Hot plate with in situ surface temperature adjustment

• US 6,100,506 A
• Filed: 07/26/1999
• Issued: 08/08/2000
• Est. Priority Date: 07/26/1999
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Colelli, James J. Jr., Leggett, Randall A., Whiting, Charles A., Mundenar, Joseph
• Primary Examiner(s): PAIK, SANG YEOP
• Application Number:
  US09/361,451
• Time in Patent Office: 379 Days
• Field of Search: 219/443.1, 219/444.1, 219/448.11, 219/409, 219/411, 219/413, 219/502, 118/725, 118/726, 118/621, 118/624, 427/8, 427/9, 427/10, 427/592
• US Class Current: 219/446.1
• CPC Class Codes: H01L 21/67248 Temperature monitoring

Abstract

An arrangement and method for controlling individual zones of a hot plate which is employed in a post exposure bake step of wafers in the fabrication of semi-conductor devices incorporating photolithographic processes using chemically amplified resist systems. Provided is an in situ temperature-controllable hot plate which includes temperature-controllable surface zones for supporting a standard single wafer, and having loading means which orient the wafer on the hot plate. The hot plate may be segmented into an array of individually controllable heating zones, while mounted above the hot plate is a thermal detection array, such as an infrared(IR) camera or pyroelectric or pyrometric detector which functions to detect and scrutinize the wafer surface temperature with regard to specific locations dispersed across the hot plate surface. This particular data is mapped into the hot plate zones, and the mapped data transmitted into a servo for zonal hot plate adjustment and temperature control.

Claims

1. An arrangement for controlling the temperature of a hotplate used for spatially adjusting and controlling the temperature of at least an upper surface of a wafer for the fabrication of semiconductor structures;

said arrangement, comprising;

(a) means for supplying energy to said hotplate for heating said hot plate;

(b) controller means for modulating the supply of energy to said hotplate so as to regulate the temperature of the hotplate surface supporting said wafer;

(c) means for sensing the temperature of said wafer, said sensing means including a thermal detection array arranged above the upper surface of said wafer for scrutinizing the temperatures across a plurality of zones across the surface of said wafer; and

(d) means for processing temperature information received from said energy supply responsive to temperature deviations sensed from said wafer so as to correctively adjust the temperature of said hotplate and resultingly of said wafer to a specified uniform surface wafer temperature profile.

2. An arrangement as claimed in claim 1, wherein said sensing means comprises an infrared camera arranged in spaced relationship above said wafer.

3. An arrangement as claimed in claim 1, wherein said sensing means comprises a pyrometric element arranged in spaced relationship above said wafer.

4. An arrangement as claimed in claim 1, wherein said energy supply is transmitted to said hot plate so as to uniformly heat the surface of said hot plate supporting said wafer.

5. An arrangement as claimed in claim 1, wherein said hot plate has a surface for supporting said wafer divided into a plurality of zones, said energy being supplied to heating elements in each of said zones so as to impart a predetermined heating pattern to the surface of said hot plate.

6. An arrangement as claimed in claim 5, wherein said zones in said hot plate comprise individually thermally-controllable heating areas in the surface of said hot plate.

7. An arrangement as claimed in claim 6, wherein said zones are heated in correlation with temperatures sensed on said wafer so as to adjust the hot plate temperatures to a specified temperature profile.

8. An arrangement as claimed in claim 1, wherein said wafer temperature is controlled during post exposure baking of the wafer employed in the fabrication of semiconductor devices and to control the image sizes of integrated circuits on said wafer.

9. An arrangement as claimed in claim 1, wherein a monitor is operatively connected to said hot plate for in situ visual monitoring of hot plate surface temperatures so as to ensure that the hot plate arrangement is controlled to the specified temperature profile.

10. A method for controlling the temperature of a hotplate used for spatially adjusting and controlling the temperature of at least an upper surface of a wafer for the fabrication of semiconductor structures;

said method comprising;

(a) supplying energy to said hotplate for heating said hotplate;

(b) modulating the supply of energy to said hotplate so as to regulate the temperature of the hotplate surface supporting said wafer;

(c) sensing the temperature of said wafer, said sensing including utilizing a thermal detection array arranged above the upper surface of said wafer for scrutinizing the temperature across a plurality of zones across the surface of said wafer and;

(d) processing temperature information received from said energy supply responsive to temperature deviation sensed from said wafer so as to correctively adjust the temperature of said hotplate and resultingly of said wafer to a specified uniform surface wafer temperature profile.

11. A method as claimed in claim 10, wherein said sensing comprises arranging an infrared camera in spaced relationship above said wafer.

12. A method as claimed in claim 10, wherein said sensing comprises arranging a pyrometric element in spaced relationship above said wafer.

13. A method as claimed in claim 10, wherein said energy supply is transmitted to said hot plate so as to uniformly heat the surface of said hot plate supporting said wafer.

14. A method as claimed in claim 10, wherein said hot plate has a surface for supporting said wafer divided into a plurality of zones, said energy being supplied to heating elements in each of said zones so as to impart a predetermined heating pattern to the surface of said hot plate.

15. A method as claimed in claim 14, wherein said zones in said hot plate comprise individually thermally-controllable heating areas in the surface of said hot plate.

16. A method as claimed in claim 15, wherein said zones are heated in correlation with temperatures sensed on said wafer so as to adjust the hot plate temperatures to a specified temperature profile.

17. A method as claimed in claim 10, wherein said wafer temperature is controlled during post exposure baking of the wafer employed in the fabrication of semiconductor devices and to control the image sizes of integrated circuits on said wafer.

18. A method as claimed in claim 10, wherein a monitor is operatively connected to said hot plate for in situ visual monitoring of hot plate surface temperatures so as to ensure that the hot plate arrangement is controlled to the specified temperature profile.