Space-efficient layout method to reduce the effect of substrate capacitance in dielectrically isolated process technologies

• US 6,104,054 A
• Filed: 05/06/1999
• Issued: 08/15/2000
• Est. Priority Date: 05/13/1998
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Texas Instruments, Inc.
• Inventors: Milam, Stephen W., Cooley, Gregory M., Corsi, Marco
• Primary Examiner(s): Hardy, David
• Assistant Examiner(s): Ortiz, Edgardo
• Application Number:
  US09/306,182
• Time in Patent Office: 467 Days
• Field of Search: 257/301, 257/304, 257/306, 257/311
• US Class Current: 257/306
• CPC Class Codes: H01L 21/76264 SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
• CPC Class Codes: H01L 21/76283 Lateral isolation by refilling of trenches with dielectric material
• CPC Class Codes: H01L 21/76286 Lateral isolation by refilling of trenches with polycristalline material

Abstract

A method for reducing the parasitic capacitance and capacitive coupling of nodes (106) in a dielectrically isolated integrated circuit (100) using layout changes. A separate area of floating silicon (110) is created adjacent two or more dielectrically isolated nodes (106). The two or more nodes (106) are chosen that "slew together" (i.e., nodes that are required to change by the same voltage at the same time). The area of floating silicon (110) is created by placing an additional trench (112) around both of the dielectrically isolated nodes (106).

Claims

1. An integrated circuit comprising:

a plurality of dielectrically isolated silicon nodes each comprising a transistor region;

a plurality of first trenches, each of said first trenches surrounding and isolating one of said plurality of dielectrically isolated silicon nodes; and

at least one second trench, each said second trench surrounding at least two of said first trenches thereby creating an area of inner floating silicon around at least two of said dielectrically isolated silicon nodes.

2. The integrated circuit of claim 1, further comprising an outer silicon region connected to ground, said outer silicon region located around said second trench.

3. The integrated circuit of claim 1, wherein at least two of said dielectrically isolated silicon nodes contain bipolar transistors whose collectors are designed to slew together.

4. An integrated circuit comprising:

a carrier substrate;

a buried dielectric layer over said carrier substrate; and

a device layer over said buried dielectric layer, said device layer comprising;

an outer floating silicon region;

a first transistor region surrounded by a first trench;

a second transistor region surrounded by a second trench;

a third trench surrounding said first and second trenches thereby creating an inner floating silicon region, wherein said first transistor region is separated from said outer floating silicon region by said first trench, said third trench, and said inner floating silicon region, and wherein said second transistor region is separated from said outer floating silicon region by said second trench, said third trench, and said inner floating silicon region.

5. The integrated circuit of claim 4, wherein said outer floating silicon region is connected to ground.

6. The integrated circuit of claim 4, further comprising:

a plurality of said first transistor regions each surrounded by one of a plurality of said first trenches;

a plurality of said second transistor regions each surrounded by one of a plurality of said second trenches; and

a plurality of said third trenches, each surrounding at least one of said first transistor regions and at least one of said second transistor regions.

7. The integrated circuit of claim 4, wherein said first transistor region comprises a first bipolar transistor and said second transistor region comprises a second bipolar transistor, wherein the collectors of said first and second bipolar transistors slew together.

8. The integrated circuit of claim 7, further comprising:

one or more third transistor regions each comprising a third bipolar transistor whose collector slews with said first and second bipolar transistors and each surrounded by a fourth trench, wherein said third trench and said inner floating silicon region surrounds said fourth trench.

9. An integrated circuit comprising:

a carrier substrate;

a buried dielectric layer over said carrier substrate; and

a device layer over said buried dielectric layer, said device layer comprising;

an outer floating silicon region;

a first transistor region surrounded by a first trench;

a second trench surrounding said first trench thereby creating an inner floating silicon region, wherein said first transistor region is separated from to said outer floating silicon region by said first and second trenches and said inner floating silicon region.

10. The integrated circuit of claim 9, further comprising one or more third trenches surrounding said second trench.

11. The integrated circuit of claim 9, further comprising:

a plurality of said first transistor regions each surrounded by one of a plurality of said first trenches; and

a plurality of said second trenches, each surrounding one of said plurality of first trenches.