Method and device for acquiring redundancy information from a packaged memory chip
First Claim
1. A method of testing a packaged semiconductor memory device to acquire information on redundant elements, said method comprising the steps of:
- configuring the device in a test mode; and
in response to configuring the device into a first test mode, sensing a first programmed signal indicating that redundancy has been implemented on the device, and changing the state of at least one output pin when the first signal has a preselected value.
8 Assignments
0 Petitions
Accused Products
Abstract
A method and circuit for testing a packaged semiconductor memory device allow the acquisition of information on redundant elements by performing one of three possible redundancy rollcall tests on the packaged memory chip. By stimulating the packaged device'"'"'s pins, the memory chip is set in one of the three test modes. In the first test mode, a preset signal indicating redundancy is sensed and the state of an output pin is changed. In the second test mode, memory array rows are sequentially addressed and the state of an output pin is changed when a redundant row is addressed. In the third test, array columns are sequentially addressed and, when a redundant column is addressed, the state of the output pin to which the redundant column is mapped is changed.
-
Citations
9 Claims
-
1. A method of testing a packaged semiconductor memory device to acquire information on redundant elements, said method comprising the steps of:
-
configuring the device in a test mode; and in response to configuring the device into a first test mode, sensing a first programmed signal indicating that redundancy has been implemented on the device, and changing the state of at least one output pin when the first signal has a preselected value. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
Specification