Structure and method for improved signal processing

• US 6,104,068 A
• Filed: 09/01/1998
• Issued: 08/15/2000
• Est. Priority Date: 09/01/1998
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Forbes, Leonard
• Primary Examiner(s): Meier, Stephan D.
• Application Number:
  US09/145,100
• Time in Patent Office: 714 Days
• Field of Search: 257/365, 257/401, 257/423, 327/105
• US Class Current: 257/365
• CPC Class Codes: H01L 27/0705 comprising components of the field effect type
• CPC Class Codes: H01L 29/7828 without inversion channel, e.g. vertical ACCUFETs, normally-on vertical MISFETs
• CPC Class Codes: H01L 29/7831 with multiple gate structure FinFETs or MuGFETs H01L29/7855, thin film transistors H01L29/78645
• CPC Class Codes: H03D 7/125 with field effect transistors

Abstract

An improved structure and method are provided for signal processing. The structure includes dual-gated metal-oxide semiconducting field effect transistor (MOSFET). The dual-gated MOSFET can be fabricated according to current CMOS processing techniques. The body region of the dual-gated MOSFET is a fully depleted structure. The structure includes two gates which are positioned on opposite sides of the opposing sides of the body region. Further, the structure operates as one device where the threshold voltage of one gate depends on the bias of the other gate. Thus, the structure yields a small signal component in analog circuit applications which depends on the product of the signals applied to the gates, and not simply one which depends on the sum of the two signals.

Claims

1. A mixer circuit, comprising:

a transistor extending outwardly from a semiconductor substrate, the transistor having a source region, a body region, and a drain region, the body region having opposing sidewall surfaces, and wherein the body region includes a fully depleted structure;

a first gate located on a first one of the opposing sidewall surfaces;

a second gate located on a second one of the opposing sidewall surfaces;

a local oscillator coupled to the first gate; and

a signal input coupled to the second gate.

2. The mixer circuit of claim 1, wherein the signal input provides input signals having frequencies in the gigahertz (GHz) range to the second gate.

3. The mixer circuit of claim 1, wherein the signal input provides input signals having frequencies in the megahertz (MHZ) range to the second gate.

4. The mixer circuit of claim 1, wherein the transistor includes a lateral metal oxide semiconducting field effect transistor (MOSFET).

5. The mixer circuit of claim 1, wherein the transistor includes a vertical metal oxide semiconducting field effect transistor (MOSFET).

6. The mixer circuit of claim 1, wherein the first gate is coupled to a first dc source.

7. The mixer circuit of claim 1, wherein the second gate is coupled to a second dc source.

8. The mixer circuit of claim 1, wherein the first and the second gate are coupled to a single dc source.

9. The mixer circuit of claim 1, wherein the mixer circuit is coupled to an integrated circuit chip, wherein the integrated circuit chip is adapted to processing digital and analog signals.

10. The mixer circuit of claim 1, wherein the transistor is fabricated on a complementary metal-oxide semiconductor (CMOS) chip.

11. The mixer circuit of claim 1, wherein the threshold voltage (V_t) of the first gate is dependent on the potential applied to the second gate.

16. The analog circuit of claim 11, wherein the threshold voltage (V_t) of the first gate is dependent on the potential applied to the second gate.

17. The analog circuit of claim 11, wherein the non-linear characteristics of the dual-gated MOSFET are adapted to producing an intermediate frequency signal from the local oscillator signal and the input signal.

18. The analog circuit of claim 17, wherein the intermediate frequency signal represents the product of the local oscillator signal and the input signal.

19. The analog circuit of claim 17, wherein the intermediate frequency signal represents the difference of the local oscillator signal and the input signal.

20. The analog circuit of claim 17, wherein the intermediate frequency signal represents the sum of the local oscillator signal and the input signal.

12. An analog circuit, comprising:

a dual-gated metal-oxide semiconducting field effect transistor (MOSFET) extending outwardly from a semiconductor substrate, the dual-gated MOSFET including;

a source region and a drain region;

a body region, the body region having opposing sidewall surfaces, and wherein the body region includes a fully depleted structure;

a first gate located on a first one of the opposing sidewall surfaces;

a second gate located on a second one of the opposing sidewall surfaces;

a local oscillator coupled to the first gate, wherein the local oscillator provides a local oscillator signal to the first gate; and

a signal input coupled to the second gate, wherein the signal input provides an input signal to the second gate.

13. The analog circuit of claim 12, wherein the first gate is coupled to a first dc source.

14. The analog circuit of claim 12, wherein the second gate is coupled to a second dc source.

15. The analog circuit of claim 12, wherein the first and the second gate are coupled to a single dc source.

21. The analog circuit of claim 12, wherein the analog circuit is a heterodyne receiver.

22. The analog circuit of claim 12, wherein the analog circuit is a frequency multiplier.

23. A communication device, comprising:

a signal processing circuit, wherein the signal processing circuit includes;

a dual-gated metal-oxide semiconducting field effect transistor (MOSFET) extending outwardly from a semiconductor substrate, the transistor including;

a source region and a drain region;

a body region, the body region having opposing sidewall surfaces, and wherein the body region includes a fully depleted structure;

a first gate located on a first one of the opposing sidewall surfaces; and

a second gate located on a second one of the opposing sidewall surfaces;

a local oscillator coupled to the first gate, wherein the local oscillator provides a local oscillator signal; and

a signal input coupled to the second gate, wherein the signal input provides an input signal; and

a receiver.

24. The communication device of claim 23, wherein the signal input is adapted to receiving input signals in the gigahertz (GHz) frequency range.

25. The communication device of claim 23, wherein the signal input is adapted to receiving input signals in the megahertz (MHZ) frequency range.

26. The communication device of claim 23, wherein the first gate is coupled to a first dc source.

27. The communication device of claim 23, wherein the second gate is coupled to a second dc source.

28. The communication device of claim 23, wherein the dual-gated MOSFET is fabricated on a complementary metal-oxide semiconductor (CMOS) chip.

29. The communication device of claim 23, wherein the non-linear characteristics of the dual-gated MOSFET are adapted to producing an intermediate frequency signal at the drain region from the local oscillator signal and the input signal.

30. The communication device of claim 29, wherein the intermediate frequency signal represents the product of the local oscillator signal and the input signal.

31. The communication device of claim 29, wherein the intermediate frequency signal represents the difference of the local oscillator signal and the input signal.

32. The communication device of claim 29, wherein the intermediate frequency signal represents the sum of the local oscillator signal and the input signal.

33. A method of signal processing, comprising:

biasing a first gate of a dual-gated MOSFET, wherein the dual-gated MOSFET includes;

a source region and a drain region; and

a body region, the body region having opposing sidewall surfaces,

wherein the body region includes a fully depleted structure,

and wherein the first gate opposes a first one of the opposing sidewall surfaces;

biasing a second gate of the dual-gated MOSFET, wherein the second gate opposes a second one of the opposing sidewall surfaces;

applying a local oscillator signal to the first gate; and

applying an input signal to the second gate.

34. The method of claim 33, wherein biasing the second gate includes biasing the second gate prior to biasing the first gate.

35. The method of claim 33, wherein biasing the second gate includes shifting the threshold voltage (V_t) of the first gate.

36. The method of claim 33, wherein applying a local oscillator signal and an input signal to the first and second gates of the dual-gated MOSFET includes outputting a number of intermediate frequency signals at the drain region of the dual-gated MOSFET.

37. The method of claim 36, wherein outputting a number of intermediate frequency signals includes outputting the product of the local oscillator signal and the input signal.

38. The method of claim 36, wherein outputting a number of intermediate frequency signals includes outputting the difference of the local oscillator signal and the input signal.

39. The method of claim 36, wherein outputting a number of intermediate frequency signals includes outputting the sum of the local oscillator signal and the input signal.

40. The method of claim 33, wherein applying an input signal to a second gate includes an input signal having a frequency in the gigahertz (GHz) range.

41. The method of claim 33, wherein applying an input signal to a second gate includes an input signal having a frequency in the megahertz (MHZ) range.

42. A signal processing circuit, comprising:

a digital logic circuit; and

an analog circuit, including;

a dual-gated metal-oxide semiconducting field effect transistor (MOSFET) extending outwardly from a semiconductor substrate, the dual-gated MOSFET including;

a source region and a drain region;

a body region, the body region having opposing sidewall surfaces, and wherein the body region includes a fully depleted structure;

a first gate located on a first one of the opposing sidewall surfaces;

a second gate located on a second one of the opposing sidewall surfaces;

a first input coupled to the first gate to receive an oscillator signal; and

a second input coupled to the second gate to receive an RF signal.

43. The signal processing circuit of claim 42, wherein the digital logic circuit and the analog circuit are implemented on a single integrated circuit.

44. The signal processing circuit of claim 43, wherein the digital logic circuit and the analog circuit are fabricated using CMOS processing techniques.

45. An analog circuit, comprising:

a dual-gated metal-oxide semiconducting field effect transistor extending outwardly from a substrate, including;

a source region and a drain region;

a body region, the body region having opposing sidewall surfaces, and wherein the body region includes an area which is capable of being fully depleted;

a first gate located on a first one of the opposing sidewall surfaces;

a second gate located on a second one of the opposing sidewall surfaces;

a first input coupled to the first gate to receive an oscillator signal; and

a second input coupled to the second gate to receive an RF signal.

46. The signal processing circuit of claim 45, wherein the digital logic circuit and the analog circuit are implemented on a single integrated circuit.

47. The signal processing circuit of claim 46, wherein the digital logic circuit and the analog circuit are fabricated using CMOS processing techniques.

48. A single integrated circuit, comprising:

a digital logic circuit fabricated with a CMOS process; and

an analog circuit fabricated with the CMOS process, including;

a dual-gated metal-oxide semiconducting field effect transistor extending outwardly from a semiconductor substrate, including;

a source region and a drain region;

a body region, the body region having opposing sidewall surfaces, and wherein the body region includes a fully depleted structure;

a first gate located on a first one of the opposing sidewall surfaces;

a second gate located on a second one of the opposing sidewall surfaces;

a first input coupled to the first gate to receive an oscillator signal; and

a second input coupled to the second gate to receive an RF signal.