Compound switching matrix for probing and interconnecting devices under test to measurement equipment

• US 6,100,815 A
• Filed: 12/24/1997
• Issued: 08/08/2000
• Est. Priority Date: 12/24/1997
• Status: Expired due to Term

• Current Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Original Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Inventors: Pailthorp, Robert M.
• Primary Examiner(s): Zimmerman, Brian
• Assistant Examiner(s): Dalencourt, Yves
• Application Number:
  US08/998,156
• Time in Patent Office: 958 Days
• Field of Search: 340/825.54, 340/825.18, 340/825.06, 340/825.49, 340/10.1, 340/825.79, 324/754, 324/761, 324/758
• US Class Current: 324/754.07
• CPC Class Codes: G01R 1/07385 using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester
• CPC Class Codes: H01C 17/242 by laser trimming by laser in general B23K26/351
• CPC Class Codes: H01H 67/30 Co-ordinate-type selector switches with field of co-ordinate coil acting directly upon magnetic leaf spring or reed-type contact member

Abstract

A compound switching matrix (30) operates in cooperation with a resistance measuring system (20) and a laser (22) to quickly and accurately trim resistors (12) to predetermined values while they are being measured. The compound switching matrix is implemented with dry reed relays (34-81, 101-164) and includes a probe switching matrix (90-97) and a configuration matrix (32) that reduce the average number of relay contacts required per probe to implement two-, three-, and four-terminal measurements with or without guarding. Moreover, the separate probe switching and measurement configuration matrices effectively separate the high and low sides of the measurement to reduce the effects of stray resistances and capacitances on measurement speed and accuracy. A switchable grounding configuration (82-89) further improves measurement accuracy. The compound switching matrix of this invention enables sequential resistance measurements of individual resistors in the array, with two-, three-, and four-terminal measurement configurations being adapted to resistors having values ranging from less than 0.1 ohm to greater than 100 Megohms.

Claims

1. A compound switching matrix apparatus for interconnecting a set of devices that each include first and second contacts to first and second sets of terminals on a measurement system, comprising:

a first set of probes contacting the first contacts on the set of devices;

a second set of probes contacting the second contacts on the set of devices;

first set of probe matrix relays mounted on a first circuit board for selectively interconnecting the first set of probes to a first set of inter-matrix conductors;

a second set of probe matrix relays mounted on a second circuit board for selectively interconnecting the second set of probes to a second set of inter-matrix conductors, the first and second circuit boards electrically isolating the first set of probe matrix relays and inter-matrix conductors from the second set of probe matrix relays and inter-matrix conductors;

a first set of configuration matrix relays selectively interconnecting the first set of terminals on the measurement system to the first set of inter-matrix conductors;

a second set of configuration matrix relays selectively interconnecting the second set of terminals on the measurement system to the second set of inter-matrix conductors; and

a laser that cooperates with the measurement system to laser trim a device in the set of devices to a predetermined value.

2. The apparatus of claim 1 in which the set of probe matrix relays and the set of configuration matrix relays comprise dry reed relays.

3. The apparatus of claim 1 in which the set of devices includes at least one of a set of resistors, a set of capacitors, a set of inductors, and a set of delay lines.

4. The apparatus of claim 1 in which the set of devices is an array of resistors formed on a substrate.

5. The apparatus of claim 4 in which the measurement system is a resistance measuring system that cooperates with the laser to laser trim a resistor in the array of resistors to a predetermined value.

6. The apparatus of claim 1 in which the set of devices includes at least 25 devices and the first and second sets of probes each include at least 50 probes.

7. The apparatus of claim 1 in which the first and second sets of probe matrix relays and the first and second sets of configuration matrix relays together include about 440 relays and the first and second sets of probes include about 192 probes.

8. The apparatus of claim 1 in which each probe in the first set of probes is connected to 2 relays in the first set of probe matrix relays, and each probe in the second set of probes is connected to 2 relays in the second set of probe matrix relays.

9. The apparatus of claim 1 in which the first and second sets of probes are mounted on a probe card that is physically separated from the first and second circuit boards by first and second probe card connectors that electrically connect the first and second sets of probes to the respective first and second sets of probe matrix relays.

10. The apparatus of claim 1 in which the first set of terminals comprise at least Hi force and Hi sense terminals and the second set of terminals comprise at least Lo force and Lo sense terminals on a resistance measurement system.

11. The apparatus of claim 10 in which the measurement system effects a four-terminal measurement by employing odd members of the first set of probes to connect the Hi force terminals to the first contacts on the set of devices, even members of the first set of probes to connect the Hi sense terminals to the first contacts on the set of devices, odd members of the second set of probes to connect the Lo force terminals to the second contacts on the set of devices, and even members of the second set of probes to connect the Lo sense terminals to the second contacts on the set of devices.