Electrode for dielectric-thin film device, and ultrasonic wave oscillator using the electrode
First Claim
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1. An electrode structure comprising:
- an electrically insulating film;
a metal adhesive film disposed on the electrically insulating film and including a metal selected from the group consisting of titanium, chromium, tantalum, vanadium, and niobium;
a metal film different in composition from the metal adhesive film, disposed on the metal adhesive film, and including one of an oxide and a nitride of the metal of the metal adhesive film for preventing diffusion of the metal of the metal adhesive film through the metal film; and
a conductor film disposed on the metal film and selected from the group consisting of gold, platinum, iridium, and ruthenium.
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Abstract
An electrode for a dielectric thin film device includes an adhesive layer adhering to a substrate, a diffusion suppressing layer containing compounds of metal elements constituting the adhesive layer or the substrate, and a main conduction layer. The crystallinity is enhanced by preventing diffusion of unnecessary elements into the dielectric thin film.
13 Citations
5 Claims
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1. An electrode structure comprising:
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an electrically insulating film; a metal adhesive film disposed on the electrically insulating film and including a metal selected from the group consisting of titanium, chromium, tantalum, vanadium, and niobium; a metal film different in composition from the metal adhesive film, disposed on the metal adhesive film, and including one of an oxide and a nitride of the metal of the metal adhesive film for preventing diffusion of the metal of the metal adhesive film through the metal film; and a conductor film disposed on the metal film and selected from the group consisting of gold, platinum, iridium, and ruthenium. - View Dependent Claims (2, 3, 4)
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5. An ultrasonic wave oscillator including an electrode structure comprising:
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an electrically insulating film; a metal adhesive film disposed on the electrically insulating film and including a metal selected from the group consisting of titanium, chromium, tantalum, vanadium, and niobium; a metal film different in composition from the metal adhesive film, disposed on the metal adhesive film, and including one of an oxide and a nitride of the metal of the metal adhesive film for preventing diffusion of the metal of the metal adhesive film through the metal film; and a conductor film disposed on the metal film and selected from the group consisting of gold, platinum, iridium, and ruthenium.
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Specification