicular to a radial direction of the ring sections.

9. The semiconductor device fabrication system as set forth in claim 1, further comprising at least one hub building which is disposed over the central hub area and is capable of human habitation.

10. A semiconductor device fabrication system, comprising:

a central hub area;

at least one ring section circumferentially provided around the hub area, the ring section including;

a plurality of modular process units, each having two opposite sidewalls and two opposite endwalls which define an internal space, the modular process units being successively disposed around the hub area with the endwalls positioned radially of the hub area, the modular process unit including;

at least one semiconductor device processing station disposed in the internal space;

an air conditioning system provided at a top of the internal space;

two through doors formed at the opposite endwalls of the unit, respectively;

a plurality of service facilities correspondingly provided under the modular process units;

a handling piping system provided under the service facilities;

at least two conveying tracks provided adjacent to the endwalls of the modular process units;

passages provided for connection between the modular process units and the conveying track through the through doors; and

a maintenance system which is provided over the modular process units, the maintenance system having at least one container which is accessible to the internal space of each of the modular process units.

11. The semiconductor device fabrication system as set forth in claim 10, including two ring sections which are a first ring section and a second ring section concentrically provided around the hub area, wherein the second ring section is provided externally of the first ring section.

12. The semiconductor device fabrication system as set forth in claim 11, including three conveying tracks which are a first, a second and a third conveying track, wherein the first conveying track is internally adjacent to the modular process units of the first ring section, the second conveying track is externally adjacent to the modular process units of the first ring section and internally adjacent to the modular process units of the second ring section, the third conveying track is externally adjacent to the modular process units of the second ring section.

13. The semiconductor device fabrication system as set forth in claim 12, further comprising a plurality of crossovers which are provided between the first conveying track and the central hub area.

14. The semiconductor device fabrication system as set forth in claim 10, wherein each of the modular process units includes a plurality of semiconductor device processing stations which are in-line arranged in a radial direction of the ring sections.

15. The semiconductor device fabrication system as set forth in claim 10, further comprising at least one hub building which is disposed over the ring section and is capable of human habitation.

16. The semiconductor device fabrication system as set forth in claim 10, further comprising a ring-shaped platform which is externally provided around the ring section.