Apparatus for monitoring and controlling progressive punch press production of articles and associated method

• US 6,101,857 A
• Filed: 04/06/1999
• Issued: 08/15/2000
• Est. Priority Date: 04/06/1999
• Status: Expired due to Term

• Current Assignee: Oberg Industries
• Original Assignee: Oberg Industries
• Inventors: Rummel, Samuel A., Fox, Ronald R.
• Primary Examiner(s): TOLAN, EDWARD THOMAS
• Application Number:
  US09/286,898
• Time in Patent Office: 497 Days
• Field of Search: 72/14.8, 72/15.1, 72/17.1, 72/17.2, 72/20.1, 72/20.2, 72/21.1, 72/21.4, 29/598, 364/476.01, 364/474.15, 364/474.16, 364/474.17, 364/468.15, 364/468.21, 73/763, 73/768, 73/774-777
• US Class Current: 72/15.1
• CPC Class Codes: G05B 19/4184 characterised by fault tolerance, reliability of production system
• CPC Class Codes: G05B 2219/25257 Microcontroller
• CPC Class Codes: G05B 2219/31455 Monitor process status
• CPC Class Codes: G05B 2219/33273 DCS distributed, decentralised controlsystem, multiprocessor
• CPC Class Codes: G05B 2219/45137 Punch, stamp, also with use die, mould
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

Apparatus for progressively manufacturing fabricated or semi-fabricated articles, such as a rotor or stator assembly, includes a punch press and a progressive stamping die for creating the assemblies from sheet stock moving therebetween. A microcontroller board or network, including a plurality of microcontroller boards, is secured to the die for controlling operation of the apparatus responsive to information provided to them. Sensors are provided for monitoring operation of the apparatus and providing such information to the microcontroller boards. The communication system provides for communication between the sensors and the logic chips, among the logic chips and among the microcontroller boards and between the microcontroller boards and other portions of the apparatus which are to be subjected to responsive control. In a preferred embodiment, the microcontroller boards are positioned within a container which is secured in a recess in the progressive die and has an overlying material, such as an epoxy, covering all of the logic chips such that efforts to remove the material will at least partially destroy the chips. The die and microcontroller boards may be secured to and removed from the press as a unit. An associated method is disclosed.

Claims

1. A punch press apparatus for progressively manufacturing articles comprising

a punch press,

a cooperating punch section and die section for creating said articles from sheet stock moving therethrough,

a plurality of microcontroller boards secured to said punch section or said die section or both,

said microcontroller boards having a plurality of logic chips secured thereto,

sensor means for monitoring operation of said apparatus and providing input information regarding a plurality of monitored conditions to said microcontroller boards,

said microcontroller boards have means for processing said input information and emitting responsive control signals to other said microcontroller boards and control portions of said apparatus, and

communication means for effecting communication (a) between said sensor means and said microcontroller boards, (b) among said microcontroller boards and (c) between said microcontroller boards and control portions of said apparatus, whereby said microcontroller boards will through receipt and processing of said input information for a plurality of monitored conditions and communicating with other said microcontroller boards effect control of a plurality of monitored press apparatus conditions.

2. The apparatus of claim 1 including said punch section and die section being a progressive metal stamping die.

3. The apparatus of claim 2 including said microcontroller boards being secured to said die section.

4. The apparatus of claim 2 including said articles being selected from the group consisting of rotors and stators.

5. The apparatus of claim 1 including

said sheet stock being metal sheet stock.

6. The apparatus of claim 3 including

said microcontroller boards being embedded within said die section.

7. The apparatus of claim 1 including

said communication means having means for effecting communication among said microcontroller boards.

8. The apparatus of claim 6 including

said microcontroller boards being recessed within said punch section, said die section or both.

9. The apparatus of claim 2 including

a container disposed within a recess in said die section,

said microcontroller boards being disposed within said container, and

a sealing material covering said microcontroller boards.

10. The apparatus of claim 9 including

said sealing material being an epoxy which substantially completely covers said logic chips, whereby removal of said epoxy will at least partially destroy said logic chips.

11. The apparatus of claim 4 including

rotation means for rotating stacks of stator or rotor laminas.

12. The apparatus of claim 11 including

display means for displaying information regarding said apparatus, and

said display means being operatively associated with said communication means.

13. The apparatus of claim 8 including

solenoid means for initiating predetermined functions in said apparatus responsive to predetermined control signals.

14. The apparatus of claim 6 including

said sensor means including at least one sensor selected from the group consisting of triggered sensors, change-of-state sensors and output devices.

15. The apparatus of claim 8 including

said sensors including sensors which monitor at least one of the following conditions:

press position;

lamina thickness; and

rotation.

16. The apparatus of claim 2 including

said microcontroller boards having means for issuing control signals responsive to information received by microcontroller boards relating to at least one condition selected from the group consisting of lamina or stack thickness, misfeed, stack separation, press position and counter-bore.

17. The apparatus of claim 15 including

said press position sensors monitoring press open, press closed and at least one intermediate press position.

18. The apparatus of claim 1 including

said microcontroller boards being permanently secured to said die section.

19. The apparatus of claim 18 including

calibration means disposed exteriorly of said microcontroller boards for providing information to said communication means prior to initiating operation of said punch press.

20. The apparatus of claim 1 including

said logic chips being disposed on both surfaces of at least one said microcontroller board.

21. The apparatus of claim 2 including

at least one container having at least one said microcontroller board disposed therein, and

said container disposed at least partially within a recess in said punch section or said die section.

22. The apparatus of claim 21 including

a resinous material encapsulating each said microcontroller board.

23. The apparatus of claim 21 including

at least two said containers.

24. The apparatus of claim 23 including

said containers secured within recesses in said die portion, said punch portion, or both.

25. The apparatus of claim 24 including

at least some of said containers having a plurality of said microprocessor boards.

26. The apparatus of claim 21 including

at least one said container secured to said die section and at least one said container secured to said punch section.

27. The apparatus of claim 22 including

said resinous material being epoxy.

43. The method of claim 27 including

employing epoxy as said resinous material.

28. A method of progressively manufacturing articles comprising

providing a punch press having a cooperating punch section and die section for creating said articles from sheet stock moving therethrough,

providing a plurality of microcontroller boards each having a plurality of logic chips within said punch section, said die section or both,

sensing certain conditions of said apparatus and said sheet stock and delivering input information regarding a plurality of monitored conditions from sensors to said microcontroller boards, and

responsive to receipt of said input information from said sensors, said microcontroller boards processing said input information and emitting responsive control signals from said microcontroller boards to other said microcontroller boards and portions of said press apparatus to control operation of said apparatus, whereby said microcontroller boards will through receipt and processing of said input information for a plurality of monitored conditions and communicating with other said microcontroller boards effect control of a plurality of monitored press apparatus conditions.

29. The method of claim 28 including

providing said microcontroller boards in a recess in said die section.

30. The method of claim 28 including

employing said method to manufacture articles selected from the group consisting of rotors and stators.

31. The method of claim 28 including

employing said microcontroller boards to issue control signals responsive to information received thereby relating to at least one condition selected from the group consisting of lamina or stack thickness, misfeed, stack separation, press position and counter-bore.

32. The method of claim 28 including

employing said sensors to monitor at least one condition selected from the group consisting of press position, lamina thickness and rotation.

33. The method of claim 28 including

displaying visually readable information regarding specific conditions of said apparatus.

34. The method of claim 28 including

providing said microcontroller boards on both said punch section and said die section.

35. The method of claim 28 including

employing at least one container having at least one said microcontroller board disposed therein and positioning said containers at least partially within a recess in said punch section or said die section.

36. The method of claim 35 including

encapsulating said microcontroller boards with a resinous material.

37. The method of claim 28 including

employing only one said microcontroller board in each said container.

38. The method of claim 28 including

employing a plurality of said microcontroller boards in at least some of said containers.

39. The method of claim 28 including

employing a total of at least two said containers, and

said containers being disposed within recesses in said punch section, said die section, or both.

40. The method of claim 39 including

securing said containers within recesses within said die portion, said punch portion, or both.

41. The method of claim 40 including

providing at least some of said containers with a plurality of said microprocessor boards.

42. The method of claim 34 including

securing at least some of said containers to said die section and at least some of said containers to said punch section.