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Method and device for acquiring redundancy information from a packaged memory chip

  • US 6,101,618 A
  • Filed: 12/22/1993
  • Issued: 08/08/2000
  • Est. Priority Date: 12/22/1993
  • Status: Expired due to Term
First Claim
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1. A method of testing a packaged semiconductor memory device to acquire information on redundant elements, said method comprising the steps of:

  • configuring the device in a test mode; and

    in response to configuring the device into a first test mode, sensing a first programmed signal indicating that redundancy has been implemented on the device, and changing the state of at least one output pin when the first signal has a preselected value.

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