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Method and apparatus for reactive sputtering employing two control loops

  • US 6,106,676 A
  • Filed: 04/16/1998
  • Issued: 08/22/2000
  • Est. Priority Date: 04/16/1998
  • Status: Expired due to Term
First Claim
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1. A method of controlling a reactive sputtering process in a sputter system, the sputter system housing a target and being supplied with power and at least one reactive gas, the method comprising:

  • sputtering the target;

    controlling a parameter of a system power supply in view of a first process parameter; and

    controlling a parameter of a system gas supply in view of a second process parameter, wherein said controlling a power supply parameter and said controlling a gas supply parameter are responsive to one another.

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