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Method of and apparatus for restoring a support surface in a semiconductor wafer processing system

  • US 6,099,697 A
  • Filed: 04/13/1999
  • Issued: 08/08/2000
  • Est. Priority Date: 04/13/1999
  • Status: Expired due to Fees
First Claim
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1. A method for restoring a support surface of a substrate support comprising the steps of:

  • (a) providing a surrogate substrate on the support surface;

    (b) connecting the surrogate substrate to a ground; and

    (c) creating a force between the support surface and the surrogate substrate to remove accumulated charges in the support surface.

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