Semiconductor device having all outer leads extending from one side of a resin member

• US 6,100,580 A
• Filed: 10/07/1998
• Issued: 08/08/2000
• Est. Priority Date: 09/20/1988
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Kitano, Makoto, Yaguchi, Akihiro, Kikuchi, Hiroshi, Yokoyama, Takashi, Nishimura, Asao, Matsumoto, Tetsuro, Hasebe, Akio, Oshima, Kazuyoshi, Hozoji, Hiroshi, Nishi, Kunihiko, Yamazaki, Takashi, Yoshida, Isamu, Anjo, Ichiro, Tsubosaki, Kunihiro, Saeki, Junichi, Ichitani, Masahiro, Segawa, Masanori, Kokaku, Hiroyoshi, Murakami, Gen, Eguchi, Syuuji, Nakamura, Shozo, Kawai, Sueo, Kaneda, Aizo, Kinjo, Noriyuki, Ogata, Masatsugu
• Primary Examiner(s): Clark, Sheila V.
• Application Number:
  US09/167,736
• Time in Patent Office: 671 Days
• Field of Search: 257/666, 257/676, 257/691
• US Class Current: 257/666
• CPC Class Codes: H01L 2224/02166 Collar structures
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05556 in side view
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/06136 Covering only the central area of the surface to be connected, i.e. central arrangements
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45565 Single coating layer
• CPC Class Codes: H01L 2224/4569 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4826 : Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48465 : the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48624 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48724 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48799 : Principal constituent of the connecting portion of the wire connector being Copper (Cu)
• CPC Class Codes: H01L 2224/48824 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/73215 : Layer and wire connectors
• CPC Class Codes: H01L 2224/85205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/85399 : Material
• CPC Class Codes: H01L 2224/8592 : Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2225/1005 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2225/1029 : the support being a lead frame
• CPC Class Codes: H01L 2225/107 : Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB printed circuits H05K1/00
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/4951 : Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 23/49555 : the bent parts being the outer leads
• CPC Class Codes: H01L 23/49558 : Insulating layers on lead frames, e.g. bridging members
• CPC Class Codes: H01L 23/49568 : specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 23/49586 : Insulating layers on lead frames
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 29/0657 : characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01011 : Sodium [Na]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01026 : Iron [Fe]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01043 : Technetium [Tc]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01092 : Uranium [U]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0695 : Polyamide
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15738 : the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/1576 : Iron [Fe] as principal constituent
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H05K 1/144 : Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device

Abstract

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Claims

1. A semiconductor device comprising:

a semiconductor chip having a main surface, said semiconductor chip including an integrated circuit and external terminals formed on said main surface, said main surface having a pair of longer edges and a pair of shorter edges, said pair of longer edges extending in a first direction, and said pair of shorter edges extending in a second direction which is different from said first direction;

a plurality of signal leads each having an inner lead and an outer lead which is continuous with said inner lead, said inner lead having a first portion and a second portion, each first portion being disposed over said main surface of the semiconductor chip and being spaced from one another in said first direction, each second portion crossing one of said pair of longer edges and extending away from said semiconductor chip;

bonding wires electrically connecting said external terminals of said semiconductor chip with said first portions of said inner leads; and

a resin member, said resin member having a pair of longer sides and a pair of shorter sides, said pair of longer sides of said resin member extending in said first direction, said pair of shorter sides of said resin member extending in said second direction, one of said pair of longer sides of said resin member being arranged in a vicinity of said one of said pair of longer edges of said semiconductor chip, said resin member sealing said semiconductor chip, said bonding wires, and said inner leads of said plurality of signal leads, wherein all of the outer leads of said plurality of signal leads protrude outwardly from said one of said pair of longer sides of said resin member, all outer leads of all signal leads of said semiconductor device protruding outwardly from said one of said pair of longer sides of said resin member.

2. A semiconductor device according to claim 1, wherein said external terminals are spaced from each other in said first direction.

3. A semiconductor device according to claim 2, wherein said external terminals are arranged at a central area between said pair of longer edges of said semiconductor chip.

4. A semiconductor device according to claim 3, wherein said outer leads of said plurality of signal leads protrude outwardly from only said one of the pair of longer sides of said resin member.

5. A semiconductor device according to claim 1, wherein said semiconductor device is a zigzag-in-line package.

6. A semiconductor device according to claim 1, further comprising a power supply lead having an inner lead and an outer lead which is continuous with said inner lead, said inner lead of said power supply lead having a first portion and a second portion, said first portion of said inner lead of said power supply lead being disposed over said main surface of said semiconductor chip and being extended in said first direction, said second portion of said inner lead of said power supply lead extending from said first portion to the outside of said semiconductor chip, wherein said outer lead of said power supply lead protrudes outwardly from said one of the pair of longer sides of said resin member.

7. A semiconductor device according to claim 1, wherein said main surface has a rectangular shape, and said resin member has a rectangular shape.

8. A semiconductor device according to claim 1, wherein some of the outer leads extend above a plane extending substantially parallel to the main surface of the semiconductor chip, and others of the outer leads extend below the plane extending substantially parallel to the main surface of the semiconductor chip.

9. A semiconductor device comprising:

a semiconductor chip having a main surface, said semiconductor chip including an integrated circuit and external terminals formed on said main surface, said main surface having a pair of longer edges and a pair of shorter edges, said pair of longer edges extending in a first direction, said pair of shorter edges extending in a second direction which is different from said first direction;

first signal leads each having an inner lead and an outer lead which is continuous with said inner lead, the inner leads of said first signal leads having first portions and second portions, each of said first portions of said inner leads of said first signal leads being disposed over said main surface of said semiconductor chip and being spaced from one another in said first direction, each of said second portions of said inner leads of said first signal leads extending away from said semiconductor chip;

second signal leads each having an inner lead and an outer lead which is continuous with said inner lead, each inner lead of said second signal leads having a first portion and a second portion, each first portion of the inner leads of said second signal leads being disposed over said main surface of said semiconductor chip and being spaced from one another in said first direction, each second portion of said inner leads of said second signal leads extending away from said semiconductor chip;

bonding wires electrically connecting said external terminals of said semiconductor chip with said first portions of said inner leads of said first and second signal leads respectively; and

a resin member, said resin member having a pair of longer sides and a pair of shorter sides, said pair of longer sides of said resin member extending in said first direction, said pair of shorter sides of said resin member extending in said second direction, one of said pair of longer sides of said resin member being arranged in a vicinity of one of said pair of longer edges of said semiconductor chip, said resin member sealing said semiconductor chip, said bonding wires, and said inner leads of said first and second signal leads,

wherein tips of said first portions of said first signal leads are arranged between said external terminals and said one of said pair of longer edges of said semiconductor chip,

wherein tips of said first portions of said second signal leads are arranged between said external terminals and the other of said pair of longer edges of said semiconductor chip, and

wherein said outer leads of said first signal leads and second signal leads protrude outwardly from said one of said pair of longer sides of said resin member.

10. A semiconductor device according to claim 9, wherein said external terminals are arranged at a central area between said pair of longer edges of said semiconductor chip.

11. A semiconductor device according to claim 9, wherein said semiconductor device is a zigzag-in-line package.

12. A semiconductor device according to claim 9, wherein said outer leads of said first signal leads and said second signal leads protrude outwardly from only said one of said pair of longer sides of said resin member.

13. A semiconductor device according to claim 9, further comprising a first power supply lead and a second power supply lead, each having an inner lead and an outer lead which is continuous with said inner lead, said inner lead of each of said first and second power supply leads having a first portion and a second portion, said first portion of said inner lead of each of said first and second power supply leads being disposed over said main surface of said semiconductor chip and being extended in said first direction, said second portion of said inner lead of each of said first and second power supply leads extending from said first portion, away from said semiconductor chip, wherein said outer leads of said first and second power supply leads protrude outwardly from said one of said pair of longer sides of said resin member.

14. A semiconductor device according to claim 13, wherein said first power supply lead is a power supply voltage lead, and wherein said second power supply lead is a reference voltage lead.

15. A semiconductor device according to claim 9, wherein said main surface has a rectangular shape, and said resin member has a rectangular shape.

16. A semiconductor device according to claim 9, wherein some of the outer leads of the first and second signal leads extend above a plane extending substantially parallel to the main surface of the semiconductor chip, and others of the outer leads of the first and second signal leads extend below the plane extending substantially parallel to the main surface of the semiconductor chip.

17. A semiconductor device according to claim 13, wherein said tips of the first signal leads are arranged between the first portion of the inner lead of the first power supply lead and the one of the pair of longer edges of the semiconductor chip, and the tips of the second signal leads are arranged between the first portion of the inner lead of the second power supply lead and the other of the pair of longer edges of the semiconductor chip.

18. A semiconductor device according to claim 13, wherein said first portion of the inner lead of the first power supply lead is located between said external terminals and said tips of the first signal leads, and said first portion of the inner lead of the second power supply lead is located between said external terminals and said tips of said second signal leads.

19. A semiconductor device according to claim 18, wherein said external terminals are arranged at a central area between said pair of longer edges of said semiconductor chip.